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XC3S1500L-4FGG456C XC3S1500L-4FGG456C AMD Kmjv2BHpGtvDiWUcZ7B2jg Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Number of I/O: 333
DigiKey Programmable: Not Verified
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XA3S1500-4FGG456I XA3S1500-4FGG456I AMD 3AZXjBRmzTgewD3IuB~V~g Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 333
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XC3S1500L-4FGG676C XC3S1500L-4FGG676C AMD Kmjv2BHpGtvDiWUcZ7B2jg Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Number of I/O: 487
DigiKey Programmable: Not Verified
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SM-K24-XCL2GI SM-K24-XCL2GI AMD TTmtpv_UK8cgx8PtcGWqqw Description: SOM K24 KRIA ZYNQ MPSOC
Packaging: Bulk
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
1+31614.84 грн
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XA7S25-1CSGA225I XA7S25-1CSGA225I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7S25-2CSGA225I XA7S25-2CSGA225I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7S25-1CSGA225Q XA7S25-1CSGA225Q AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7A12T-1CSG325Q AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
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XA7A25T-1CSG325I XA7A25T-1CSG325I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7A25T-2CSG325I XA7A25T-2CSG325I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA3S1500-4FGG676I XA3S1500-4FGG676I AMD 3AZXjBRmzTgewD3IuB~V~g Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XCVU13P-L2FIGD2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
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XCVU13P-2FHGA2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
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XC4028XLA-09BGG352C XC4028XLA-09BGG352C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
3+9688.97 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
XC4028XL-3HQ208I XC4028XL-3HQ208I AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
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XC4008E-3PQ208C XC4008E-3PQ208C AMD Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 335 шт:
термін постачання 21-31 дні (днів)
2+11959.64 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4008E-3PQ208C XC4008E-3PQ208C AMD Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC4044XL-1BG352C AMD 4000.pdf Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
2+14048.94 грн
Мінімальне замовлення: 2
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XC4062XL-1BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4062XL-1BG560C AMD 4000.pdf Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
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XC4062XL-1BG432I AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4062XL-09BG432C AMD ~eXJ78~X0b0haIBXA~GNOw Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4025E-3HQ240I XC4025E-3HQ240I AMD XILIS01062-1.pdf?t.download=true&u=5oefqw Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
2+17099.46 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4004A-6TQ144I XC4004A-6TQ144I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 85 шт:
термін постачання 21-31 дні (днів)
8+2965.97 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
XC4028XL-2HQ208C XC4028XL-2HQ208C AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
5+5328.95 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
XC4028XL-3BG352C AMD 4000.pdf Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
2+17427.00 грн
Мінімальне замовлення: 2
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XC4062XL-3BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XCVM1502-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1LSEVFVC1760 XCVM1502-1LSEVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-1MSEVFVC1760 XCVM1802-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1LSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2MLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-1LSEVFVC1760 XCVM1802-1LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-2MSEVFVC1760 XCVM1802-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-1MSIVFVC1760 XCVM1802-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1LLIVFVC1760 XCVM1502-1LLIVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2LLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2HSIVFVC1760 AMD Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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EK-U1-VCU108-G-J EK-U1-VCU108-G-J AMD xtp400-vcu108-quickstart.pdf Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
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XCAU20P-1FFVB676E XCAU20P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-1SFVB784E XCAU20P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU25P-1FFVB676E XCAU25P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-1SFVB784E XCAU25P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU20P-1SFVB784I XCAU20P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-2FFVB676E XCAU20P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-L1FFVB676I XCAU20P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-L1SFVB784I XCAU20P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-2SFVB784E XCAU20P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU25P-1SFVB784I XCAU25P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-L1FFVB676I XCAU25P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-2FFVB676E XCAU25P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-L1SFVB784I XCAU25P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-2SFVB784E XCAU25P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-2FFVB676I XCAU25P-2FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XC3S1500L-4FGG456C Kmjv2BHpGtvDiWUcZ7B2jg
XC3S1500L-4FGG456C
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Number of I/O: 333
DigiKey Programmable: Not Verified
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XA3S1500-4FGG456I 3AZXjBRmzTgewD3IuB~V~g
XA3S1500-4FGG456I
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 333
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XC3S1500L-4FGG676C Kmjv2BHpGtvDiWUcZ7B2jg
XC3S1500L-4FGG676C
Виробник: AMD
Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Number of I/O: 487
DigiKey Programmable: Not Verified
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SM-K24-XCL2GI TTmtpv_UK8cgx8PtcGWqqw
SM-K24-XCL2GI
Виробник: AMD
Description: SOM K24 KRIA ZYNQ MPSOC
Packaging: Bulk
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+31614.84 грн
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XA7S25-1CSGA225I j6dhSNsTk1SGc2BkX0wKUg
XA7S25-1CSGA225I
Виробник: AMD
Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7S25-2CSGA225I j6dhSNsTk1SGc2BkX0wKUg
XA7S25-2CSGA225I
Виробник: AMD
Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7S25-1CSGA225Q j6dhSNsTk1SGc2BkX0wKUg
XA7S25-1CSGA225Q
Виробник: AMD
Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7A12T-1CSG325Q s3NwarfUcQdgTa4CDreCuQ
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
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XA7A25T-1CSG325I s3NwarfUcQdgTa4CDreCuQ
XA7A25T-1CSG325I
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7A25T-2CSG325I s3NwarfUcQdgTa4CDreCuQ
XA7A25T-2CSG325I
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA3S1500-4FGG676I 3AZXjBRmzTgewD3IuB~V~g
XA3S1500-4FGG676I
Виробник: AMD
Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XCVU13P-L2FIGD2104E ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
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XCVU13P-2FHGA2104E ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
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XC4028XLA-09BGG352C 4000.pdf?t.download=true&u=ovmfp3
XC4028XLA-09BGG352C
Виробник: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+9688.97 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
XC4028XL-3HQ208I 4000.pdf
XC4028XL-3HQ208I
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
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XC4008E-3PQ208C
XC4008E-3PQ208C
Виробник: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 335 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+11959.64 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4008E-3PQ208C
XC4008E-3PQ208C
Виробник: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC4044XL-1BG352C 4000.pdf
Виробник: AMD
Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+14048.94 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4062XL-1BG432C 4000.pdf
Виробник: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4062XL-1BG560C 4000.pdf
Виробник: AMD
Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
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XC4062XL-1BG432I 4000.pdf
Виробник: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4062XL-09BG432C ~eXJ78~X0b0haIBXA~GNOw
Виробник: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4025E-3HQ240I XILIS01062-1.pdf?t.download=true&u=5oefqw
XC4025E-3HQ240I
Виробник: AMD
Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+17099.46 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4004A-6TQ144I 4000.pdf?t.download=true&u=ovmfp3
XC4004A-6TQ144I
Виробник: AMD
Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 85 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+2965.97 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
XC4028XL-2HQ208C 4000.pdf
XC4028XL-2HQ208C
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+5328.95 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
XC4028XL-3BG352C 4000.pdf
Виробник: AMD
Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+17427.00 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
XC4062XL-3BG432C 4000.pdf
Виробник: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XCVM1502-1MSEVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1LSEVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LSEVFVC1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1MSIVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-2MSEVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-1MSEVFVC1760 ds950-versal-overview
XCVM1802-1MSEVFVC1760
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-1MLIVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-1LSIVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-2LSEVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-2MLEVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1802-1LSEVFVC1760 ds950-versal-overview
XCVM1802-1LSEVFVC1760
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCVM1502-2MSIVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1802-2MSEVFVC1760 ds950-versal-overview
XCVM1802-2MSEVFVC1760
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
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XCVM1802-1MSIVFVC1760 ds950-versal-overview
XCVM1802-1MSIVFVC1760
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-1LLIVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LLIVFVC1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2LLEVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2MLIVFVC1760 ds950-versal-overview
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVM1502-2HSIVFVC1760
Виробник: AMD
Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
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EK-U1-VCU108-G-J xtp400-vcu108-quickstart.pdf
EK-U1-VCU108-G-J
Виробник: AMD
Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
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XCAU20P-1FFVB676E ds890-ultrascale-overview
XCAU20P-1FFVB676E
Виробник: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-1SFVB784E ds890-ultrascale-overview
XCAU20P-1SFVB784E
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU25P-1FFVB676E ds890-ultrascale-overview
XCAU25P-1FFVB676E
Виробник: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-1SFVB784E ds890-ultrascale-overview
XCAU25P-1SFVB784E
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU20P-1SFVB784I ds890-ultrascale-overview
XCAU20P-1SFVB784I
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-2FFVB676E ds890-ultrascale-overview
XCAU20P-2FFVB676E
Виробник: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-L1FFVB676I ds890-ultrascale-overview
XCAU20P-L1FFVB676I
Виробник: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-L1SFVB784I ds890-ultrascale-overview
XCAU20P-L1SFVB784I
Виробник: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU20P-2SFVB784E ds890-ultrascale-overview
XCAU20P-2SFVB784E
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
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XCAU25P-1SFVB784I ds890-ultrascale-overview
XCAU25P-1SFVB784I
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-L1FFVB676I ds890-ultrascale-overview
XCAU25P-L1FFVB676I
Виробник: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-2FFVB676E ds890-ultrascale-overview
XCAU25P-2FFVB676E
Виробник: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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XCAU25P-L1SFVB784I ds890-ultrascale-overview
XCAU25P-L1SFVB784I
Виробник: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-2SFVB784E ds890-ultrascale-overview
XCAU25P-2SFVB784E
Виробник: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCAU25P-2FFVB676I ds890-ultrascale-overview
XCAU25P-2FFVB676I
Виробник: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
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