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M2S025-FCS325I M2S025-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325 M2S025-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325I M2S025-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 91 шт:
термін постачання 21-31 дні (днів)
1+5448.98 грн
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M2S025T-1FCS325 M2S025T-1FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCS325I M2S025T-1FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325 M2S025T-1FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325I M2S025T-1FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325 M2S025T-FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325I M2S025T-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325 M2S025T-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325I M2S025T-FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCS325 M2S025TS-1FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCSG325 M2S025TS-1FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325 M2S025TS-FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325I M2S025TS-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325 M2S025TS-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325I M2S025TS-FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-VF400 M2S025TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VF400I M2S025TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VFG400 M2S025TS-VFG400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VF256 M2S025T-VF256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VFG256 M2S025T-VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256 M2S025-VF256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256I M2S025-VF256I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF400I M2S025-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256 M2S025-VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256I M2S025-VFG256I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
1+6636.87 грн
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M2S050-FCSG325I M2S050-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
1+8431.49 грн
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M2S050T-FG484I M2S050T-FG484I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 484FBGA
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M2S050TS-VF400 M2S050TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050TS-VF400I M2S050TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050-VF400I M2S050-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060-1FCSG325I M2S060-1FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 166 шт:
термін постачання 21-31 дні (днів)
1+9441.32 грн
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M2S060-FCSG325I M2S060-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 774 шт:
термін постачання 21-31 дні (днів)
1+8431.49 грн
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M2S060T-1FGG484I M2S060T-1FGG484I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
1+13229.22 грн
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M2S060TS-VF400 M2S060TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060TS-VF400I M2S060TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S090-FGG484I M2S090-FGG484I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+18661.71 грн
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M2S090TS-1FCS325I M2S090TS-1FCS325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
1+17250.42 грн
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M2S150-1FCS536 M2S150-1FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCS536I M2S150-1FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536 M2S150-1FCSG536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536I M2S150-1FCSG536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536 M2S150-FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536I M2S150-FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCSG536 M2S150-FCSG536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCSG536I M2S150-FCSG536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCVG484I M2S150-FCVG484I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+28633.09 грн
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M2S150T-1FC1152M M2S150T-1FC1152M Microchip Technology 134729-ds0120-military-grade-igloo2-fpga-and-smartfusion2-soc-fpga-datasheet Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCG1152M M2S150T-1FCG1152M Microchip Technology 134729-ds0120-military-grade-igloo2-fpga-and-smartfusion2-soc-fpga-datasheet Description: IC SOC CORTEX-M3 166MHZ 1152BGA
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
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M2S150T-1FCS536 M2S150T-1FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCS536I M2S150T-1FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCSG536 M2S150T-1FCSG536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCSG536I M2S150T-1FCSG536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCG1152I M2S150T-FCG1152I Microchip Technology Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+37806.50 грн
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M2S150T-FCS536 M2S150T-FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товару немає в наявності
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M2S150T-FCS536I M2S150T-FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCSG536 M2S150T-FCSG536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCSG536I M2S150T-FCSG536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150TS-1FCS536 M2S150TS-1FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S025-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S025-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 91 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5448.98 грн
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M2S025T-1FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-1FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-1FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VFG400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VFG400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VF256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-VF256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S025-VFG256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6636.87 грн
В кошику  од. на суму  грн.
M2S050-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S050-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8431.49 грн
В кошику  од. на суму  грн.
M2S050T-FG484I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050T-FG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
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M2S050TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060-1FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060-1FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 166 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9441.32 грн
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M2S060-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 774 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8431.49 грн
В кошику  од. на суму  грн.
M2S060T-1FGG484I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060T-1FGG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13229.22 грн
В кошику  од. на суму  грн.
M2S060TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S060TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S060TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S090-FGG484I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S090-FGG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+18661.71 грн
В кошику  од. на суму  грн.
M2S090TS-1FCS325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S090TS-1FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+17250.42 грн
В кошику  од. на суму  грн.
M2S150-1FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCSG536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCSG536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCSG536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCSG536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCSG536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCSG536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCVG484I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S150-FCVG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FBGA (19x19)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+28633.09 грн
В кошику  од. на суму  грн.
M2S150T-1FC1152M 134729-ds0120-military-grade-igloo2-fpga-and-smartfusion2-soc-fpga-datasheet
M2S150T-1FC1152M
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -55°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCG1152M 134729-ds0120-military-grade-igloo2-fpga-and-smartfusion2-soc-fpga-datasheet
M2S150T-1FCG1152M
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
M2S150T-1FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-1FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-1FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCSG536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-1FCSG536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-1FCSG536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-1FCSG536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCG1152I
M2S150T-FCG1152I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+37806.50 грн
В кошику  од. на суму  грн.
M2S150T-FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCSG536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-FCSG536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150T-FCSG536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150T-FCSG536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150TS-1FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150TS-1FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
товару немає в наявності
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