| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XC3130-4PC84C | AMD |
 Description: FPGA, 100 CLBS, 2K GATESPackaging: Bulk Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 84-PLCC (29.31x29.31) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 74 DigiKey Programmable: Not Verified |
на замовлення 376 шт: термін постачання 21-31 дні (днів) |
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XC3130-PC44CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 44-PLCC (16.59x16.59) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 792 шт: термін постачання 21-31 дні (днів) |
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XC3130-PC68CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 68-PLCC (24.23x24.23) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 2897 шт: термін постачання 21-31 дні (днів) |
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XC3130-PQ100IPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 100-BQFP Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 100 Supplier Device Package: 100-PQFP (20x14) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 80 DigiKey Programmable: Not Verified |
на замовлення 141 шт: термін постачання 21-31 дні (днів) |
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XC3130-PC84CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 84-PLCC (29.31x29.31) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 74 DigiKey Programmable: Not Verified |
на замовлення 426 шт: термін постачання 21-31 дні (днів) |
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| XC3164-PP132CPH | AMD |
Description: XC3164 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 132-BPGA Mounting Type: Through Hole Number of Gates: 4500 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.25V ~ 5.25V Number of Logic Elements/Cells: 224 Supplier Device Package: 132-PGA (37.08x37.08) Number of LABs/CLBs: 224 Total RAM Bits: 46064 Number of I/O: 110 DigiKey Programmable: Not Verified |
на замовлення 362 шт: термін постачання 21-31 дні (днів) |
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| XC3164-PG132CPH | AMD |
Description: XC3164 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 132-BCPGA Mounting Type: Through Hole Number of Gates: 4500 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.25V ~ 5.25V Number of Logic Elements/Cells: 224 Supplier Device Package: 132-CPGA (37.08x37.08) Number of LABs/CLBs: 224 Total RAM Bits: 46064 Number of I/O: 110 DigiKey Programmable: Not Verified |
на замовлення 302 шт: термін постачання 21-31 дні (днів) |
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| XC3195-PG175CPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 484 Total RAM Bits: 94944 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 473 шт: термін постачання 21-31 дні (днів) |
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XAZU1EG-1SBVA484Q | AMD |
Description: IC ZUP MPSOC A53 FPGA Q 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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XCZU5EG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC3S1000-4FG320C | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Bulk Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 17280 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1920 Total RAM Bits: 442368 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| EFR-DI-25GEMAC-PROJ | AMD |
Description: LOGICORE, 10G/25G ETHERNET MAC/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Project Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25G-TSN-802-1-CM-PROJ | AMD |
Description: 10G/25G TSN 802.1CM WIRELESS PRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Project |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25GEMAC-SITE | AMD |
Description: LOGICORE, 10G/25G ETHERNET MAC/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25G-TSN-802-1-CM-SITE | AMD |
Description: 10G/25G TSN 802.1CM WIRELESS SIT Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25G-RS-FEC-PROJ | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Project Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25GBASE-KR-PROJ | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Project Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25G-RS-FEC-SITE | AMD |
Description: LOGICORE, 25G IEEE 802.3 REED-SO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25GBASE-KR-SITE | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| EFR-DI-25GBASE-KR-WW | AMD |
Description: LOGICORE, 10G/25G ETHERNET PCS/P Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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XC7A35T-2CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 210 DigiKey Programmable: Not Verified |
на замовлення 232 шт: термін постачання 21-31 дні (днів) |
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XC7A75T-2CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Number of I/O: 210 DigiKey Programmable: Not Verified |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XC7A75T-L1CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Number of I/O: 210 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCAU15P-2FFVB676I | AMD |
Description: IC FPGA ARTIXUP 676BGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 170100 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Number of I/O: 228 DigiKey Programmable: Not Verified |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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XCZU5EG-L2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-1UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| AM29LV160DT-70EC | AMD |
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7 Packaging: Tube Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 1032 шт: термін постачання 21-31 дні (днів) |
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| AM29LV160DT-70EC/T | AMD |
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7 Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 565 шт: термін постачання 21-31 дні (днів) |
