| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
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XCKU040-1FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGAPackaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Part Status: Active Number of I/O: 520 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG225E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGAPackaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||
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XC7Z012S-1CLG485I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGAPackaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGAPackaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z014S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z012S-2CLG485I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 485CSBGAPackaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 221 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGAPackaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 135 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z007S-2CLG225I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGAPackaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||
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XC7Z007S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 579 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGAPackaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
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XC7Z012S-1CLG485C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGAPackaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG484C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGAPackaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7Z014S-1CLG484I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGAPackaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGAPackaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGAPackaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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XCZU9CG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGAPackaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGAPackaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9CG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGAPackaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCKU5P-1FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 256 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU5P-1FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 474600 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 27120 Total RAM Bits: 41984000 Number of I/O: 280 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1SFVA625E | AMD |
Description: IC SOC CORTEX-A53 625FCBGAPackaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1SFVA625I | AMD |
Description: IC SOC CORTEX-A53 625FCBGAPackaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-L1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU15EG-L1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGAPackaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-1FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-1FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-3FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-L2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
XCZU2CG-1SBVA484E | AMD |
Description: IC SOC CORTEX-A53 484FCBGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-2SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-L1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
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XCZU4EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU4EV-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCZU7EV-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGAPackaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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EK-U1-ZCU102-G | AMD |
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZCPackaging: Box For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: XCZU9EG Platform: Zynq UltraScale+ MPSoC ZCU102 Part Status: Active |
на замовлення 316 шт: термін постачання 21-31 дні (днів) |
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EK-U1-KCU116-G | AMD |
Description: XILINX KINTEX ULTRASCALE+ FPGA KPackaging: Box For Use With/Related Products: XCKU5P Type: FPGA Contents: Board(s), Cable(s), Power Supply Utilized IC / Part: XCKU5P Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| EF-DI-25G-RS-FEC-PROJ | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-25G-RS-FEC-SITE | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
XCKU3P-1FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 280 DigiKey Programmable: Not Verified |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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XCKU3P-1FFVB676I | AMD |
Description: IC FPGA 280 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 280 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCKU3P-2FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 280 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
XCKU3P-1FFVD900E | AMD |
Description: IC FPGA 304 I/O 900FCBGAPackaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Part Status: Active Number of I/O: 304 DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XC7S50-1FGGA484C | AMD |
Description: IC FPGA 250 I/O 484FBGAPackaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 250 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC7S50-1CSGA324C | AMD |
Description: IC FPGA 210 I/O 324CSGAPackaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
XC7S50-1CSGA324I | AMD |
Description: IC FPGA 210 I/O 324CSGAPackaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| XCKU040-1FFVA1156I |
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Виробник: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 190054.80 грн |
| XC7Z007S-2CLG400I |
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Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6406.85 грн |
| XC7Z007S-2CLG225E |
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Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| XC7Z012S-1CLG485I |
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Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10149.07 грн |
| XC7Z007S-1CLG225C |
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Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4444.90 грн |
| XC7Z014S-1CLG400I |
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Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z014S-2CLG400I |
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Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z012S-2CLG485I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11695.89 грн |
| XC7Z007S-1CLG400C |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 221 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4744.06 грн |
| XC7Z007S-1CLG225I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5110.48 грн |
| XC7Z014S-1CLG400C |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z007S-2CLG225I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| XC7Z007S-1CLG400I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 579 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4520.66 грн |
| XC7Z007S-2CLG400E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4975.97 грн |
| XC7Z012S-1CLG485C |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7557.11 грн |
| XC7Z014S-1CLG484C |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XC7Z014S-1CLG484I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10825.46 грн |
| XCZU9EG-2FFVB1156E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 367046.21 грн |
| XCZU9EG-2FFVB1156I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 419481.38 грн |
| XCZU9CG-2FFVC900I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9EG-1FFVC900E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9CG-1FFVC900E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 197931.16 грн |
| XCKU5P-1FFVA676E |
![]() |
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 256
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU5P-1FFVB676E |
![]() |
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 474600
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 27120
Total RAM Bits: 41984000
Number of I/O: 280
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1SFVA625E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1SFVA625I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29222.73 грн |
| XCZU2EG-1SFVC784E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24050.41 грн |
| XCZU2EG-1SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29998.85 грн |
| XCZU2EG-L1SBVA484I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 35037.43 грн |
| XCZU3CG-1SFVC784E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36008.36 грн |
| XCZU3CG-2SFVC784E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 44031.60 грн |
| XCZU3CG-2SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 51467.34 грн |
| XCZU15EG-L1FFVC900I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-3FFVD1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-L2FFVD1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2CG-1SBVA484E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Description: IC SOC CORTEX-A53 484FCBGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 20867.08 грн |
| XCZU2CG-1SBVA484I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26063.37 грн |
| XCZU2CG-1SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Description: IC SOC CORTEX-A53 784FCBGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28097.97 грн |
| XCZU2CG-2SBVA484I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 31050.94 грн |
| XCZU2CG-L1SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 27525.93 грн |
| XCZU4CG-1SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 85880.17 грн |
| XCZU4CG-2SFVC784I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 110877.53 грн |
| XCZU4EG-1SFVC784E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 74437.06 грн |
| XCZU4EV-1SFVC784E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 84910.03 грн |
| XCZU7EV-2FFVC1156I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 339296.10 грн |
| EK-U1-ZCU102-G |
![]() |
Виробник: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
на замовлення 316 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 248359.56 грн |
| EK-U1-KCU116-G |
![]() |
Виробник: AMD
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Packaging: Box
For Use With/Related Products: XCKU5P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: XCKU5P
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Part Status: Active
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Packaging: Box
For Use With/Related Products: XCKU5P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: XCKU5P
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 498806.30 грн |
| EF-DI-25G-RS-FEC-PROJ |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25G-RS-FEC-SITE |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCKU3P-1FFVB676E |
![]() |
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 108946.51 грн |
| XCKU3P-1FFVB676I |
![]() |
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 136250.60 грн |
| XCKU3P-2FFVB676E |
![]() |
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 280
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU3P-1FFVD900E |
![]() |
Виробник: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 105361.22 грн |
| XC7S50-1FGGA484C |
![]() |
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC7S50-1CSGA324C |
![]() |
Виробник: AMD
Description: IC FPGA 210 I/O 324CSGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC7S50-1CSGA324I |
![]() |
Виробник: AMD
Description: IC FPGA 210 I/O 324CSGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5763.69 грн |























