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JAN1N4977C JAN1N4977C Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 62V 5W E AXIAL
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93LC56-I/SL 93LC56-I/SL Microchip Technology MCHPS00073-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 2KBIT MICROWIRE 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 14-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Microwire
Access Time: 500 ns
Memory Organization: 128 x 16, 256 x 8
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK169-V/HF PIC32MZ1064DAK169-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK169T-V/HF PIC32MZ1064DAK169T-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK176-V/2J PIC32MZ1064DAK176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK176T-V/2J PIC32MZ1064DAK176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL169-V/HF PIC32MZ1064DAL169-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
1+1307.98 грн
25+1153.83 грн
100+1045.90 грн
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PIC32MZ1064DAL169T-V/HF PIC32MZ1064DAL169T-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAL176-V/2J PIC32MZ1064DAL176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL176T-V/2J PIC32MZ1064DAL176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169-V/6J PIC32MZ1064DAR169-V/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169T-V/6J PIC32MZ1064DAR169T-V/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR176-V/2J PIC32MZ1064DAR176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAR176T-V/2J PIC32MZ1064DAR176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAS176T-V/2J PIC32MZ1064DAS176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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AT91SAM7X128C-CUR AT91SAM7X128C-CUR Microchip Technology Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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AT91SAM7X128C-CUR AT91SAM7X128C-CUR Microchip Technology Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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SY89250VMG-TR SY89250VMG-TR Microchip Technology sy89250v.pdf Description: IC RCVR/BUFFER PECL/ECL 8-MLF
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad, 8-MLF®
Mounting Type: Surface Mount
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-MLF® (2x2)
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
75+289.90 грн
Мінімальне замовлення: 75
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MIC6315-42D3UY-TR MIC6315-42D3UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+30.52 грн
Мінімальне замовлення: 3000
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MIC6315-42D3UY-TR MIC6315-42D3UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 6725 шт:
термін постачання 21-31 дні (днів)
8+40.34 грн
25+32.26 грн
100+29.39 грн
Мінімальне замовлення: 8
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SPNY801037 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
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SPNY801039 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
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SPNY801049 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
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SPNY801068 Microchip Technology Description: IC ETHERNET SWITCH SMD
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MX574EBH20M0000 Microchip Technology MX574EBH20M0000.pdf Description: OSC 20MHZ LVCMOS
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MX574EBH20M0000-TR Microchip Technology MX574EBH20M0000.pdf Description: 20MHZ LVCMOS
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MXRT100KP260CA MXRT100KP260CA Microchip Technology 77294-mrt100kp-pdf Description: TVS DIODE 260VWM 512VC CASE 5A
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ATSAMD51J20A-AU-EFP ATSAMD51J20A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
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ATSAMD51J20A-AUT-EFP ATSAMD51J20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAMD51J20A-AUT-EFP ATSAMD51J20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-AU-EFP ATSAME53J20A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
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PIC32MZ1025W104132-I/NX PIC32MZ1025W104132-I/NX Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
1+345.35 грн
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ATSAM4C16CA-AUR ATSAM4C16CA-AUR Microchip Technology SAM4C-Series-DS60001717.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)
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ATSAM4CMS32CA-AUR ATSAM4CMS32CA-AUR Microchip Technology Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
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ATSAM4CMS32CA-AUR ATSAM4CMS32CA-AUR Microchip Technology Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)
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1N5811E3 1N5811E3 Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
1+613.24 грн
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1N5811E3/TR 1N5811E3/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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1N5811USE3/TR 1N5811USE3/TR Microchip Technology Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
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JAN1N5811/TR JAN1N5811/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JAN1N5811US/TR JAN1N5811US/TR Microchip Technology Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANHCE1N5811 Microchip Technology Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANKCE1N5811 Microchip Technology Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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JANS1N5811/TR JANS1N5811/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Grade: Military
Qualification: MIL-PRF-19500/477
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JANS1N5811US/TR JANS1N5811US/TR Microchip Technology Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Grade: Military
Qualification: MIL-PRF-19500/477
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JANTX1N5811US/TR JANTX1N5811US/TR Microchip Technology Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANTXV1N5811/TR JANTXV1N5811/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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DM240017 DM240017 Microchip Technology 40001806G.pdf Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
1+5724.12 грн
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DM240415-2 Microchip Technology Description: ACCESSORY DEVELOPMENT START KIT
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MA240040 MA240040 Microchip Technology PIC24FJ128GL306_General_Purpose_PIM_Information_Sheet.pdf Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+2979.06 грн
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PIC24FJ1024GA610-E/BG PIC24FJ1024GA610-E/BG Microchip Technology Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Number of I/O: 85
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC24FJ1024GA610-E/PT PIC24FJ1024GA610-E/PT Microchip Technology Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC24FJ1024GB610-E/BG PIC24FJ1024GB610-E/BG Microchip Technology Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ1024GB610-E/PT PIC24FJ1024GB610-E/PT Microchip Technology Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GA610-E/BG PIC24FJ128GA610-E/BG Microchip Technology Description: IC MCU 16BIT 128KB FLSH 121TFBGA
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MXPLAD15KP60Ae3 Microchip Technology 9522-mplad15kp-datasheet Description: TVS DIODE 60VWM 96.8VC PLAD
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ATTINY261-15MD ATTINY261-15MD Microchip Technology atmel-7753-automotive-microcontrollers-attiny261-461-861_datasheet.pdf Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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ATTINY261-15MD ATTINY261-15MD Microchip Technology atmel-7753-automotive-microcontrollers-attiny261-461-861_datasheet.pdf Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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AC244049 AC244049 Microchip Technology Description: PIC12F752 PROCESSOR EXT PAK
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AC244050 AC244050 Microchip Technology Description: PIC12HV752 PROCESSOR EXT PAK
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SW500024 Microchip Technology Description: CCS C COMPILER IDE
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
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JAN1N4977C 10913-sa5-37-datasheet
JAN1N4977C
Виробник: Microchip Technology
