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AGIB022R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2I2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2I2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A1E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A1E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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EE80C186XL20 Intel Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
12+857.75 грн
Мінімальне замовлення: 12
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DK-CMC-AGI027RBES Intel Description: IC DEV TOOLS
Packaging: Bulk
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DJLXP730LE.A1 Intel Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
на замовлення 1370 шт:
термін постачання 21-31 дні (днів)
31+733.53 грн
Мінімальне замовлення: 31
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UG80960HD8016 Intel 80960HA_HD_HT_Sep02.pdf Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 968 шт:
термін постачання 21-31 дні (днів)
4+5994.24 грн
Мінімальне замовлення: 4
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5AGXBA1D6F27C6G Intel arria-v-device-overview.html Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D6F31C6G 5AGXBA1D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D6F31C6G 5AGXMA1D6F31C6G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA1D4F31C5G 5AGXBA1D4F31C5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27C4G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31C5G 5AGXMA1D4F31C5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA1D4F31C4G 5AGXBA1D4F31C4G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXBA1D4F31I5G 5AGXBA1D4F31I5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31C4G 5AGXMA1D4F31C4G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXMA1D4F31I5G 5AGXMA1D4F31I5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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10AX016E4F29E3SG 10AX016E4F29E3SG Intel Arria10_DeviceOverview.pdf Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
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5AGXMA1D4F27I3G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA3D6F31C6G 5AGXBA3D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA3D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31I3G 5AGXMA1D4F31I3G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA5D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
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10AX022C4U19I3SG 10AX022C4U19I3SG Intel Arria10_DeviceOverview.pdf Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
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10M25DAF256A7G 10M25DAF256A7G Intel Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
1+9595.08 грн
25+7391.64 грн
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QG82945GSE S LB2R Intel INTLS03772-1.pdf?t.download=true&u=5oefqw Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
на замовлення 810273 шт:
термін постачання 21-31 дні (днів)
13+1796.26 грн
Мінімальне замовлення: 13
В кошику  од. на суму  грн.
PR21555BB Intel INTLS00854-1.pdf?t.download=true&u=5oefqw Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
на замовлення 14384 шт:
термін постачання 21-31 дні (днів)
5+4748.91 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
A5ED065BB23AE5SR0 Intel Description: IC MPU FPGA AGILEX5E ES 839BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+67838.80 грн
В кошику  од. на суму  грн.
A5ED065BB32AE4SR0 Intel Description: IC MPU FPGA AGILEX5E ES 1591BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+83074.57 грн
В кошику  од. на суму  грн.
5AGXBB1D6F40C6G 5AGXBB1D6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXMB1G6F40C6G 5AGXMB1G6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB1D4F40C5G 5AGXBB1D4F40C5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB3D6F40C6G 5AGXBB3D6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXMB1G4F40C5G 5AGXMB1G4F40C5G Intel arria-v-device-overview.html Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB3G6F40C6G 5AGXMB3G6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXBB1D4F40C4G 5AGXBB1D4F40C4G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
5AGXBB1D4F40I5G 5AGXBB1D4F40I5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB1H4F40C5G 5AGXFB1H4F40C5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB3H6F40C6G 5AGXFB3H6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXBB3D4F40C5G 5AGXBB3D4F40C5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXBB5D6F40C6G 5AGXBB5D6F40C6G Intel Arria_V_DS.pdf Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB1G4F40C4G 5AGXMB1G4F40C4G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB1G4F40I5G 5AGXMB1G4F40I5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB5G6F40C6G 5AGXMB5G6F40C6G Intel Arria_V_DS.pdf Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB1H4F40C4G 5AGXFB1H4F40C4G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB1H4F40I5G 5AGXFB1H4F40I5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXBB3D4F40C4G 5AGXBB3D4F40C4G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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AGIB022R29A1E2V
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E2V
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2I3V
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2I2V
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A1E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIB022R29A1E1V
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIB027R29A2E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
AGIB027R29A1E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
AGIB027R29A1E2V
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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EE80C186XL20
Виробник: Intel
Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
12+857.75 грн
Мінімальне замовлення: 12
В кошику  од. на суму  грн.
