Продукція > DREYER ELECTRONICS LLC > Всі товари виробника DREYER ELECTRONICS LLC (21) > Сторінка 1 з 1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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DE01032 | Dreyer Electronics LLC |
 Description: QFP-32/TQFP-32/LQFP-32 TO DIP-32Packaging: Bag Size / Dimension: 1.637" L x 0.744" W (41.60mm x 18.90mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, QFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE01044 | Dreyer Electronics LLC |
Description: QFP-44/TQFP-44/LQFP-44 TO DIP-44 Packaging: Bag Size / Dimension: 2.236" L x 0.937" W (56.80mm x 23.80mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, QFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE01048 | Dreyer Electronics LLC |
Description: QFP-48/TQFP-48/LQFP-48 TO DIP-48 Packaging: Bag Size / Dimension: 2.440" L x 0.740" W (62.00mm x 18.80mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, QFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE01052 | Dreyer Electronics LLC |
Description: QFP-52/TQFP-52/LQFP-52 TO DIP-52 Packaging: Bag Size / Dimension: 2.937" L x 0.940" W (74.60mm x 23.90mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, QFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE01064 | Dreyer Electronics LLC |
Description: QFP-64/TQFP-64/LQFP-64 TO DIP-64 Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, QFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02008 | Dreyer Electronics LLC |
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8 Packaging: Bag Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02014 | Dreyer Electronics LLC |
Description: SOP-14/SSOP-14/SOIC-14 TO DIP-14 Packaging: Bag Size / Dimension: 0.740" L x 0.744" W (18.80mm x 18.90mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02016 | Dreyer Electronics LLC |
Description: SOP-16/SSOP-16/SOIC-16 TO DIP-16 Packaging: Bag Size / Dimension: 0.842" L x 0.744" W (21.40mm x 18.90mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02018 | Dreyer Electronics LLC |
Description: SOP-18/SSOP-18/SOIC-18 TO DIP-18 Packaging: Bag Size / Dimension: 0.905" L x 0.744" W (23.00mm x 18.90mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02020 | Dreyer Electronics LLC |
Description: SOP-20/SSOP-20/SOIC-20 TO DIP-20 Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02024 | Dreyer Electronics LLC |
Description: SOP-24/SSOP-24/SOIC-24 TO DIP-24 Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE02028 | Dreyer Electronics LLC |
Description: SOP-28/SSOP-28/SOIC-28 TO DIP-28 Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP, SSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0301 | Dreyer Electronics LLC |
Description: SOT23-3/SOT89-3 TO DIP-3 ADAPTER Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 2 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23, SOT-89 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0302 | Dreyer Electronics LLC |
Description: SOT23-5/SOT353 TO DIP-6 ADAPTER Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23, SOT-353 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0303 | Dreyer Electronics LLC |
Description: SOT23-6/SOT363 TO DIP-6 ADAPTER Packaging: Bag Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23, SOT-363 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0702 | Dreyer Electronics LLC |
Description: BREADBOARD MODULAR PTH Packaging: Bag Size / Dimension: 3.00" L x 3.00" W (76.2mm x 76.2mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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DE0703 | Dreyer Electronics LLC |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bag Size / Dimension: 3.50" L x 2.30" W (88.9mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 116 шт: термін постачання 21-31 дні (днів) |
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DE0703E | Dreyer Electronics LLC |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bag Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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DE0703L | Dreyer Electronics LLC |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bag Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0703Q | Dreyer Electronics LLC |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bag Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
DE0704 | Dreyer Electronics LLC |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bag Size / Dimension: 0.75" L x 0.59" W (19.15mm x 15.00mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 1650 шт: термін постачання 21-31 дні (днів) |
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| DE01032 |
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Виробник: Dreyer Electronics LLC
Description: QFP-32/TQFP-32/LQFP-32 TO DIP-32
Packaging: Bag
Size / Dimension: 1.637" L x 0.744" W (41.60mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
Description: QFP-32/TQFP-32/LQFP-32 TO DIP-32
Packaging: Bag
Size / Dimension: 1.637" L x 0.744" W (41.60mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE01044 |
|
Виробник: Dreyer Electronics LLC
Description: QFP-44/TQFP-44/LQFP-44 TO DIP-44
Packaging: Bag
Size / Dimension: 2.236" L x 0.937" W (56.80mm x 23.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
Description: QFP-44/TQFP-44/LQFP-44 TO DIP-44
Packaging: Bag
Size / Dimension: 2.236" L x 0.937" W (56.80mm x 23.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE01048 |
|
