| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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|---|---|---|---|---|---|---|---|
| XC95144XV-7TQ144I | AMD |
 Description: FLASH PLD, 7.5NS, 144-CELLPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 187 шт: термін постачання 21-31 дні (днів) |
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XC95144XV-5TQ100C | AMD |
Description: FLASH PLD, 5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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XC95288XV-6PQ208C | AMD |
Description: FLASH PLD, 6NS, 288-CELL PQFP208 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 392 шт: термін постачання 21-31 дні (днів) |
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XC4028XL-3HQ208I | AMD |
Description: IC FPGA 160 I/O 208QFP Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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XCZU7EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EV-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EV-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EV-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EV-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7EG-3FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-L2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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| A-SN1022-P4N-PQ | AMD |
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB Power (Watts): 75W Packaging: Box Interface: PCI Express Operating Temperature: 0°C ~ 30°C Bandwidth: 2GHz Cooling Type: Fan Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SK-KV260-G | AMD |
Description: KRIA KV260 VISION AI STARTER Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s) Platform: Kria KV260 Vision AI Starter Part Status: Active |
на замовлення 115 шт: термін постачання 21-31 дні (днів) |
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SM-K26-XCL2GC-ED | AMD |
Description: SOM K26C VISION ZYNQ MPSOC ED Packaging: Box Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Speed: 533MHz, 1.333GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C (TJ) Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Flash Size: 16GB eMMC, 64MB QSPI Part Status: Active |
на замовлення 107 шт: термін постачання 21-31 дні (днів) |
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SM-K26-XCL2GC | AMD |
Description: IC MOD SOM K26C ZYNQ MPSOC Packaging: Box Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Speed: 533MHz, 1.333GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C (TJ) Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Flash Size: 16GB eMMC, 64MB QSPI Part Status: Active |
на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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XA7A35T-2CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Grade: Automotive Number of I/O: 210 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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HW-DMB-1-G | AMD |
Description: CABLE PROGRAM ALVEO Packaging: Bag For Use With/Related Products: Alveo Accessory Type: Cable Assembly |
товар відсутній |
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XC5204-6VQ100I | AMD |
Description: FPGA, 120 CLBS, 4000 GATES Packaging: Bulk Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 480 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 120 Part Status: Active Number of I/O: 81 DigiKey Programmable: Not Verified |
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EK-U1-ZCU216-V1-G | AMD |
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU216 V1 |
товар відсутній |
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| EK-U1-ZCU216-V1-G-J | AMD |
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan |
товар відсутній |
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| XC3190-PG175IPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 130 шт: термін постачання 21-31 дні (днів) |
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XC3190-PQ160CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Part Status: Active Number of I/O: 138 DigiKey Programmable: Not Verified |
на замовлення 283 шт: термін постачання 21-31 дні (днів) |
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| XC3190-PG175CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 1472 шт: термін постачання 21-31 дні (днів) |
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| XC3190-PP175CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BPGA Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 175-PGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 3347 шт: термін постачання 21-31 дні (днів) |
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XC3190-4PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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XC3190-3PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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XC3190-5PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 |
на замовлення 710 шт: термін постачання 21-31 дні (днів) |
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XC3190-5PQ208I | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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XC95144-15PQ100I | AMD |
Description: IC CPLD 144MC 15NS 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 10K program/erase cycles) Number of Gates: 3200 Number of Macrocells: 144 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.5V ~ 5.5V Part Status: Obsolete Number of I/O: 81 DigiKey Programmable: Not Verified |
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XCKU035-2FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
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XC9536XV-5VQ44C0779 | AMD |
Description: FLASH PLD, 5NS, 36-CELL, CMOS Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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XA7A50T-1CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
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XA7A50T-1CSG324Q | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
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XC4052XLA-09HQ208I | AMD |
Description: FPGA, 1936 CLBS, 33000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 52000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 4598 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1936 Total RAM Bits: 61952 Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| XC4VSX35-12FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA |
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| XC4VLX60-11FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA Packaging: Bulk Package / Case: 668-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 59904 Supplier Device Package: 668-FCBGA (27x27) Number of LABs/CLBs: 6656 Total RAM Bits: 2949120 Number of I/O: 448 DigiKey Programmable: Not Verified |
товар відсутній |
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| XC4VLX60-10FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA Packaging: Bulk Package / Case: 668-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 59904 Supplier Device Package: 668-FCBGA (27x27) Number of LABs/CLBs: 6656 Total RAM Bits: 2949120 Number of I/O: 448 DigiKey Programmable: Not Verified |
товар відсутній |
