| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
| XCVU440-2FLGA2892E | AMD |
 Description: IC FPGA 1456 I/O 2892FCBGAPackaging: Bulk Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 5540850 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 316620 Total RAM Bits: 90726400 Number of I/O: 1456 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| DV-SPVIV-DES-PP-100-XDV | AMD |
Description: VIVADO DESIGN SUITE: DESIGN EDIT Packaging: Bulk For Use With/Related Products: Xilinx Type: Integrated Development Environment (IDE) Applications: Programming Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-25GBASE-KR-WW | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Worldwide Media Delivery Type: Electronically Delivered Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EK-U1-ZCU102-ES2-G | AMD |
Description: KIT EVAL ZYNQ ULTRA ZCU102 Packaging: Bulk For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EK-U1-ZCU102-ES2-G-J | AMD |
Description: KIT EVAL ZYNQ ULTRA ZCU102 Packaging: Bulk For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EF-DI-25GEMAC-WW | AMD |
Description: LICENSE 25GEMAC WW LOGICORE Part Status: Active Media Delivery Type: Electronically Delivered License - User Details: Worldwide License Length: 1 Year Type: License For Use With/Related Products: Xilinx Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU040-1FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Part Status: Active Number of I/O: 520 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Speed: 766MHz Package / Case: 400-LFBGA, CSPBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 400-CSPBGA (17x17) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG225E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGA Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 766MHz Package / Case: 225-LFBGA, CSPBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 225-CSPBGA (13x13) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||
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XC7Z012S-1CLG485I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA Architecture: MCU, FPGA Supplier Device Package: 485-CSPBGA (19x19) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 667MHz Package / Case: 485-LFBGA, CSPBGA Packaging: Tray |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 225-CSPBGA (13x13) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 256KB Speed: 667MHz Package / Case: 225-LFBGA, CSPBGA Packaging: Tray |
на замовлення 93 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 667MHz Package / Case: 400-LFBGA, CSPBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 400-CSPBGA (17x17) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z012S-2CLG485I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA Packaging: Tray Package / Case: 485-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 485-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 71 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 269 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-1CLG225I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 156 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 174 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG225I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||
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XC7Z007S-1CLG400I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 684 шт: термін постачання 21-31 дні (днів) |
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XC7Z007S-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 400-CSPBGA (17x17) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 766MHz Package / Case: 400-LFBGA, CSPBGA Packaging: Tray |
на замовлення 194 шт: термін постачання 21-31 дні (днів) |
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XC7Z012S-1CLG485C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 485-CSPBGA (19x19) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 256KB Speed: 667MHz Package / Case: 485-LFBGA, CSPBGA Packaging: Tray |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG484C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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XC7Z014S-1CLG484I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 130 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9CG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCZU9CG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCKU5P-1FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 256 Total RAM Bits: 41984000 Number of LABs/CLBs: 27120 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 474600 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU5P-1FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 280 Total RAM Bits: 41984000 Number of LABs/CLBs: 27120 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 474600 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1SFVA625E | AMD |
Description: IC SOC CORTEX-A53 625FCBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1SFVA625I | AMD |
Description: IC SOC CORTEX-A53 625FCBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MCU, FPGA |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-L1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 140 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 62 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU15EG-L1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-1FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-1FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVD1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-3FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-L2FFVD1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCZU2CG-1SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-2SBVA484I | AMD |
Description: IC SOC CORTEX-A53 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MCU, FPGA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-L1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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XCZU4CG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
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XCZU4EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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XCZU4EV-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCZU7EV-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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EK-U1-ZCU102-G | AMD |
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC Packaging: Box For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: XCZU9EG Platform: Zynq UltraScale+ MPSoC ZCU102 Part Status: Active |
на замовлення 312 шт: термін постачання 21-31 дні (днів) |
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EK-U1-KCU116-G | AMD |
Description: XILINX KINTEX ULTRASCALE+ FPGA K Utilized IC / Part: XCKU5P Part Status: Active Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card Contents: Board(s), Cable(s), Power Supply Type: FPGA For Use With/Related Products: XCKU5P Packaging: Box |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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| EF-DI-25G-RS-FEC-PROJ | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Part Status: Active Media Delivery Type: Electronically Delivered License - User Details: Project License Length: 1 Year Type: License For Use With/Related Products: Xilinx Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-25G-RS-FEC-SITE | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Part Status: Active Media Delivery Type: Electronically Delivered License - User Details: Site License Length: 1 Year Type: License For Use With/Related Products: Xilinx Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU3P-1FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 280 Total RAM Bits: 31641600 Number of LABs/CLBs: 20340 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 355950 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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XCKU3P-1FFVB676I | AMD |
Description: IC FPGA 280 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 280 Total RAM Bits: 31641600 Number of LABs/CLBs: 20340 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 355950 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCKU3P-2FFVB676E | AMD |
Description: IC FPGA 280 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 280 Total RAM Bits: 31641600 Number of LABs/CLBs: 20340 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 355950 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| XCVU440-2FLGA2892E |
|
Виробник: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| DV-SPVIV-DES-PP-100-XDV |
Виробник: AMD
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GBASE-KR-WW |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EK-U1-ZCU102-ES2-G |
|
Виробник: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
товару немає в наявності
В кошику
од. на суму грн.
