| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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5CSEBA2U19C7N | Intel |
 Description: IC SOC CORTEX-A9 800MHZ 484UBGAPackaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 99 шт: термін постачання 21-31 дні (днів) |
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5CSEBA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 484-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 484-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 484-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 484-FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
на замовлення 207 шт: термін постачання 21-31 дні (днів) |
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5CSEBA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 672-FBGA Packaging: Tray |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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5CSEBA4U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Qualification: AEC-Q100 Grade: Automotive Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 25K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 25K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Qualification: AEC-Q100 Grade: Automotive Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 672-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EVB-ED8101P02QI | Intel |
Description: EVAL BOARD FOR ED8101 Supplied Contents: Board(s) Utilized IC / Part: ED8101, ET4040 Type: Power Management Function: Digital Power Controller Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EVB-EY1501DI-ADJ | Intel |
Description: EVAL BAORD FOR EY1501 Channels per IC: 1 - Single Supplied Contents: Board(s) Utilized IC / Part: EY1501DI-ADJ Board Type: Fully Populated Regulator Type: Positive Adjustable Current - Output: 1A Voltage - Input: 2.2V ~ 6V Voltage - Output: 0.8V ~ 5V Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EVI-ED8100COMMIF | Intel |
Description: DONGLE FOR ED8100 SERIES Accessory Type: Interface Board Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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ED8101P00QI | Intel |
Description: IC REG CTRLR BUCK I2C 24QFN Number of Outputs: 1 Clock Sync: No Duty Cycle (Max): 100% Output Phases: 1 Serial Interfaces: I²C Control Features: Power Good Supplier Device Package: 24-QFN (4x4) Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Topology: Buck Frequency - Switching: 500kHz ~ 1MHz Output Configuration: Positive Operating Temperature: -40°C ~ 85°C (TA) Function: Step-Down Mounting Type: Surface Mount Output Type: PWM Signal Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Part Status: Obsolete Voltage - Output (Min/Fixed): 0.6V Voltage - Input (Min): 3V Voltage - Output (Max): 34V Synchronous Rectifier: Yes Supplier Device Package: 12-DFN (4x3) Topology: Buck Voltage - Input (Max): 36V Frequency - Switching: 300kHz ~ 2MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 1A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 12-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC DigiKey Programmable: Not Verified Current - Supply: 286 µA Supplier Device Package: 14-SOIC Applications: Power Supply Sequencer Voltage - Supply: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Input: 3.3V ~ 24V Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Current - Supply (Max): 7 mA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 212mV @ 1A PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Part Status: Obsolete Control Features: Enable, Power Good, Soft Start Voltage - Output (Min/Fixed): 0.8V Voltage - Output (Max): 5V Supplier Device Package: 10-DFN (3x3) Number of Regulators: 1 Voltage - Input (Max): 6V Current - Quiescent (Iq): 5 mA Output Configuration: Positive Operating Temperature: -40°C ~ 125°C Current - Output: 1A Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 10-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EY1601SA-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 50MA 8SOIC |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Part Status: Obsolete Voltage - Output (Min/Fixed): 0.6V Voltage - Input (Min): 3V Voltage - Output (Max): 34V Synchronous Rectifier: Yes Supplier Device Package: 12-DFN (4x3) Topology: Buck Voltage - Input (Max): 36V Frequency - Switching: 300kHz ~ 2MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 1A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 12-VFDFN Exposed Pad Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
на замовлення 211 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC Voltage - Supply: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Input: 3.3V ~ 24V Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Current - Supply: 286 µA Supplier Device Package: 14-SOIC Applications: Power Supply Sequencer |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Current - Supply (Max): 7 mA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 212mV @ 1A PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Part Status: Obsolete Control Features: Enable, Power Good, Soft Start Voltage - Output (Min/Fixed): 0.8V Voltage - Output (Max): 5V Supplier Device Package: 10-DFN (3x3) Number of Regulators: 1 Voltage - Input (Max): 6V Current - Quiescent (Iq): 5 mA Output Configuration: Positive Operating Temperature: -40°C ~ 125°C Current - Output: 1A Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 10-VFDFN Exposed Pad Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||
| ED8101P01QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| ED8101P02QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
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ED8106N02QI | Intel |
Description: IC REG CTRLR BUCK 24QFN Output Type: PWM Signal Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Number of Outputs: 1 Part Status: Obsolete Clock Sync: No Duty Cycle (Max): 100% Output Phases: 1 Control Features: Power Good Supplier Device Package: 24-QFN (4x4) Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Topology: Buck Frequency - Switching: 500kHz ~ 1MHz Output Configuration: Positive Operating Temperature: -40°C ~ 85°C (TA) Function: Step-Down Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EQC1241QI | Intel | Description: IC REG BUCK SYNC 2A 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EN23F2QI | Intel |