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XC7A15T-2FGG484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 250 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FSVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU43DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU43DR-2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FFVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FSVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU43DR-2FSVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU43DR-2FFVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU48DR-2FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU48DR-2FSVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FFVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU43DR-2FFVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
XCZU43DR-2FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU47DR-2FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
EK-VPK120-G-ED | AMD |
Description: KIT VERSAL VPK120 VP1202 ACAP ED Packaging: Box For Use With/Related Products: XCVP1202 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Versal Premium Adaptive SoC VPK120 Encryption Disabled PCIe Card |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| EK-U1-ZCU111-G-ED | AMD |
Description: ZYNQUS+ XCZU28DR EVAL BRD ED Packaging: Box For Use With/Related Products: XCZU28DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU111 Encryption Disabled |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| VCK5000-AI-INF-P-G-ED | AMD |
Description: EVAL VERSAL AI ENGINE CARD ED Packaging: Bulk For Use With/Related Products: XCVC1902 Type: FPGA + MCU/MPU SoC Contents: Board(s) Platform: VCK5000 Versal AI Core Adaptive SoC Encryption Disabled PCIe Card |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
 |
XC7A15T-2CSG325I | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 150 DigiKey Programmable: Not Verified |
на замовлення 76 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
XAZU1EG-L1SBVA484I | AMD |
Description: ZUP MPSOC A53 FPGA Q LP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU2CG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
XAZU1EG-L1SFVA625I | AMD |
Description: ZUP MPSOC A53 FPGA Q LP 625BGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
XAZU1EG-L1SFVC784I | AMD |
Description: ZUP MPSOC A53 FPGA Q LP 784BGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU3CG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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XCZU3CG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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|
XAZU5EV-L1SFVC784I | AMD |
Description: IC FPGA SOC ZUEV LP Q100 784SBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| LMS-EMBD-HET | AMD |
Description: ONDEMAND EMBEDDED HETEROGENOUS D Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
 |
XCKU060-2FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 725550 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 41460 Total RAM Bits: 38912000 Number of I/O: 520 DigiKey Programmable: Not Verified |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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 |
XCAU15P-L1UBVA368I | AMD |
Description: IC FPGA ARTIXUP LP 368BGA Packaging: Tray Package / Case: 368-WFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 170100 Supplier Device Package: 368-FCBGA (10.5x10.5) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Number of I/O: 128 DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XCAU25P-1FFVB676I | AMD |
Description: IC FPGA ARTIXUP 676FBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 17625 Total RAM Bits: 4928307 Number of I/O: 280 DigiKey Programmable: Not Verified |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
|
| XC3130-4PC84C |
|
Виробник: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
на замовлення 376 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 36+ | 627.04 грн |
| XC3130-PC44CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 792 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 45+ | 513.75 грн |
| XC3130-PC68CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 2897 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 43+ | 517.47 грн |
| XC3130-PQ100IPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 141 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 658.81 грн |
| XC3130-PC84CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
на замовлення 426 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 17+ | 1334.02 грн |
| XC3164-PP132CPH |
|
Виробник: AMD
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-PGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-PGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
на замовлення 362 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2419.31 грн |
| XC3164-PG132CPH |
|
Виробник: AMD
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BCPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-CPGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BCPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-CPGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
на замовлення 302 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2419.31 грн |
| XC3195-PG175CPH |
|
Виробник: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 473 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 2526.69 грн |
| XAZU1EG-1SBVA484Q |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 46169.59 грн |
| XCZU5EG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 191203.34 грн |
| XC3S1000-4FG320C |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| EFR-DI-25GEMAC-PROJ |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25G-TSN-802-1-CM-PROJ |
|
Виробник: AMD
Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
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В кошику
од. на суму грн.
| EFR-DI-25GEMAC-SITE |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
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В кошику
од. на суму грн.
