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M2S010-TQG144 M2S010-TQG144 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Supplier Device Package: 144-TQFP (20x20)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 106 шт:
термін постачання 21-31 дні (днів)
1+2573.27 грн
100+2441.91 грн
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M2S010-TQG144I M2S010-TQG144I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Supplier Device Package: 144-TQFP (20x20)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 386 шт:
термін постачання 21-31 дні (днів)
1+2680.39 грн
100+2542.73 грн
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M2S010TS-1VFG256I M2S010TS-1VFG256I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 1046 шт:
термін постачання 21-31 дні (днів)
1+4100.15 грн
100+3891.96 грн
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M2S010TS-VF400 M2S010TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S010TS-VF400I M2S010TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S010T-VFG256 M2S010T-VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
1+2931.12 грн
В кошику  од. на суму  грн.
M2S010-VFG256 M2S010-VFG256 Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 224 шт:
термін постачання 21-31 дні (днів)
1+2648.56 грн
100+2513.81 грн
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M2S010-VFG256I M2S010-VFG256I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 145 шт:
термін постачання 21-31 дні (днів)
1+3264.13 грн
100+3097.26 грн
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M2S025-1FCS325 M2S025-1FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCS325I M2S025-1FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCSG325 M2S025-1FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCSG325I M2S025-1FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1VF256 M2S025-1VF256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1VFG256 M2S025-1VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCS325 M2S025-FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCS325I M2S025-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325 M2S025-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325I M2S025-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 199 шт:
термін постачання 21-31 дні (днів)
1+5223.39 грн
100+4956.64 грн
В кошику  од. на суму  грн.
M2S025T-1FCS325 M2S025T-1FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCS325I M2S025T-1FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325 M2S025T-1FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325I M2S025T-1FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325 M2S025T-FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325I M2S025T-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325 M2S025T-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325I M2S025T-FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCS325 M2S025TS-1FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCSG325 M2S025TS-1FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325 M2S025TS-FCS325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325I M2S025TS-FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325 M2S025TS-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325I M2S025TS-FCSG325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-VF400 M2S025TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VF400I M2S025TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VFG400 M2S025TS-VFG400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VF256 M2S025T-VF256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VFG256 M2S025T-VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256 M2S025-VF256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256I M2S025-VF256I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF400I M2S025-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256 M2S025-VFG256 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256I M2S025-VFG256I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
1+6362.14 грн
100+6037.09 грн
В кошику  од. на суму  грн.
M2S050-FCSG325I M2S050-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
1+8081.54 грн
В кошику  од. на суму  грн.
M2S050T-FG484I M2S050T-FG484I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 484FBGA
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M2S050TS-VF400 M2S050TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050TS-VF400I M2S050TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050-VF400I M2S050-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060-1FCSG325I M2S060-1FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
1+9813.35 грн
В кошику  од. на суму  грн.
M2S060-FCSG325I M2S060-FCSG325I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 790 шт:
термін постачання 21-31 дні (днів)
1+8081.54 грн
В кошику  од. на суму  грн.
M2S060T-1FGG484I M2S060T-1FGG484I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
1+12680.82 грн
В кошику  од. на суму  грн.
M2S060TS-VF400 M2S060TS-VF400 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060TS-VF400I M2S060TS-VF400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S090-FGG484I M2S090-FGG484I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
1+17888.68 грн
В кошику  од. на суму  грн.
M2S090TS-1FCS325I M2S090TS-1FCS325I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
на замовлення 599 шт:
термін постачання 21-31 дні (днів)
1+17481.15 грн
В кошику  од. на суму  грн.
M2S150-1FCS536 M2S150-1FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCS536I M2S150-1FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536 M2S150-1FCSG536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536I M2S150-1FCSG536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536 M2S150-FCS536 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536I M2S150-FCS536I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S010-TQG144 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S010-TQG144
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Supplier Device Package: 144-TQFP (20x20)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 106 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2573.27 грн
100+2441.91 грн
В кошику  од. на суму  грн.
M2S010-TQG144I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S010-TQG144I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Supplier Device Package: 144-TQFP (20x20)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 386 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2680.39 грн
100+2542.73 грн
В кошику  од. на суму  грн.
M2S010TS-1VFG256I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S010TS-1VFG256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 1046 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4100.15 грн
100+3891.96 грн
В кошику  од. на суму  грн.
M2S010TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S010TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S010TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S010TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S010T-VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S010T-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2931.12 грн
В кошику  од. на суму  грн.
M2S010-VFG256 IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S010-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 224 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2648.56 грн
100+2513.81 грн
В кошику  од. на суму  грн.
M2S010-VFG256I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S010-VFG256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 145 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3264.13 грн
100+3097.26 грн
В кошику  од. на суму  грн.
M2S025-1FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1VF256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1VF256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-1VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-1VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S025-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 199 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5223.39 грн
100+4956.64 грн
В кошику  од. на суму  грн.
M2S025T-1FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-1FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-1FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-1FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-1FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-1FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCS325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCSG325
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-FCSG325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025TS-VFG400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025TS-VFG400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VF256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-VF256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025T-VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025T-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF256I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S025-VFG256
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
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M2S025-VFG256I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S025-VFG256I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6362.14 грн
100+6037.09 грн
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M2S050-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S050-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8081.54 грн
В кошику  од. на суму  грн.
M2S050T-FG484I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050T-FG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
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M2S050TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S050-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S050-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060-1FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060-1FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9813.35 грн
В кошику  од. на суму  грн.
M2S060-FCSG325I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060-FCSG325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
на замовлення 790 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8081.54 грн
В кошику  од. на суму  грн.
M2S060T-1FGG484I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S060T-1FGG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12680.82 грн
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M2S060TS-VF400 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S060TS-VF400
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S060TS-VF400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S060TS-VF400I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S090-FGG484I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S090-FGG484I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+17888.68 грн
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M2S090TS-1FCS325I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S090TS-1FCS325I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
на замовлення 599 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+17481.15 грн
В кошику  од. на суму  грн.
M2S150-1FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCSG536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-1FCSG536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-1FCSG536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCS536
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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M2S150-FCS536I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2S150-FCS536I
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
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