Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (332468) > Сторінка 1044 з 5542
Фото | Назва | Виробник | Інформація |
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M2S025TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S025TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S025TS-VFG400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025T-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025T-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025-VF256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
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M2S025-VFG256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
на замовлення 144 шт: термін постачання 21-31 дні (днів) |
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M2S050-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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M2S050T-FG484I | Microchip Technology | Description: IC SOC CORTEX-M3 166MHZ 484FBGA |
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M2S050TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S050TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S050-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S060-1FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
на замовлення 176 шт: термін постачання 21-31 дні (днів) |
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M2S060-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
на замовлення 467 шт: термін постачання 21-31 дні (днів) |
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M2S060T-1FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 256KB |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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M2S060TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S060TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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M2S090-FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
на замовлення 119 шт: термін постачання 21-31 дні (днів) |
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M2S090TS-1FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x13.5) Architecture: MCU, FPGA Flash Size: 512KB |
на замовлення 528 шт: термін постачання 21-31 дні (днів) |
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M2S150-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150-FCVG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FBGA (19x19) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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M2S150T-1FC1152M | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 1152BGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -55°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-1FCG1152M | Microchip Technology | Description: IC SOC CORTEX-M3 166MHZ 1152BGA |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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M2S150T-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-FCG1152I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 1152BGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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M2S150T-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150T-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150TS-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150TS-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150TS-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
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M2S150TS-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
товар відсутній |
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M2S150TS-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
товар відсутній |
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M2S150TS-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
товар відсутній |
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M2S150TS-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
товар відсутній |
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M2S150TS-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
товар відсутній |
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MAQ5300-3.0YML-TR | Microchip Technology | Description: IC REG LDO 3V 0.3A 6DFN |
товар відсутній |
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MAQ5300-3.0YML-TR | Microchip Technology | Description: IC REG LDO 3V 0.3A 6DFN |
товар відсутній |
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ATMEGA328PB-XMINI | Microchip Technology |
Description: ATMEGA328PB XPLAINED MINI BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: AVR Board Type: Evaluation Platform Utilized IC / Part: ATmega328PB Platform: ATmega328PB Xplained Mini Part Status: Active |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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MTCH102T-I/MS | Microchip Technology |
Description: IC PROXIMITY DETECTOR 8MSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 2 Supplier Device Package: 8-MSOP Proximity Detection: Yes LED Driver Channels: Up to 2 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MTCH102T-I/MU | Microchip Technology |
Description: IC PROXIMITY DETECTOR 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UDFN Exposed Pad Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 2 Supplier Device Package: 8-UDFN (3x3) Proximity Detection: Yes LED Driver Channels: Up to 2 Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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MTCH105T-I/ST | Microchip Technology |
Description: IC PROXIMITY DETECTOR 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 5 Supplier Device Package: 14-TSSOP Proximity Detection: Yes LED Driver Channels: Up to 5 Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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MTCH108T-I/GZ | Microchip Technology |
Description: IC PROXIMITY DETECTOR 20UQFN Packaging: Tape & Reel (TR) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 8 Supplier Device Package: 20-UQFN (4x4) Proximity Detection: Yes LED Driver Channels: Up to 8 Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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MTCH108T-I/SS | Microchip Technology |
Description: IC PROXIMITY DETECTOR 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: Open Drain Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.05V ~ 3.6V Current - Supply: 80mA Number of Inputs: Up to 8 Supplier Device Package: 20-SSOP Proximity Detection: Yes LED Driver Channels: Up to 8 DigiKey Programmable: Not Verified |
на замовлення 1600 шт: термін постачання 21-31 дні (днів) |
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ATSAML21-XPRO-B | Microchip Technology |