| EFR-DI-25G-TSN-802-1-CM-SITE |
|
Виробник: AMD
Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25G-RS-FEC-PROJ |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25GBASE-KR-PROJ |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25G-RS-FEC-SITE |
Виробник: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25GBASE-KR-SITE |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| EFR-DI-25GBASE-KR-WW |
|
Виробник: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
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В кошику
од. на суму грн.
| XC7A35T-2CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
на замовлення 232 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5139.66 грн |
| XC7A75T-2CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11308.99 грн |
| XC7A75T-L1CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 10846.15 грн |
| XCAU15P-2FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 22131.33 грн |
| XCZU5EG-L2SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 192618.85 грн |
| XCZU2CG-1UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
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| AM29LV160DT-70EC |
Виробник: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 1032 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 96+ | 185.40 грн |
| 192+ | 177.16 грн |
| 384+ | 175.10 грн |
| 960+ | 161.10 грн |
| AM29LV160DT-70EC/T |
Виробник: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 565 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 100+ | 185.40 грн |
| 200+ | 177.16 грн |
| 300+ | 175.79 грн |
| 500+ | 164.32 грн |
| XC7A15T-2FGG484I |
|
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
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од. на суму грн.
| XCZU47DR-2FSVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU47DR-2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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| XCZU47DR-2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
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| XCZU47DR-2FFVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU47DR-2FSVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FSVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FFVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU48DR-2FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU48DR-2FSVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU47DR-2FFVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FFVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-2FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU47DR-2FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| EK-VPK120-G-ED |
|
Виробник: AMD
Description: KIT VERSAL VPK120 VP1202 ACAP ED
Packaging: Box
For Use With/Related Products: XCVP1202
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Versal Premium Adaptive SoC VPK120 Encryption Disabled PCIe Card
Description: KIT VERSAL VPK120 VP1202 ACAP ED
Packaging: Box
For Use With/Related Products: XCVP1202
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Versal Premium Adaptive SoC VPK120 Encryption Disabled PCIe Card
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В кошику
од. на суму грн.
| EK-U1-ZCU111-G-ED |
|
Виробник: AMD
Description: ZYNQUS+ XCZU28DR EVAL BRD ED
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111 Encryption Disabled
Description: ZYNQUS+ XCZU28DR EVAL BRD ED
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111 Encryption Disabled
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В кошику
од. на суму грн.
| VCK5000-AI-INF-P-G-ED |
|
Виробник: AMD
Description: EVAL VERSAL AI ENGINE CARD ED
Packaging: Bulk
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: VCK5000 Versal AI Core Adaptive SoC Encryption Disabled PCIe Card
Description: EVAL VERSAL AI ENGINE CARD ED
Packaging: Bulk
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: VCK5000 Versal AI Core Adaptive SoC Encryption Disabled PCIe Card
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В кошику
од. на суму грн.
| XC7A15T-2CSG325I |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
на замовлення 76 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5277.00 грн |
| XCZU2CG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XAZU1EG-L1SBVA484I |
|
Виробник: AMD
Description: ZUP MPSOC A53 FPGA Q LP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Description: ZUP MPSOC A53 FPGA Q LP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XCZU2CG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XAZU1EG-L1SFVA625I |
|
Виробник: AMD
Description: ZUP MPSOC A53 FPGA Q LP 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
Description: ZUP MPSOC A53 FPGA Q LP 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XAZU1EG-L1SFVC784I |
|
Виробник: AMD
Description: ZUP MPSOC A53 FPGA Q LP 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Description: ZUP MPSOC A53 FPGA Q LP 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU3CG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XCZU3CG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XAZU5EV-L1SFVC784I |
|
Виробник: AMD
Description: IC FPGA SOC ZUEV LP Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC FPGA SOC ZUEV LP Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCKU060-2FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Number of I/O: 520
DigiKey Programmable: Not Verified
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Number of I/O: 520
DigiKey Programmable: Not Verified
на замовлення 49 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 404561.03 грн |
| XCAU15P-L1UBVA368I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 128
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 18080.10 грн |
| XCAU25P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Number of I/O: 280
DigiKey Programmable: Not Verified
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 36061.75 грн |