Description: DC DC CONVERTER 0.75-3.3V Number of Outputs: 1 Control Features: Enable, Active High Voltage - Output 1: 0.75 ~ 3.3V Voltage - Input (Min): 4.5V Supplier Device Package: 92-QFN (13x12) Current - Output (Max): 15A Efficiency: 91% Voltage - Input (Max): 13.2V Applications: ITE (Commercial) Operating Temperature: -40°C ~ 85°C Type: Non-Isolated PoL Module Mounting Type: Surface Mount Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm) Package / Case: 92-PowerBFQFN Module Features: Remote On/Off, OCP, OTP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EN5310DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Number of Outputs: 1 Control Features: Enable, Active High Voltage - Output 1: 0.8 ~ 3.3V Voltage - Input (Min): 2.375V Supplier Device Package: 36-DFN (12.5x8.1) Current - Output (Max): 1A Efficiency: 90% Voltage - Input (Max): 5.5V Applications: ITE (Commercial) Operating Temperature: 0°C ~ 70°C Type: Non-Isolated PoL Module Mounting Type: Surface Mount Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Package / Case: 36-PowerDFN Module Features: Remote On/Off, OCP, OTP, OVP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EN5310DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Features: Remote On/Off, OCP, OTP, OVP Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 1A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EN5312QI | Intel |
Description: DC DC CONVERTER 0.6-6V 6W |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EN5330DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Features: Remote On/Off, OCP, OTP, OVP, UVLO Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: 0°C ~ 70°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EN5330DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Features: Remote On/Off, OCP, OTP, OVP, UVLO Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
5AGXBA1D4F27I5 | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5AGXFB5K4F40I5 | Intel |
Description: IC FPGA 704 I/O 1517FBGA Number of I/O: 704 Part Status: Obsolete Total RAM Bits: 23625728 Number of LABs/CLBs: 19811 Supplier Device Package: 1517-FBGA (40x40) Number of Logic Elements/Cells: 420000 Voltage - Supply: 1.07V ~ 1.13V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1517-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5ASXMB5E4F31I3N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Architecture: MCU, FPGA Supplier Device Package: 896-FBGA, FC (31x31) Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 462K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 896-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5CEBA4F17I7 | Intel |
Description: IC FPGA 128 I/O 256FBGA DigiKey Programmable: Not Verified Number of I/O: 128 Total RAM Bits: 3464192 Number of LABs/CLBs: 18480 Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Cells: 49000 Voltage - Supply: 1.07V ~ 1.13V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5CEFA2F23I7 | Intel |
Description: IC FPGA 224 I/O 484FBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
5CGXFC9A6U19I7 | Intel |
Description: IC FPGA 240 I/O 484UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5M1270ZT144I5 | Intel |
Description: IC CPLD 980MC 6.2NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 114 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 5SGXEA4H3F35I4 | Intel |
Description: IC FPGA 552 I/O 1152FBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
5SGXMA4H2F35I2 | Intel |
Description: IC FPGA 600 I/O 1152FBGA DigiKey Programmable: Not Verified Packaging: Tray Number of I/O: 600 Total RAM Bits: 37888000 Number of LABs/CLBs: 158500 Supplier Device Package: 1152-FBGA (35x35) Number of Logic Elements/Cells: 420000 Voltage - Supply: 0.87V ~ 0.93V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1152-BBGA, FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
EP2AGX65CU17I3N | Intel |
Description: IC FPGA 156 I/O 358UBGA Mounting Type: Surface Mount Package / Case: 358-LFBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 156 Total RAM Bits: 5371904 Number of LABs/CLBs: 2530 Supplier Device Package: 358-UBGA, FCBGA (17x17) Number of Logic Elements/Cells: 60214 Voltage - Supply: 0.87V ~ 0.93V Operating Temperature: -40°C ~ 100°C (TJ) |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
EP3C5M164I7 | Intel |
Description: IC FPGA 106 I/O 164MBGA DigiKey Programmable: Not Verified Number of I/O: 106 Part Status: Active Total RAM Bits: 423936 Number of LABs/CLBs: 321 Supplier Device Package: 164-MBGA (8x8) Number of Logic Elements/Cells: 5136 Voltage - Supply: 1.15V ~ 1.25V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 164-TFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
5SGXEA7N1F45I2 | Intel |
Description: IC FPGA 840 I/O 1932FBGA DigiKey Programmable: Not Verified Number of I/O: 840 Total RAM Bits: 51200000 Number of LABs/CLBs: 234720 Supplier Device Package: 1932-FBGA, FC (45x45) Number of Logic Elements/Cells: 622000 Voltage - Supply: 0.87V ~ 0.93V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1932-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| 5CSEBA2U19C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA2U19C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA2U19C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 99 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5241.63 грн |
| 5CSEBA2U23C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA2U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA2U23C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA2U23I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
на замовлення 207 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 9812.80 грн |
| 5CSEBA4U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7266.31 грн |
