| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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XC7VX415T-2FFV1158C | AMD |
 Description: IC FPGA 350 I/O 1158FCBGAPackaging: Bulk Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 412160 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 32200 Total RAM Bits: 32440320 Number of I/O: 350 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-1FLVD1517I | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-2FLVD1517E | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-2FLVD1517I | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EF-DI-25GEMAC-PROJ | AMD |
Description: LOGICORE, 10G/25G ETHERNET MAC/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCVU080-1FFVD1517I | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 975000 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 55714 Total RAM Bits: 51200000 Part Status: Active Number of I/O: 338 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVU080-2FFVD1517E | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 975000 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 55714 Total RAM Bits: 51200000 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EF-DI-25GEMAC-SITE | AMD |
Description: LOGICORE, 10G/25G ETHERNET MAC/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU125-H1FLVD1517E | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 1.030V Number of Logic Elements/Cells: 1566600 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 89520 Total RAM Bits: 90726400 Part Status: Active Number of I/O: 338 |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCVU095-2FFVD1517E | AMD |
Description: IC FPGA 338 I/O 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1176000 Supplier Device Package: 1517-FCBGA (40x40) Number of LABs/CLBs: 67200 Total RAM Bits: 62259200 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EF-DI-25GBASE-KR-PROJ | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-25GBASE-KR-SITE | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU440-1FLGA2892C | AMD |
Description: IC FPGA 1456 I/O 2892FCBGA Packaging: Bulk Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 5540850 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 316620 Total RAM Bits: 90726400 Number of I/O: 1456 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU440-2FLGA2892E | AMD |
Description: IC FPGA 1456 I/O 2892FCBGA Packaging: Bulk Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 5540850 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 316620 Total RAM Bits: 90726400 Number of I/O: 1456 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| DV-SPVIV-DES-PP-100-XDV | AMD |
Description: VIVADO DESIGN SUITE: DESIGN EDIT Packaging: Bulk For Use With/Related Products: Xilinx Type: Integrated Development Environment (IDE) Applications: Programming Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-25GBASE-KR-WW | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Worldwide Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EK-U1-ZCU102-ES2-G | AMD |
Description: KIT EVAL ZYNQ ULTRA ZCU102 Packaging: Bulk For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EK-U1-ZCU102-ES2-G-J | AMD |
Description: KIT EVAL ZYNQ ULTRA ZCU102 Packaging: Bulk For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EF-DI-25GEMAC-WW | AMD |
Description: LICENSE 25GEMAC WW LOGICORE Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Worldwide Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU040-1FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Part Status: Active Number of I/O: 520 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG225E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z012S-1CLG485I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA Packaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 93 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z012S-2CLG485I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA Packaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 178 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 156 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 176 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG225I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z007S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 977 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 194 шт: термін постачання 21-31 дні (днів) |
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XC7Z012S-1CLG485C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA Packaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG484C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG484I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 108 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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XCZU9CG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCZU9CG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCKU5P-1FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 256 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCKU5P-1FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 280 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU2EG-1SFVA625E | AMD |
Description: IC SOC CORTEX-A53 625FCBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU2EG-L1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 155 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 62 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU15EG-L1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-1FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-1FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-3FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-L2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCZU2CG-1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 164 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-2SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-L1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
|
| XC7VX415T-2FFV1158C |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-1FLVD1517I |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-2FLVD1517E |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-2FLVD1517I |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GEMAC-PROJ |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVU080-1FFVD1517I |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
товару немає в наявності
В кошику
од. на суму грн.
| XCVU080-2FFVD1517E |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GEMAC-SITE |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVU125-H1FLVD1517E |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 1566600
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 89520
Total RAM Bits: 90726400
Part Status: Active
Number of I/O: 338
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 1566600
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 89520
Total RAM Bits: 90726400
Part Status: Active
Number of I/O: 338
товару немає в наявності
В кошику
од. на суму грн.
| XCVU095-2FFVD1517E |
|
Виробник: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1176000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 67200
Total RAM Bits: 62259200
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1176000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 67200
Total RAM Bits: 62259200
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| EF-DI-25GBASE-KR-PROJ |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GBASE-KR-SITE |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVU440-1FLGA2892C |
|
Виробник: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU440-2FLGA2892E |
|
Виробник: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| DV-SPVIV-DES-PP-100-XDV |
Виробник: AMD
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GBASE-KR-WW |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EK-U1-ZCU102-ES2-G |
|
Виробник: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
товару немає в наявності
В кошику
од. на суму грн.
| EK-U1-ZCU102-ES2-G-J |
|
Виробник: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GEMAC-WW |
|
Виробник: AMD
Description: LICENSE 25GEMAC WW LOGICORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LICENSE 25GEMAC WW LOGICORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCKU040-1FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 202561.69 грн |
| XC7Z007S-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 98 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 6050.70 грн |
| XC7Z007S-2CLG225E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z012S-1CLG485I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11340.12 грн |
| XC7Z007S-1CLG225C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 93 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4197.76 грн |
| XC7Z014S-1CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 9305.09 грн |
| XC7Z014S-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 9831.56 грн |
| XC7Z012S-2CLG485I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11045.99 грн |
| XC7Z007S-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 178 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4086.53 грн |
| XC7Z007S-1CLG225I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 156 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4827.21 грн |
| XC7Z014S-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 176 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8090.67 грн |
| XC7Z007S-2CLG225I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z007S-1CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 977 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4696.21 грн |
| XC7Z007S-2CLG400E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 194 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5169.95 грн |
| XC7Z012S-1CLG485C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8018.17 грн |
| XC7Z014S-1CLG484C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8902.21 грн |
| XC7Z014S-1CLG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 108 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 10223.74 грн |
| XCZU9EG-2FFVB1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 367018.14 грн |
| XCZU9EG-2FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 447957.78 грн |
| XCZU9CG-2FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU9EG-1FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 232037.43 грн |
| XCZU9CG-1FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 214223.94 грн |
| XCKU5P-1FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU5P-1FFVB676E |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1SFVA625E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-L1SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 34474.32 грн |
| XCZU3CG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 155 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 34936.53 грн |
| XCZU3CG-2SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 49302.82 грн |
| XCZU3CG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 54854.24 грн |
| XCZU15EG-L1FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-3FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-L2FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2CG-1SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 164 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 25553.99 грн |
| XCZU2CG-2SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 33094.30 грн |
| XCZU2CG-L1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 30873.90 грн |
| XCZU4CG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 91531.66 грн |
| XCZU4CG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 122 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 118174.02 грн |