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| XC4VLX60-12FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA Packaging: Bulk Package / Case: 668-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 59904 Supplier Device Package: 668-FCBGA (27x27) Number of LABs/CLBs: 6656 Total RAM Bits: 2949120 Number of I/O: 448 DigiKey Programmable: Not Verified |
товар відсутній |
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 |
XCKU5P-L1FFVB676I | AMD |
Description: IC FPGA 280 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 280 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-2FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 256 DigiKey Programmable: Not Verified |
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XCKU5P-1SFVB784E | AMD |
Description: IC FPGA 304 I/O 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
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XCKU5P-2FFVD900I | AMD |
Description: IC FPGA 304 I/O 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-2SFVB784I | AMD |
Description: IC FPGA 304 I/O 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-L2FFVD900E | AMD |
Description: IC FPGA 304 I/O 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-1SFVB784I | AMD |
Description: IC FPGA 304 I/O 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-2SFVB784E | AMD |
Description: IC FPGA 304 I/O 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-1FFVB676I | AMD |
Description: IC FPGA 280 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 280 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-L2SFVB784E | AMD |
Description: IC FPGA 304 I/O 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 304 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-2FFVB676I | AMD |
Description: IC FPGA 280 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 280 DigiKey Programmable: Not Verified |
товар відсутній |
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XCKU5P-L2FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 256 DigiKey Programmable: Not Verified |
товар відсутній |
| XC95144XV-7TQ144I |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 187 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 28+ | 864.75 грн |
| XC95144XV-5TQ100C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 24+ | 921.96 грн |
| XC95288XV-6PQ208C |
|
Виробник: AMD
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 392 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 2148.59 грн |
| XC4028XL-3HQ208I |
|
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4856.38 грн |
| XCZU7EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-3FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-L2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| A-SN1022-P4N-PQ |
|
Виробник: AMD
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Power (Watts): 75W
Packaging: Box
Interface: PCI Express
Operating Temperature: 0°C ~ 30°C
Bandwidth: 2GHz
Cooling Type: Fan
Part Status: Active
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Power (Watts): 75W
Packaging: Box
Interface: PCI Express
Operating Temperature: 0°C ~ 30°C
Bandwidth: 2GHz
Cooling Type: Fan
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 412237.33 грн |
| XCZU9EG-2FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 310495.85 грн |
| SK-KV260-G |
|
Виробник: AMD
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Kria KV260 Vision AI Starter
Part Status: Active
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Kria KV260 Vision AI Starter
Part Status: Active
на замовлення 115 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19934.69 грн |
| SM-K26-XCL2GC-ED |
|
Виробник: AMD
Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 107 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33034.22 грн |
| SM-K26-XCL2GC |
|
Виробник: AMD
Description: IC MOD SOM K26C ZYNQ MPSOC
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Description: IC MOD SOM K26C ZYNQ MPSOC
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 170 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29671.37 грн |
| XA7A35T-2CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5274.53 грн |
| XCZU3EG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 39713.78 грн |
| XCZU3EG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 49665.48 грн |
| HW-DMB-1-G |
|
Виробник: AMD
Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
товар відсутній
| XC5204-6VQ100I |
|
Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: FPGA, 120 CLBS, 4000 GATES
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU216-V1-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
товар відсутній
| EK-U1-ZCU216-V1-G-J |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
товар відсутній
| XC3190-PG175IPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 130 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2464.38 грн |
| XC3190-PQ160CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
на замовлення 283 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2373.69 грн |
| XC3190-PG175CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 1472 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2464.38 грн |
| XC3190-PP175CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 3347 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2464.38 грн |
| XC3190-4PQ208C |
|
на замовлення 72 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 25+ | 903.44 грн |
| XC3190-3PQ208C |
|
на замовлення 80 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1264.99 грн |
| XC3190-5PQ208C |
|
Виробник: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
на замовлення 710 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 14+ | 1683.04 грн |
| XC3190-5PQ208I |
|
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 1647.78 грн |
| XC95144-15PQ100I |
|
Виробник: AMD
Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
товар відсутній
| XCKU035-2FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товар відсутній
| XC9536XV-5VQ44C0779 |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XA7A50T-1CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
товар відсутній
| XA7A50T-1CSG324Q |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
товар відсутній
| XC4052XLA-09HQ208I |
|
Виробник: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 21182.17 грн |
| XC4VLX60-11FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
товар відсутній
| XC4VLX60-10FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
товар відсутній
| XC4VLX60-12FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Bulk
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 448
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-L1FFVB676I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-2FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-1SFVB784E |
|
Виробник: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-2FFVD900I |
|
Виробник: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-2SFVB784I |
|
Виробник: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-L2FFVD900E |
|
Виробник: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-1SFVB784I |
|
Виробник: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-2SFVB784E |
|
Виробник: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-L2SFVB784E |
|
Виробник: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 304
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-2FFVB676I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
товар відсутній
| XCKU5P-L2FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній