Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
---|---|---|---|---|---|---|---|
QGE7320MC | Intel |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 11040 шт: термін постачання 21-31 дні (днів) |
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5SGXMA4H2F35I3LG | Intel |
Description: IC FPGA 600 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 158500 Total RAM Bits: 37888000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5AGXFB1H4F40I3G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 300000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 14151 Total RAM Bits: 17358848 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5AGXFB3H4F40I3G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 362000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 17110 Total RAM Bits: 19822592 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5AGTFD3H3F40I3G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 362000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 17110 Total RAM Bits: 19822592 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5AGXFB7K4F40I3G | Intel |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 504140 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 23786 Total RAM Bits: 2975744 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
DH82Z97 | Intel |
![]() Packaging: Bulk |
на замовлення 15200 шт: термін постачання 21-31 дні (днів) |
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DH82H97 | Intel |
![]() Packaging: Bulk |
на замовлення 9600 шт: термін постачання 21-31 дні (днів) |
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1SX280HH3F55I2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280HH2F55E2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280HH3F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280HH3F55E2LGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1ST085EN3F43E3VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1ST085EN3F43E3VGAS | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN3F43I3VGAS | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN3F43I3VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43E2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN1F43E2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43E1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43I2VGAS | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43I2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43E2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN1F43E2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085ES3F50I3XG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43I1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN1F43I1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43I2LGAS | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
1ST085EN2F43I2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
EP4SE360H29I3G | Intel |
Description: IC FPGA 488 I/O 780HBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
EP4SGX230HF35I3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EP4S100G5H40I1G | Intel |
Description: IC FPGA 654 I/O 1517HBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EP4SGX70HF35I4G | Intel |
Description: IC FPGA 488 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 72600 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 2904 Total RAM Bits: 7564880 Number of I/O: 488 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
QG82945GC | Intel |
![]() Packaging: Bulk Package / Case: 1202-BGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 99°C (TC) Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 1202-FCBGA (34x34) |
на замовлення 128020 шт: термін постачання 21-31 дні (днів) |
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EP4SGX530HH35C4G | Intel |
Description: IC FPGA 564 I/O 1152HBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EPF8452ATC100-3 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 4000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 336 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 42 Number of I/O: 78 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
KC80526LY700128 | Intel |
Description: RISC MPU, 32-BIT, 700MHZ Packaging: Bulk |
на замовлення 7266 шт: термін постачання 21-31 дні (днів) |
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5CEFA9U19I7N | Intel |
![]() Packaging: Tray Package / Case: 484-FBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 301000 Supplier Device Package: 484-UBGA (19x19) Number of LABs/CLBs: 113560 Total RAM Bits: 14251008 Number of I/O: 240 DigiKey Programmable: Not Verified |
на замовлення 79 шт: термін постачання 21-31 дні (днів) |
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RD38F2240WWYTQ0 | Intel |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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P82C088 | Intel |
![]() Packaging: Bulk Package / Case: 48-DIP Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 48-DIP |
на замовлення 1008 шт: термін постачання 21-31 дні (днів) |
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TN87C196KJ | Intel |
Description: 196 MICROPROCESSOR Packaging: Bulk |
на замовлення 1295 шт: термін постачання 21-31 дні (днів) |
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EPF6010ATC100-2 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 10000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 880 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 88 Number of I/O: 71 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
EPM570ZM256C6N | Intel |
![]() Packaging: Tray Package / Case: 256-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 256-MBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 160 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
EPM570ZM256I8N | Intel |
![]() Packaging: Tray Package / Case: 256-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 256-MBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 160 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
PA28F008SA85 | Intel |
![]() Packaging: Bulk Package / Case: 44-PSOP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Technology: FLASH Memory Format: FLASH Write Cycle Time - Word, Page: 85ns Memory Interface: Parallel Access Time: 85 ns Memory Organization: 1M x 8 DigiKey Programmable: Not Verified |
на замовлення 1160 шт: термін постачання 21-31 дні (днів) |
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1ST040EH3F35E3VG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
1ST040EH3F35I3VG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
1ST040EH3F35E3XG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
1ST040EH2F35E2VG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
1ST040EH1F35E2VG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
1ST040EH3F35I3XG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
EPM7064BTC100-3 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 3.5 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
EPF8820ABC225-4 | Intel |
![]() Packaging: Tray Package / Case: 225-BGA Mounting Type: Surface Mount Number of Gates: 8000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 672 Supplier Device Package: 225-BGA (19x19) Number of LABs/CLBs: 84 Number of I/O: 152 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
AGIB022R29A2E3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
AGIB027R29A2E3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.7M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
AGIB022R29A2E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
AGIB022R29A2E2V | Intel |
Description: IC Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
AGIB022R29A2I3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
AGIB022R29A1E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
AGIB022R29A2E1VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
AGIB022R29A2E1V | Intel |
Description: IC Packaging: Tray Package / Case: 2957-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 2.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2957-BGA (56x45) Architecture: MPU, FPGA |
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В кошику од. на суму грн. |
QGE7320MC |
