| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ABA-SAT-022-K04 | LOTES |
на замовлення 2694 шт: термін постачання 14-28 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
| ACA-SPI-001-T03 | LOTES |
на замовлення 2400 шт: термін постачання 14-28 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
|
ACA-SPI-004-K01 | LOTES |
Description: SPI 8 PIN_IC 208milFeatures: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1680 шт: термін постачання 21-31 дні (днів) |
|
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|
ACA-SPI-006-K01 | LOTES |
Description: SPI 16 PIN_IC 300milFeatures: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| ACA-Z1F-046-K01-A | LOTES |
на замовлення 15 шт: термін постачання 14-28 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
| ACA-ZIF-068-P02 | LOTES |
на замовлення 958 шт: термін постачання 14-28 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
| AEA-BTB-023-T80 BTB HD | LOTES | 08+ SMD |
на замовлення 8746 шт: термін постачання 14-28 дні (днів) |
В кошику од. на суму грн. | |||||||||||
|
ASPI0001-P001A | LOTES |
Description: SPI 8 PIN_IC 150milFeatures: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1710 шт: термін постачання 21-31 дні (днів) |
|
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|
ASPI0002-P001A | LOTES |
Description: SPI 8Pin WSON 8X6Packaging: Tape & Reel (TR) Features: Board Guide, Closed Frame Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3400 шт: термін постачання 21-31 дні (днів) |
|
| ABA-SAT-022-K04 |
Виробник: LOTES
на замовлення 2694 шт:
термін постачання 14-28 дні (днів)В кошику од. на суму грн.
| ACA-SPI-001-T03 |
Виробник: LOTES
на замовлення 2400 шт:
термін постачання 14-28 дні (днів)В кошику од. на суму грн.
| ACA-SPI-004-K01 |
![]() |
Виробник: LOTES
Description: SPI 8 PIN_IC 208mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 208mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1680 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 1493.95 грн |
| 50+ | 719.31 грн |
| 100+ | 431.59 грн |
| 200+ | 270.02 грн |
| 700+ | 135.01 грн |
| ACA-SPI-006-K01 |
![]() |
Виробник: LOTES
Description: SPI 16 PIN_IC 300mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Description: SPI 16 PIN_IC 300mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| ACA-Z1F-046-K01-A |
Виробник: LOTES
на замовлення 15 шт:
термін постачання 14-28 дні (днів)В кошику од. на суму грн.
| ACA-ZIF-068-P02 |
Виробник: LOTES
на замовлення 958 шт:
термін постачання 14-28 дні (днів)В кошику од. на суму грн.
| AEA-BTB-023-T80 BTB HD |
Виробник: LOTES
08+ SMD
08+ SMD
на замовлення 8746 шт:
термін постачання 14-28 дні (днів)В кошику од. на суму грн.
| ASPI0001-P001A |
![]() |
Виробник: LOTES
Description: SPI 8 PIN_IC 150mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 150mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1710 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 1493.95 грн |
| 50+ | 719.31 грн |
| 100+ | 431.59 грн |
| 200+ | 270.02 грн |
| 700+ | 135.01 грн |
| ASPI0002-P001A |
![]() |
Виробник: LOTES
Description: SPI 8Pin WSON 8X6
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8Pin WSON 8X6
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 1545.56 грн |
| 50+ | 744.16 грн |
| 100+ | 446.50 грн |
| 200+ | 279.35 грн |
| 700+ | 139.67 грн |