Description: SAM L21 XPLAINED PRO ATSAML21 Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: ATSAML21 Platform: SAM L21 Xplained Pro Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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JAN1N1190 | Microchip Technology | Description: DIODE GEN PURP 600V 35A DO5 |
товар відсутній |
M2S025TS-VF400 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S025TS-VF400I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S025TS-VFG400 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025T-VF256 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025T-VFG256 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025-VF256 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025-VF256I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025-VF400I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025-VFG256 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
M2S025-VFG256I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 144 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6141.97 грн |
100+ | 5828.19 грн |
M2S050-FCSG325I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 139 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7802.33 грн |
M2S050T-FG484I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
товар відсутній
M2S050TS-VF400 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S050TS-VF400I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S050-VF400I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S060-1FCSG325I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 176 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8736.33 грн |
M2S060-FCSG325I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 467 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7802.33 грн |
M2S060T-1FGG484I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12241.85 грн |
M2S060TS-VF400 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S060TS-VF400I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
M2S090-FGG484I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 119 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 17269.3 грн |
M2S090TS-1FCS325I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
на замовлення 528 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 15962.85 грн |
M2S150-1FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-1FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-1FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-1FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150-FCVG484I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 26496.53 грн |
M2S150T-1FC1152M |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-1FCG1152M |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
на замовлення 24 шт:
термін постачання 21-31 дні (днів)M2S150T-1FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-1FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-1FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-1FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-FCG1152I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 31564.65 грн |
M2S150T-FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150T-FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-1FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-1FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-1FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-1FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-FCS536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-FCS536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-FCSG536 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
M2S150TS-FCSG536I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
MAQ5300-3.0YML-TR |
Виробник: Microchip Technology
Description: IC REG LDO 3V 0.3A 6DFN
Description: IC REG LDO 3V 0.3A 6DFN
товар відсутній
MAQ5300-3.0YML-TR |
Виробник: Microchip Technology
Description: IC REG LDO 3V 0.3A 6DFN
Description: IC REG LDO 3V 0.3A 6DFN
товар відсутній
ATMEGA328PB-XMINI |
Виробник: Microchip Technology
Description: ATMEGA328PB XPLAINED MINI BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328PB
Platform: ATmega328PB Xplained Mini
Part Status: Active
Description: ATMEGA328PB XPLAINED MINI BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328PB
Platform: ATmega328PB Xplained Mini
Part Status: Active
на замовлення 110 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1019.62 грн |
MTCH102T-I/MS |
Виробник: Microchip Technology
Description: IC PROXIMITY DETECTOR 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-MSOP
Proximity Detection: Yes
LED Driver Channels: Up to 2
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-MSOP
Proximity Detection: Yes
LED Driver Channels: Up to 2
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 49.61 грн |
MTCH102T-I/MU |
Виробник: Microchip Technology
Description: IC PROXIMITY DETECTOR 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-UDFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 2
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 2
Supplier Device Package: 8-UDFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 2
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MTCH105T-I/ST |
Виробник: Microchip Technology
Description: IC PROXIMITY DETECTOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 5
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 5
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 5
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 5
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 60.7 грн |
MTCH108T-I/GZ |
Виробник: Microchip Technology
Description: IC PROXIMITY DETECTOR 20UQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-UQFN (4x4)
Proximity Detection: Yes
LED Driver Channels: Up to 8
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 20UQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-UQFN (4x4)
Proximity Detection: Yes
LED Driver Channels: Up to 8
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MTCH108T-I/SS |
Виробник: Microchip Technology
Description: IC PROXIMITY DETECTOR 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 8
DigiKey Programmable: Not Verified
Description: IC PROXIMITY DETECTOR 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Open Drain
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.05V ~ 3.6V
Current - Supply: 80mA
Number of Inputs: Up to 8
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 8
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1600+ | 67.88 грн |
ATSAML21-XPRO-B |
Виробник: Microchip Technology
Description: SAM L21 XPLAINED PRO ATSAML21
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATSAML21
Platform: SAM L21 Xplained Pro
Part Status: Active
Description: SAM L21 XPLAINED PRO ATSAML21
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATSAML21
Platform: SAM L21 Xplained Pro
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6714.93 грн |