| 5CSEBA4U23I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA2U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
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| 5CSEMA2U23C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA2U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA2U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA2U23I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
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| 5CSEMA4U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
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| 5CSEMA4U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
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| 5CSEMA4U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
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| EVB-ED8101P02QI |
Виробник: Intel
Description: EVAL BOARD FOR ED8101
Supplied Contents: Board(s)
Utilized IC / Part: ED8101, ET4040
Type: Power Management
Function: Digital Power Controller
Packaging: Bulk
Description: EVAL BOARD FOR ED8101
Supplied Contents: Board(s)
Utilized IC / Part: ED8101, ET4040
Type: Power Management
Function: Digital Power Controller
Packaging: Bulk
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| EVB-EY1501DI-ADJ |
|
Виробник: Intel
Description: EVAL BAORD FOR EY1501
Channels per IC: 1 - Single
Supplied Contents: Board(s)
Utilized IC / Part: EY1501DI-ADJ
Board Type: Fully Populated
Regulator Type: Positive Adjustable
Current - Output: 1A
Voltage - Input: 2.2V ~ 6V
Voltage - Output: 0.8V ~ 5V
Packaging: Bulk
Description: EVAL BAORD FOR EY1501
Channels per IC: 1 - Single
Supplied Contents: Board(s)
Utilized IC / Part: EY1501DI-ADJ
Board Type: Fully Populated
Regulator Type: Positive Adjustable
Current - Output: 1A
Voltage - Input: 2.2V ~ 6V
Voltage - Output: 0.8V ~ 5V
Packaging: Bulk
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| EVI-ED8100COMMIF |
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 10821.23 грн |
| ED8101P00QI |
Виробник: Intel
Description: IC REG CTRLR BUCK I2C 24QFN
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Serial Interfaces: I²C
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG CTRLR BUCK I2C 24QFN
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Serial Interfaces: I²C
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| ER3110DI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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| ES1020QI |
Виробник: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
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В кошику
од. на суму грн.
| ES1022SI |
|
Виробник: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC CONTROLLER HOT SWAP 14SOIC
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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В кошику
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| EY1501DI-ADJ |
|
Виробник: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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| EY1601SA-ADJ |
|
Виробник: Intel
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| ER3110DI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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| ES1020QI |
Виробник: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
на замовлення 211 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| ES1022SI |
|
Виробник: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Description: IC CONTROLLER HOT SWAP 14SOIC
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
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| EY1501DI-ADJ |
|
Виробник: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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| ED8106N02QI |
Виробник: Intel
Description: IC REG CTRLR BUCK 24QFN
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Outputs: 1
Part Status: Obsolete
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Description: IC REG CTRLR BUCK 24QFN
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Outputs: 1
Part Status: Obsolete
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
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| EQC1241QI |
Виробник: Intel
Description: IC REG BUCK SYNC 2A 24QFN
Description: IC REG BUCK SYNC 2A 24QFN
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| EN23F2QI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.75-3.3V
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.75 ~ 3.3V
Voltage - Input (Min): 4.5V
Supplier Device Package: 92-QFN (13x12)
Current - Output (Max): 15A
Efficiency: 91%
Voltage - Input (Max): 13.2V
Applications: ITE (Commercial)
Operating Temperature: -40°C ~ 85°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Package / Case: 92-PowerBFQFN Module
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
Description: DC DC CONVERTER 0.75-3.3V
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.75 ~ 3.3V
Voltage - Input (Min): 4.5V
Supplier Device Package: 92-QFN (13x12)
Current - Output (Max): 15A
Efficiency: 91%
Voltage - Input (Max): 13.2V
Applications: ITE (Commercial)
Operating Temperature: -40°C ~ 85°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Package / Case: 92-PowerBFQFN Module
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
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| EN5310DC |
Виробник: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.8 ~ 3.3V
Voltage - Input (Min): 2.375V
Supplier Device Package: 36-DFN (12.5x8.1)
Current - Output (Max): 1A
Efficiency: 90%
Voltage - Input (Max): 5.5V
Applications: ITE (Commercial)
Operating Temperature: 0°C ~ 70°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Package / Case: 36-PowerDFN Module
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Description: DC DC CONVERTER 0.8-3.3V 3W
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.8 ~ 3.3V
Voltage - Input (Min): 2.375V
Supplier Device Package: 36-DFN (12.5x8.1)
Current - Output (Max): 1A
Efficiency: 90%
Voltage - Input (Max): 5.5V
Applications: ITE (Commercial)