Виробник: Dreyer Electronics LLC
Description: QFP-48/TQFP-48/LQFP-48 TO DIP-48
Packaging: Bag
Size / Dimension: 2.440" L x 0.740" W (62.00mm x 18.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
Description: QFP-48/TQFP-48/LQFP-48 TO DIP-48
Packaging: Bag
Size / Dimension: 2.440" L x 0.740" W (62.00mm x 18.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE01052 |
|
Виробник: Dreyer Electronics LLC
Description: QFP-52/TQFP-52/LQFP-52 TO DIP-52
Packaging: Bag
Size / Dimension: 2.937" L x 0.940" W (74.60mm x 23.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
Description: QFP-52/TQFP-52/LQFP-52 TO DIP-52
Packaging: Bag
Size / Dimension: 2.937" L x 0.940" W (74.60mm x 23.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE01064 |
|
Виробник: Dreyer Electronics LLC
Description: QFP-64/TQFP-64/LQFP-64 TO DIP-64
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
Description: QFP-64/TQFP-64/LQFP-64 TO DIP-64
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02008 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8
Packaging: Bag
Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8
Packaging: Bag
Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02014 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-14/SSOP-14/SOIC-14 TO DIP-14
Packaging: Bag
Size / Dimension: 0.740" L x 0.744" W (18.80mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-14/SSOP-14/SOIC-14 TO DIP-14
Packaging: Bag
Size / Dimension: 0.740" L x 0.744" W (18.80mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02016 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-16/SSOP-16/SOIC-16 TO DIP-16
Packaging: Bag
Size / Dimension: 0.842" L x 0.744" W (21.40mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-16/SSOP-16/SOIC-16 TO DIP-16
Packaging: Bag
Size / Dimension: 0.842" L x 0.744" W (21.40mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02018 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-18/SSOP-18/SOIC-18 TO DIP-18
Packaging: Bag
Size / Dimension: 0.905" L x 0.744" W (23.00mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-18/SSOP-18/SOIC-18 TO DIP-18
Packaging: Bag
Size / Dimension: 0.905" L x 0.744" W (23.00mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02020 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-20/SSOP-20/SOIC-20 TO DIP-20
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-20/SSOP-20/SOIC-20 TO DIP-20
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02024 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-24/SSOP-24/SOIC-24 TO DIP-24
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-24/SSOP-24/SOIC-24 TO DIP-24
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE02028 |
|
Виробник: Dreyer Electronics LLC
Description: SOP-28/SSOP-28/SOIC-28 TO DIP-28
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
Description: SOP-28/SSOP-28/SOIC-28 TO DIP-28
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0301 |
|
Виробник: Dreyer Electronics LLC
Description: SOT23-3/SOT89-3 TO DIP-3 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-89
Part Status: Active
Description: SOT23-3/SOT89-3 TO DIP-3 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-89
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0302 |
|
Виробник: Dreyer Electronics LLC
Description: SOT23-5/SOT353 TO DIP-6 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-353
Part Status: Active
Description: SOT23-5/SOT353 TO DIP-6 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-353
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0303 |
|
Виробник: Dreyer Electronics LLC
Description: SOT23-6/SOT363 TO DIP-6 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-363
Part Status: Active
Description: SOT23-6/SOT363 TO DIP-6 ADAPTER
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SOT-363
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0702 |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD MODULAR PTH
Packaging: Bag
Size / Dimension: 3.00" L x 3.00" W (76.2mm x 76.2mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD MODULAR PTH
Packaging: Bag
Size / Dimension: 3.00" L x 3.00" W (76.2mm x 76.2mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 285.81 грн |
| 10+ | 251.63 грн |
| 25+ | 239.84 грн |
| 50+ | 217.70 грн |
| DE0703 |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Size / Dimension: 3.50" L x 2.30" W (88.9mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Size / Dimension: 3.50" L x 2.30" W (88.9mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 116 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 240.90 грн |
| 5+ | 208.38 грн |
| 10+ | 196.59 грн |
| 25+ | 173.42 грн |
| 50+ | 162.35 грн |
| 100+ | 154.97 грн |
| DE0703E |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 151.07 грн |
| 5+ | 137.61 грн |
| 10+ | 129.75 грн |
| 25+ | 114.38 грн |
| DE0703L |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0703Q |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| DE0704 |
|
Виробник: Dreyer Electronics LLC
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Size / Dimension: 0.75" L x 0.59" W (19.15mm x 15.00mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bag
Size / Dimension: 0.75" L x 0.59" W (19.15mm x 15.00mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 1650 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 102.07 грн |
| 5+ | 90.43 грн |
| 10+ | 78.64 грн |
| 25+ | 55.35 грн |
| 50+ | 47.97 грн |
| 100+ | 40.59 грн |