Description: DIODE ZENER 62V 5W E AXIAL
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93LC56-I/SL MCHPS00073-1.pdf?t.download=true&u=5oefqw
93LC56-I/SL
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 14-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Microwire
Access Time: 500 ns
Memory Organization: 128 x 16, 256 x 8
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK169-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK169-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK169T-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK169T-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL169-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL169-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1307.98 грн
25+1153.83 грн
100+1045.90 грн
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PIC32MZ1064DAL169T-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL169T-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAL176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169-V/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR169-V/6J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169T-V/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR169T-V/6J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAR176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAS176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAS176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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AT91SAM7X128C-CUR Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf
AT91SAM7X128C-CUR
Виробник: Microchip Technology
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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AT91SAM7X128C-CUR Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf
AT91SAM7X128C-CUR
Виробник: Microchip Technology
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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SY89250VMG-TR sy89250v.pdf
SY89250VMG-TR
Виробник: Microchip Technology
Description: IC RCVR/BUFFER PECL/ECL 8-MLF
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad, 8-MLF®
Mounting Type: Surface Mount
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-MLF® (2x2)
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
75+289.90 грн
Мінімальне замовлення: 75
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MIC6315-42D3UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-42D3UY-TR
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+30.52 грн
Мінімальне замовлення: 3000
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MIC6315-42D3UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-42D3UY-TR
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 6725 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+40.34 грн
25+32.26 грн
100+29.39 грн
Мінімальне замовлення: 8
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SPNY801037
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
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SPNY801039
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
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SPNY801049
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
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SPNY801068
Виробник: Microchip Technology
Description: IC ETHERNET SWITCH SMD
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MX574EBH20M0000 MX574EBH20M0000.pdf
Виробник: Microchip Technology
Description: OSC 20MHZ LVCMOS
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MX574EBH20M0000-TR MX574EBH20M0000.pdf
Виробник: Microchip Technology
Description: 20MHZ LVCMOS
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MXRT100KP260CA 77294-mrt100kp-pdf
MXRT100KP260CA
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 512VC CASE 5A
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ATSAMD51J20A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AU-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
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ATSAMD51J20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAMD51J20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-AU-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
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PIC32MZ1025W104132-I/NX PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
PIC32MZ1025W104132-I/NX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+345.35 грн
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ATSAM4C16CA-AUR SAM4C-Series-DS60001717.pdf
ATSAM4C16CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)
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ATSAM4CMS32CA-AUR Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf
ATSAM4CMS32CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
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ATSAM4CMS32CA-AUR Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf
ATSAM4CMS32CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)
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1N5811E3 123509-lds-0168-datasheet
1N5811E3
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+613.24 грн
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1N5811E3/TR 123509-lds-0168-datasheet
1N5811E3/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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1N5811USE3/TR
1N5811USE3/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
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JAN1N5811/TR 123509-lds-0168-datasheet
JAN1N5811/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JAN1N5811US/TR
JAN1N5811US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANHCE1N5811
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANKCE1N5811
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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JANS1N5811/TR 123509-lds-0168-datasheet
JANS1N5811/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Grade: Military
Qualification: MIL-PRF-19500/477
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JANS1N5811US/TR
JANS1N5811US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Grade: Military
Qualification: MIL-PRF-19500/477
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JANTX1N5811US/TR
JANTX1N5811US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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JANTXV1N5811/TR 123509-lds-0168-datasheet
JANTXV1N5811/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Grade: Military
Qualification: MIL-PRF-19500/477
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DM240017 40001806G.pdf
DM240017
Виробник: Microchip Technology
Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5724.12 грн
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DM240415-2
Виробник: Microchip Technology
Description: ACCESSORY DEVELOPMENT START KIT
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MA240040 PIC24FJ128GL306_General_Purpose_PIM_Information_Sheet.pdf
MA240040
Виробник: Microchip Technology
Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2979.06 грн
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PIC24FJ1024GA610-E/BG
PIC24FJ1024GA610-E/BG
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Number of I/O: 85
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC24FJ1024GA610-E/PT
PIC24FJ1024GA610-E/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC24FJ1024GB610-E/BG
PIC24FJ1024GB610-E/BG
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ1024GB610-E/PT
PIC24FJ1024GB610-E/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GA610-E/BG
PIC24FJ128GA610-E/BG
Виробник: Microchip Technology
Description: IC MCU 16BIT 128KB FLSH 121TFBGA
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MXPLAD15KP60Ae3 9522-mplad15kp-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC PLAD
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ATTINY261-15MD atmel-7753-automotive-microcontrollers-attiny261-461-861_datasheet.pdf
ATTINY261-15MD
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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ATTINY261-15MD atmel-7753-automotive-microcontrollers-attiny261-461-861_datasheet.pdf
ATTINY261-15MD
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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AC244049
AC244049
Виробник: Microchip Technology
Description: PIC12F752 PROCESSOR EXT PAK
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AC244050
AC244050
Виробник: Microchip Technology
Description: PIC12HV752 PROCESSOR EXT PAK
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SW500024
Виробник: Microchip Technology
Description: CCS C COMPILER IDE
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
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