DK-CMC-AGI027RBES
Виробник: Intel
Description: IC DEV TOOLS
Packaging: Bulk
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DJLXP730LE.A1
Виробник: Intel
Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
на замовлення 1370 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
31+733.53 грн
Мінімальне замовлення: 31
В кошику  од. на суму  грн.
UG80960HD8016 80960HA_HD_HT_Sep02.pdf
Виробник: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 968 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5994.24 грн
Мінімальне замовлення: 4
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5AGXBA1D6F27C6G arria-v-device-overview.html
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D6F31C6G
5AGXBA1D6F31C6G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D6F27C6G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27C5G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D6F31C6G
5AGXMA1D6F31C6G
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA1D4F31C5G
5AGXBA1D4F31C5G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D4F27C5G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27C4G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA1D4F27I5G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31C5G
5AGXMA1D4F31C5G
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA1D4F31C4G
5AGXBA1D4F31C4G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXBA1D4F31I5G
5AGXBA1D4F31I5G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA1D4F27I5G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31C4G
5AGXMA1D4F31C4G
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXMA1D4F31I5G
5AGXMA1D4F31I5G
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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10AX016E4F29E3SG Arria10_DeviceOverview.pdf
10AX016E4F29E3SG
Виробник: Intel
Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
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5AGXMA1D4F27I3G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXBA3D6F31C6G
5AGXBA3D6F31C6G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA3D6F27C6G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31I3G
5AGXMA1D4F31I3G
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA5D6F27C6G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
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10AX022C4U19I3SG Arria10_DeviceOverview.pdf
10AX022C4U19I3SG
Виробник: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
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10M25DAF256A7G Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf
10M25DAF256A7G
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9595.08 грн
25+7391.64 грн
В кошику  од. на суму  грн.
QG82945GSE S LB2R INTLS03772-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
на замовлення 810273 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13+1796.26 грн
Мінімальне замовлення: 13
В кошику  од. на суму  грн.
PR21555BB INTLS00854-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
на замовлення 14384 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+4748.91 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
A5ED065BB23AE5SR0
Виробник: Intel
Description: IC MPU FPGA AGILEX5E ES 839BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+67838.80 грн
В кошику  од. на суму  грн.
A5ED065BB32AE4SR0
Виробник: Intel
Description: IC MPU FPGA AGILEX5E ES 1591BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+83074.57 грн
В кошику  од. на суму  грн.
5AGXBB1D6F40C6G
5AGXBB1D6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXMB1G6F40C6G
5AGXMB1G6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB1D4F40C5G
5AGXBB1D4F40C5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB3D6F40C6G
5AGXBB3D6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXMB1G4F40C5G arria-v-device-overview.html
5AGXMB1G4F40C5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXMB3G6F40C6G
5AGXMB3G6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB1D4F40C4G
5AGXBB1D4F40C4G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXBB1D4F40I5G
5AGXBB1D4F40I5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXFB1H4F40C5G
5AGXFB1H4F40C5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
5AGXFB3H6F40C6G
5AGXFB3H6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
5AGXBB3D4F40C5G
5AGXBB3D4F40C5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
5AGXBB5D6F40C6G Arria_V_DS.pdf
5AGXBB5D6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB1G4F40C4G
5AGXMB1G4F40C4G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB1G4F40I5G
5AGXMB1G4F40I5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXMB5G6F40C6G Arria_V_DS.pdf
5AGXMB5G6F40C6G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB1H4F40C4G
5AGXFB1H4F40C4G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXFB1H4F40I5G
5AGXFB1H4F40I5G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
5AGXBB3D4F40C4G
5AGXBB3D4F40C4G
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
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