Operating Temperature: 0°C ~ 70°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Package / Case: 36-PowerDFN Module
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
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| EN5310DI |
Виробник: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 3W
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5312QI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.6-6V 6W
Description: DC DC CONVERTER 0.6-6V 6W
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| EN5330DC |
|
Виробник: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5330DI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| 5AGXBA1D4F27I5 |
|
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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| 5AGXFB5K4F40I5 |
|
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Number of I/O: 704
Part Status: Obsolete
Total RAM Bits: 23625728
Number of LABs/CLBs: 19811
Supplier Device Package: 1517-FBGA (40x40)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA
Packaging: Tray
Description: IC FPGA 704 I/O 1517FBGA
Number of I/O: 704
Part Status: Obsolete
Total RAM Bits: 23625728
Number of LABs/CLBs: 19811
Supplier Device Package: 1517-FBGA (40x40)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA
Packaging: Tray
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| 5ASXMB5E4F31I3N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Architecture: MCU, FPGA
Supplier Device Package: 896-FBGA, FC (31x31)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 462K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 896-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Architecture: MCU, FPGA
Supplier Device Package: 896-FBGA, FC (31x31)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 462K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 896-BBGA, FCBGA
Packaging: Tray
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| 5CEBA4F17I7 |
|
Виробник: Intel
Description: IC FPGA 128 I/O 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 128
Total RAM Bits: 3464192
Number of LABs/CLBs: 18480
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Cells: 49000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC FPGA 128 I/O 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 128
Total RAM Bits: 3464192
Number of LABs/CLBs: 18480
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Cells: 49000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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| 5CEFA2F23I7 |
|
Виробник: Intel
Description: IC FPGA 224 I/O 484FBGA
Description: IC FPGA 224 I/O 484FBGA
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| 5CGXFC9A6U19I7 |
|
Виробник: Intel
Description: IC FPGA 240 I/O 484UBGA
Description: IC FPGA 240 I/O 484UBGA
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| 5M1270ZT144I5 |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 114
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 114
DigiKey Programmable: Not Verified
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| 5SGXEA4H3F35I4 |
|
Виробник: Intel
Description: IC FPGA 552 I/O 1152FBGA
Description: IC FPGA 552 I/O 1152FBGA
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| 5SGXMA4H2F35I2 |
|
Виробник: Intel
Description: IC FPGA 600 I/O 1152FBGA
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 600
Total RAM Bits: 37888000
Number of LABs/CLBs: 158500
Supplier Device Package: 1152-FBGA (35x35)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Description: IC FPGA 600 I/O 1152FBGA
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 600
Total RAM Bits: 37888000
Number of LABs/CLBs: 158500
Supplier Device Package: 1152-FBGA (35x35)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
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| EP2AGX65CU17I3N |
|
Виробник: Intel
Description: IC FPGA 156 I/O 358UBGA
Mounting Type: Surface Mount
Package / Case: 358-LFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 156
Total RAM Bits: 5371904
Number of LABs/CLBs: 2530
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of Logic Elements/Cells: 60214
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Description: IC FPGA 156 I/O 358UBGA
Mounting Type: Surface Mount
Package / Case: 358-LFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 156
Total RAM Bits: 5371904
Number of LABs/CLBs: 2530
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of Logic Elements/Cells: 60214
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
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| EP3C5M164I7 |
|
Виробник: Intel
Description: IC FPGA 106 I/O 164MBGA
DigiKey Programmable: Not Verified
Number of I/O: 106
Part Status: Active
Total RAM Bits: 423936
Number of LABs/CLBs: 321
Supplier Device Package: 164-MBGA (8x8)
Number of Logic Elements/Cells: 5136
Voltage - Supply: 1.15V ~ 1.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 164-TFBGA
Packaging: Tray
Description: IC FPGA 106 I/O 164MBGA
DigiKey Programmable: Not Verified
Number of I/O: 106
Part Status: Active
Total RAM Bits: 423936
Number of LABs/CLBs: 321
Supplier Device Package: 164-MBGA (8x8)
Number of Logic Elements/Cells: 5136
Voltage - Supply: 1.15V ~ 1.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 164-TFBGA
Packaging: Tray
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| 5SGXEA7N1F45I2 |
|
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
DigiKey Programmable: Not Verified
Number of I/O: 840
Total RAM Bits: 51200000
Number of LABs/CLBs: 234720
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of Logic Elements/Cells: 622000
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1932-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 840 I/O 1932FBGA
DigiKey Programmable: Not Verified
Number of I/O: 840
Total RAM Bits: 51200000
Number of LABs/CLBs: 234720
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of Logic Elements/Cells: 622000
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1932-BBGA, FCBGA
Packaging: Tray
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