| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
|---|---|---|---|---|---|---|---|
| XCVU160-3FLGB2104E | AMD |
 Description: IC FPGA 702 I/O 2104FCBGAPackaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-1FLGB2104I | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Number of I/O: 572 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU13P-1FHGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU190-3FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 2349900 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 134280 Total RAM Bits: 150937600 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-L2FLGB2104E | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Number of I/O: 572 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU13P-1FHGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU13P-2FHGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU13P-2FHGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU13P-L2FHGB2104E | AMD |
Description: IC FPGA 832 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 832 Total RAM Bits: 514867200 Number of LABs/CLBs: 216000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of Logic Elements/Cells: 3780000 Voltage - Supply: 0.698V ~ 0.876V Operating Temperature: 0°C ~ 110°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XC7S75-1FGGA676Q | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 6000 Total RAM Bits: 4331520 Number of I/O: 400 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
XA7S75-2FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 6000 Total RAM Bits: 3317760 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
XC7S100-L1FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FPBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.92V ~ 0.98V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Number of I/O: 400 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||
|
|
XA7S100-2FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||
|
|
XA7S100-1FGGA676Q | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||
 |
XCKU040-L1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.880V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCKU040-2FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCKU040-3FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
DK-U1-KCU1500-A-G | AMD |
Description: KINTEX ULTRASCALE FPGA KCU1500 Packaging: Box For Use With/Related Products: XCKU115 Type: FPGA Contents: Board(s), Cable(s) Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card Utilized IC / Part: XCKU115 |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU4EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU4EG-1FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU4EG-2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-L2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-1FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-2FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-3SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 600MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-2FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU4EG-L2FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC5206-3TQ144C | AMD |
Description: FPGA, 196 CLBS, 6000 GATES Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 10000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 784 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 196 Number of I/O: 117 DigiKey Programmable: Not Verified |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XC3S1000-4FGG320I | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 17280 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1920 Total RAM Bits: 442368 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
 |
XC7A75T-2FGG484C | AMD |
Description: IC FPGA 285 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-U1-VCU118-ES1-G | AMD |
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES Packaging: Box For Use With/Related Products: XCVU9P Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC3S50-4CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1728 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 192 Total RAM Bits: 73728 Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 1090 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC3S50-4CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 89 Total RAM Bits: 73728 Number of LABs/CLBs: 192 Supplier Device Package: 132-CSPBGA (8x8) Number of Logic Elements/Cells: 1728 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 50000 Mounting Type: Surface Mount Package / Case: 132-TFBGA, CSPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XC3S50-5CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA DigiKey Programmable: Not Verified Number of I/O: 89 Total RAM Bits: 73728 Number of LABs/CLBs: 192 Supplier Device Package: 132-CSPBGA (8x8) Number of Logic Elements/Cells: 1728 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 50000 Mounting Type: Surface Mount Package / Case: 132-TFBGA, CSPBGA Packaging: Tray |
на замовлення 365 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC3S50-5CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA DigiKey Programmable: Not Verified Number of I/O: 89 Total RAM Bits: 73728 Number of LABs/CLBs: 192 Supplier Device Package: 132-CSPBGA (8x8) Number of Logic Elements/Cells: 1728 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 50000 Mounting Type: Surface Mount Package / Case: 132-TFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC1765ELSO8C | AMD |
Description: IC PROM SER C-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-SOIC DigiKey Programmable: Not Verified |
на замовлення 6995 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC1765ELVOG8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XC1765ELSOG8C | AMD |
Description: IC PROM SERIAL 65K 8-SOIC Packaging: Tray Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-SOIC DigiKey Programmable: Not Verified |
на замовлення 6510 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC1765ELVO8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
на замовлення 4806 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC1765EVO8I | AMD |
Description: IC PROM SER I-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
на замовлення 3661 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC1765ELVO8I | AMD |
Description: IC PROM SER I-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
на замовлення 4820 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XCZU6EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU6EG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU6EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC3S1600E-4FGG320I | AMD |
Description: IC FPGA 250 I/O 320FBGA DigiKey Programmable: Not Verified Number of I/O: 250 Total RAM Bits: 663552 Number of LABs/CLBs: 3688 Supplier Device Package: 320-FBGA (19x19) Number of Logic Elements/Cells: 33192 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 1600000 Mounting Type: Surface Mount Package / Case: 320-BGA Packaging: Tray |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||
 |
A-MA35D-P16G-PQ-G | AMD |
Description: DCAB ALVEO MA35 MEDIA HHHL AIC Power (Watts): 40W Packaging: Bulk Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 55°C Cooling Type: Heat Sink |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
|
||
| A-U250-P64G-SPQG-016 | AMD |
Description: A-U250-P64G-SPQG-016 Power (Watts): 215W Packaging: Bulk Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Heat Sink LUTs: 1728k |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A-U280-P32G-PQG-905 | AMD |
Description: A-U280-P32G-PQG-905 Power (Watts): 215W Packaging: Bulk Memory Size: 32GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
товару немає в наявності |
В кошику од. на суму грн. | |||
| ADK-U55C | AMD |
Description: ADK-U55C Power (Watts): 115W Packaging: Bulk Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
|
XC7A35T-1FGG484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-VHK158-G | AMD |
Description: VERSAL HBM VHK158 EVALUATION KIT Packaging: Bulk For Use With/Related Products: XCVH1582 Type: FPGA Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||
.jpg "XCV100-5BG256I") |