| EK-U1-ZCU102-ES2-G-J |
|
Виробник: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25GEMAC-WW |
|
Виробник: AMD
Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| XCKU040-1FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 194513.71 грн |
| XC7Z007S-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 5848.28 грн |
| XC7Z007S-2CLG225E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| XC7Z012S-1CLG485I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 10889.56 грн |
| XC7Z007S-1CLG225C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
на замовлення 93 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4054.71 грн |
| XC7Z014S-1CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8935.39 грн |
| XC7Z014S-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 10559.65 грн |
| XC7Z012S-2CLG485I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 71 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 11781.21 грн |
| XC7Z007S-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 269 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4820.55 грн |
| XC7Z007S-1CLG225I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 156 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4635.42 грн |
| XC7Z014S-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 174 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8629.21 грн |
| XC7Z007S-2CLG225I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| XC7Z007S-1CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 684 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4553.93 грн |
| XC7Z007S-2CLG400E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
на замовлення 194 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4964.55 грн |
| XC7Z012S-1CLG485C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 7699.60 грн |
| XC7Z014S-1CLG484C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 9494.74 грн |
| XC7Z014S-1CLG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 130 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 10769.31 грн |
| XCZU9EG-2FFVB1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 333649.96 грн |
| XCZU9EG-2FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9CG-2FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9EG-1FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 210941.40 грн |
| XCZU9CG-1FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 205712.60 грн |
| XCKU5P-1FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU5P-1FFVB676E |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1SFVA625E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1SFVA625I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 29908.33 грн |
| XCZU2EG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 24614.66 грн |
| XCZU2EG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 30702.66 грн |
| XCZU2EG-L1SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 31849.84 грн |
| XCZU3CG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 140 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 32713.00 грн |
| XCZU3CG-2SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 47343.97 грн |
| XCZU3CG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 52674.83 грн |
| XCZU15EG-L1FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVD1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVD1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-3FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-L2FFVD1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2CG-1SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 23464.31 грн |
| XCZU2CG-2SBVA484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 31779.43 грн |
| XCZU2CG-L1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 29647.24 грн |
| XCZU4CG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 87895.02 грн |
| XCZU4CG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 113478.85 грн |
| XCZU4EG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 74737.19 грн |
| XCZU4EV-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 86902.11 грн |
| XCZU7EV-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 347256.38 грн |
| EK-U1-ZCU102-G |
|
Виробник: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
на замовлення 312 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 246051.63 грн |
| EK-U1-KCU116-G |
|
Виробник: AMD
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Utilized IC / Part: XCKU5P
Part Status: Active
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Contents: Board(s), Cable(s), Power Supply
Type: FPGA
For Use With/Related Products: XCKU5P
Packaging: Box
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Utilized IC / Part: XCKU5P
Part Status: Active
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Contents: Board(s), Cable(s), Power Supply
Type: FPGA
For Use With/Related Products: XCKU5P
Packaging: Box
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 498737.94 грн |
| EF-DI-25G-RS-FEC-PROJ |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Project
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Project
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-25G-RS-FEC-SITE |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| XCKU3P-1FFVB676E |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 111502.53 грн |
| XCKU3P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 139447.19 грн |
| XCKU3P-2FFVB676E |
|
Виробник: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.