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MSASC100W100H Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
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MSASC100W100HR Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
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LND150N3-G-P002 LND150N3-G-P002 Microchip Technology LND150%20C041114.pdf Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Tape & Reel (TR)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
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LND150N3-G-P002 LND150N3-G-P002 Microchip Technology LND150%20C041114.pdf Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
на замовлення 1804 шт:
термін постачання 21-31 дні (днів)
7+47.10 грн
25+36.62 грн
Мінімальне замовлення: 7
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24LC512T-E/SN 24LC512T-E/SN Microchip Technology 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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24LC512T-E/SN 24LC512T-E/SN Microchip Technology 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
на замовлення 432 шт:
термін постачання 21-31 дні (днів)
3+142.86 грн
Мінімальне замовлення: 3
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ST6020A Microchip Technology Description: DIODE GEN PURP 200V 40A TO204AD
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
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ST6020D Microchip Technology Description: STD RECTIFIER
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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ST6020 Microchip Technology Description: DIODE GEN PURP 200V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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ATMEGA168PB-ANR ATMEGA168PB-ANR Microchip Technology ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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ATMEGA168PB-ANR ATMEGA168PB-ANR Microchip Technology ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
на замовлення 1525 шт:
термін постачання 21-31 дні (днів)
3+112.25 грн
25+99.02 грн
100+89.72 грн
Мінімальне замовлення: 3
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VC-801-EAE-KAAN-60M0000000 Microchip Technology 1243787-vc-801 Description: VC-801-EAE-KAAN-60M0000000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 30mA
Height - Seated (Max): 0.055" (1.40mm)
Part Status: Active
Frequency: 60 MHz
Base Resonator: Crystal
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dsPIC33EP128MU206-H/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-H/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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MXLPLAD30KP33Ae3 Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 33VWM 53.3VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 564A
Voltage - Reverse Standoff (Typ): 33V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 36.7V
Voltage - Clamping (Max) @ Ipp: 53.3V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Part Status: Active
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MASMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MSMCG30CAe3 MSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXSMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXLSMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXLSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MASMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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24AA256T-E/SN 24AA256T-E/SN Microchip Technology 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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24AA256T-E/SN 24AA256T-E/SN Microchip Technology 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
на замовлення 2449 шт:
термін постачання 21-31 дні (днів)
4+79.28 грн
25+72.90 грн
100+72.02 грн
Мінімальне замовлення: 4
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SM0502-M1 Microchip Technology 11207-sm0500-sm1000-series-datasheet Description: RF DIODE PIN 500V M1
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0512-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0509-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0504-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0512MR-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0502-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1002-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 200mOhm @ 200mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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GC4432-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
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SM0504-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1001-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0812-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0508-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.9pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0508-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.9pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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GC4432-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tray
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
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SM0512-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1001-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0509-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0504-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0502-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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PIC16F18056-I/STX PIC16F18056-I/STX Microchip Technology PIC16F18056-76-28-40-Pin-Microcontroller-Data-Sheet-40002325B.pdf Description: IC MCU 8BIT 28KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1062 шт:
термін постачання 21-31 дні (днів)
4+90.27 грн
25+80.13 грн
100+71.97 грн
Мінімальне замовлення: 4
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MIC29501-3.3BU TR MIC29501-3.3BU TR Microchip Technology MIC2915x-30x-50x-75x-High-Current-Low-Dropout-Regulators-DS20005685B.pdf Description: IC REG LINEAR 3.3V 5A TO263-5
Packaging: Tape & Reel (TR)
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 26V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
Voltage Dropout (Max): 0.6V @ 5A
Protection Features: Over Current, Over Temperature, Reverse Polarity, Transient Voltage
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25AA160B-I/WF15K Microchip Technology 21807D.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160A-I/S15K Microchip Technology 21807D.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160A-I/W15K Microchip Technology 21807D.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160D-I/WF16K Microchip Technology 22150B.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160B-I/S15K Microchip Technology 21807D.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160D-I/S16K Microchip Technology 22150B.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160A-I/WF15K Microchip Technology 21807D.pdf Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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MSASC100W100H
Виробник: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
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MSASC100W100HR
Виробник: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
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LND150N3-G-P002 LND150%20C041114.pdf
LND150N3-G-P002
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Tape & Reel (TR)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
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LND150N3-G-P002 LND150%20C041114.pdf