XCV100-5BG256I | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 108904 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 2700 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 600 Total RAM Bits: 40960 Number of I/O: 180 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC7A15T-2CPG236I | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC7A35T-1CPG236C | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 106 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
|
| XCVU160-3FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-1FLGB2104I |
|
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU13P-1FHGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU190-3FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-L2FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU13P-1FHGB2104I |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU13P-2FHGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU13P-2FHGB2104I |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU13P-L2FHGB2104E |
|
Виробник: AMD
Description: IC FPGA 832 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 832
Total RAM Bits: 514867200
Number of LABs/CLBs: 216000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 3780000
Voltage - Supply: 0.698V ~ 0.876V
Operating Temperature: 0°C ~ 110°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 832 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 832
Total RAM Bits: 514867200
Number of LABs/CLBs: 216000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 3780000
Voltage - Supply: 0.698V ~ 0.876V
Operating Temperature: 0°C ~ 110°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XC7S75-1FGGA676Q |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| XA7S75-2FGGA676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| XC7S100-L1FGGA676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| XA7S100-2FGGA676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| XA7S100-1FGGA676Q |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| XCKU040-L1FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU040-2FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU040-3FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| DK-U1-KCU1500-A-G |
|
Виробник: AMD
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Utilized IC / Part: XCKU115
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Utilized IC / Part: XCKU115
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-1FBVB900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-2SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-L2SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-1FBVB900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-2FBVB900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-3SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-2FBVB900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EG-L2FBVB900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XC5206-3TQ144C |
|
Виробник: AMD
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 4794.29 грн |
| XC3S1000-4FGG320I |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| XC7A75T-2FGG484C |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 133 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 12073.14 грн |
| EK-U1-VCU118-ES1-G |
|
Виробник: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
товару немає в наявності
В кошику
од. на суму грн.
| XC3S50-4CPG132C |
|
Виробник: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 1090 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 27+ | 812.23 грн |
| XC3S50-4CPG132C |
|
Виробник: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
товару немає в наявності
В кошику
од. на суму грн.
| XC3S50-5CPG132C |
|
Виробник: AMD
Description: IC FPGA 89 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 89 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
на замовлення 365 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 23+ | 934.47 грн |
| XC3S50-5CPG132C |
|
Виробник: AMD
Description: IC FPGA 89 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 89 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Total RAM Bits: 73728
Number of LABs/CLBs: 192
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 1728
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 50000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XC1765ELSO8C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
на замовлення 6995 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 51+ | 431.03 грн |
| XC1765ELVOG8C |
|
Виробник: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC1765ELSOG8C |
|
Виробник: AMD
Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
на замовлення 6510 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 51+ | 431.03 грн |
| XC1765ELVO8C |
|
Виробник: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
на замовлення 4806 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 54+ | 374.91 грн |
| XC1765EVO8I |
|
Виробник: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
на замовлення 3661 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 49+ | 448.56 грн |
| XC1765ELVO8I |
|
Виробник: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
на замовлення 4820 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 44+ | 506.27 грн |
| XCZU6EG-1FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-1FFVB1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-1FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-2FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-1FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-2FFVB1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-2FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU6EG-2FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XC3S1600E-4FGG320I |
|
Виробник: AMD
Description: IC FPGA 250 I/O 320FBGA
DigiKey Programmable: Not Verified
Number of I/O: 250
Total RAM Bits: 663552
Number of LABs/CLBs: 3688
Supplier Device Package: 320-FBGA (19x19)
Number of Logic Elements/Cells: 33192
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1600000
Mounting Type: Surface Mount
Package / Case: 320-BGA
Packaging: Tray
Description: IC FPGA 250 I/O 320FBGA
DigiKey Programmable: Not Verified
Number of I/O: 250
Total RAM Bits: 663552
Number of LABs/CLBs: 3688
Supplier Device Package: 320-FBGA (19x19)
Number of Logic Elements/Cells: 33192
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1600000
Mounting Type: Surface Mount
Package / Case: 320-BGA
Packaging: Tray
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 17411.12 грн |
| A-MA35D-P16G-PQ-G |
Виробник: AMD
Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 138372.79 грн |
| A-U250-P64G-SPQG-016 |
|
Виробник: AMD
Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
товару немає в наявності
В кошику
од. на суму грн.
| A-U280-P32G-PQG-905 |
|
Виробник: AMD
Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
товару немає в наявності
В кошику
од. на суму грн.
| ADK-U55C |
Виробник: AMD
Description: ADK-U55C
Power (Watts): 115W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: ADK-U55C
Power (Watts): 115W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
товару немає в наявності
В кошику
од. на суму грн.
| XC7A35T-1FGG484I |
|
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 5805.55 грн |
| EK-VHK158-G |
Виробник: AMD
Description: VERSAL HBM VHK158 EVALUATION KIT
Packaging: Bulk
For Use With/Related Products: XCVH1582
Type: FPGA
Contents: Board(s)
Description: VERSAL HBM VHK158 EVALUATION KIT
Packaging: Bulk
For Use With/Related Products: XCVH1582
Type: FPGA
Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
| XCV100-5BG256I |
|
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 108904
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 2700
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 600
Total RAM Bits: 40960
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 108904
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 2700
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 600
Total RAM Bits: 40960
Number of I/O: 180
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC7A15T-2CPG236I |
|
Виробник: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4225.60 грн |
| XC7A35T-1CPG236C |
|
Виробник: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 106
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3885.40 грн |