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Виробник: Intel
Description: MEMORY CONTROLLER HUB (MCH)
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MEMORY CONTROLLER HUB (MCH)
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 11040 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 2989.36 грн |
5SGXMA4H2F35I3LG |
Виробник: Intel
Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
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5AGXFB1H4F40I3G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGXFB3H4F40I3G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
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5AGTFD3H3F40I3G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
5AGXFB7K4F40I3G |
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Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 504140
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 23786
Total RAM Bits: 2975744
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 504140
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 23786
Total RAM Bits: 2975744
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
DH82Z97 |
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на замовлення 15200 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
211+ | 105.81 грн |
DH82H97 |
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на замовлення 9600 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
198+ | 113.26 грн |
1SX280HH3F55I2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH2F55E2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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од. на суму грн.
1SX280HH3F55E2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E2LGS3 |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1ST085EN3F43E3VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN3F43E3VGAS |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN3F43I3VGAS |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN3F43I3VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43E2VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN1F43E2VG |
![]() |
Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43E1VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43I2VGAS |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43I2VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43E2LG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN1F43E2LG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085ES3F50I3XG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43I1VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN1F43I1VG |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43I2LGAS |
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Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST085EN2F43I2LG |
![]() |
Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
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EP4SE360H29I3G |
Виробник: Intel
Description: IC FPGA 488 I/O 780HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX230HF35I3G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4S100G5H40I1G |
Виробник: Intel
Description: IC FPGA 654 I/O 1517HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 654 I/O 1517HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX70HF35I4G |
Виробник: Intel
Description: IC FPGA 488 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 72600
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 2904
Total RAM Bits: 7564880
Number of I/O: 488
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 72600
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 2904
Total RAM Bits: 7564880
Number of I/O: 488
DigiKey Programmable: Not Verified
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QG82945GC |
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Виробник: Intel
Description: DRAM CONTROLLER, 64M X 16, CMOS,
Packaging: Bulk
Package / Case: 1202-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 99°C (TC)
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 1202-FCBGA (34x34)
Description: DRAM CONTROLLER, 64M X 16, CMOS,
Packaging: Bulk
Package / Case: 1202-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 99°C (TC)
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 1202-FCBGA (34x34)
на замовлення 128020 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
27+ | 825.05 грн |
EP4SGX530HH35C4G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EPF8452ATC100-3 |
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Виробник: Intel
Description: IC FPGA 78 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 4000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 336
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 42
Number of I/O: 78
DigiKey Programmable: Not Verified
Description: IC FPGA 78 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 4000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 336
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 42
Number of I/O: 78
DigiKey Programmable: Not Verified
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KC80526LY700128 |
на замовлення 7266 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 7558.34 грн |
5CEFA9U19I7N |
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Виробник: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
на замовлення 79 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 46777.69 грн |
RD38F2240WWYTQ0 |
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на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
28+ | 793.65 грн |
P82C088 |
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Виробник: Intel
Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
на замовлення 1008 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
14+ | 1639.25 грн |
TN87C196KJ |
на замовлення 1295 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
7+ | 3490.08 грн |
EPF6010ATC100-2 |
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Виробник: Intel
Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
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EPM570ZM256C6N |
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Виробник: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
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EPM570ZM256I8N |
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Виробник: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
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PA28F008SA85 |
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Виробник: Intel
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
на замовлення 1160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
54+ | 412.94 грн |
1ST040EH3F35E3VG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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1ST040EH3F35I3VG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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1ST040EH3F35E3XG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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1ST040EH2F35E2VG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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од. на суму грн.
1ST040EH1F35E2VG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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1ST040EH3F35I3XG |
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Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
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EPM7064BTC100-3 |
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Виробник: Intel
Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
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EPF8820ABC225-4 |
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Виробник: Intel
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
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AGIB022R29A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB027R29A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2E2V |
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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AGIB022R29A2E1V |
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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