LND150N3-G-P002
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
на замовлення 1804 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+47.10 грн
25+36.62 грн
Мінімальне замовлення: 7
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24LC512T-E/SN 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf
24LC512T-E/SN
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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24LC512T-E/SN 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf
24LC512T-E/SN
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
на замовлення 432 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+142.86 грн
Мінімальне замовлення: 3
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ST6020A
Виробник: Microchip Technology
Description: DIODE GEN PURP 200V 40A TO204AD
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
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ST6020D
Виробник: Microchip Technology
Description: STD RECTIFIER
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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ST6020
Виробник: Microchip Technology
Description: DIODE GEN PURP 200V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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ATMEGA168PB-ANR ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf
ATMEGA168PB-ANR
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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ATMEGA168PB-ANR ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf
ATMEGA168PB-ANR
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
на замовлення 1525 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+112.25 грн
25+99.02 грн
100+89.72 грн
Мінімальне замовлення: 3
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VC-801-EAE-KAAN-60M0000000 1243787-vc-801
Виробник: Microchip Technology
Description: VC-801-EAE-KAAN-60M0000000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 30mA
Height - Seated (Max): 0.055" (1.40mm)
Part Status: Active
Frequency: 60 MHz
Base Resonator: Crystal
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dsPIC33EP128MU206-H/PT
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/MR
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/MR
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-H/MR
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/PT
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/MR
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/PT
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/PT
Виробник: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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MXLPLAD30KP33Ae3 9523-mplad30kp-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 33VWM 53.3VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 564A
Voltage - Reverse Standoff (Typ): 33V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 36.7V
Voltage - Clamping (Max) @ Ipp: 53.3V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Part Status: Active
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MASMCG30CAe3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MSMCG30CAe3 10561-msmc-datasheet
MSMCG30CAe3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXSMCG30CAe3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXSMCG30CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXLSMCG30CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MXLSMCG30CAe3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MASMCG30CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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24AA256T-E/SN 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf
24AA256T-E/SN
Виробник: Microchip Technology
Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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24AA256T-E/SN 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf
24AA256T-E/SN
Виробник: Microchip Technology
Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
на замовлення 2449 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+79.28 грн
25+72.90 грн
100+72.02 грн
Мінімальне замовлення: 4
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SM0502-M1 11207-sm0500-sm1000-series-datasheet
Виробник: Microchip Technology
Description: RF DIODE PIN 500V M1
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0512-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0509-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0504-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0512MR-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0502-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1002-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 200mOhm @ 200mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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GC4432-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
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SM0504-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1001-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0812-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0508-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.9pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0508-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.9pF @ 50V, 1MHz
Resistance @ If, F: 400mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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GC4432-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tray
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
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SM0512-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1001-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 700V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0509-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0504-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0502-M1/TR
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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PIC16F18056-I/STX PIC16F18056-76-28-40-Pin-Microcontroller-Data-Sheet-40002325B.pdf
PIC16F18056-I/STX
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1062 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+90.27 грн
25+80.13 грн
100+71.97 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
MIC29501-3.3BU TR MIC2915x-30x-50x-75x-High-Current-Low-Dropout-Regulators-DS20005685B.pdf
MIC29501-3.3BU TR
Виробник: Microchip Technology
Description: IC REG LINEAR 3.3V 5A TO263-5
Packaging: Tape & Reel (TR)
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 26V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
Voltage Dropout (Max): 0.6V @ 5A
Protection Features: Over Current, Over Temperature, Reverse Polarity, Transient Voltage
товару немає в наявності
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25AA160B-I/WF15K 21807D.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160A-I/S15K 21807D.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160A-I/W15K 21807D.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160D-I/WF16K 22150B.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160B-I/S15K 21807D.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
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25AA160D-I/S16K 22150B.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
товару немає в наявності
В кошику  од. на суму  грн.
25AA160A-I/WF15K 21807D.pdf
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 10MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: Die
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
товару немає в наявності
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