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ATTINY461-20MU ATTINY461-20MU Microchip Technology Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf Description: IC MCU 8BIT 4KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 16
DigiKey Programmable: Verified
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
2+181.44 грн
25+159.92 грн
100+144.52 грн
Мінімальне замовлення: 2
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JANTXV1N3822A-1 JANTXV1N3822A-1 Microchip Technology 5797-1n3821a-3828a-datasheet Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
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MSMLJ150A MSMLJ150A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 150VWM 243VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30A MSMBG30A Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30Ae3 MSMBG30Ae3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30CA MSMBG30CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30CAe3 MSMBG30CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30CA MASMBG30CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30CAe3 MASMBG30CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30A MASMBG30A Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30Ae3 MASMBG30Ae3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30A/TR Microchip Technology Description: TVS 30V 5% 600W UNI
Packaging: Tape & Reel (TR)
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30A MXLSMBG30A Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30CA MXLSMBG30CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30CAe3 MXLSMBG30CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXSMBG30CA MXSMBG30CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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Jan2N3418S Jan2N3418S Microchip Technology 124287-lds-0192-1-datasheet Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jan2N3418 Jan2N3418 Microchip Technology 124375-lds-0192-datasheet Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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2N3418S 2N3418S Microchip Technology 124287-lds-0192-1-datasheet Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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2N3418 Microchip Technology 124375-lds-0192-datasheet Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantx2N3418S Jantx2N3418S Microchip Technology 124287-lds-0192-1-datasheet Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantx2N3418 Jantx2N3418 Microchip Technology 124375-lds-0192-datasheet Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantxv2N3418S Jantxv2N3418S Microchip Technology 124287-lds-0192-1-datasheet Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantxv2N3418 Jantxv2N3418 Microchip Technology 124375-lds-0192-datasheet Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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SMDB03/TR7 SMDB03/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 3.3VWM 9VC 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 600pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V
Supplier Device Package: 8-SO
Unidirectional Channels: 4
Voltage - Breakdown (Min): 4V
Voltage - Clamping (Max) @ Ipp: 9V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB03C/TR7 SMDB03C/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 3.3VWM 9VC 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 300pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V
Supplier Device Package: 8-SO
Bidirectional Channels: 4
Voltage - Breakdown (Min): 4V
Voltage - Clamping (Max) @ Ipp: 9V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMLJ18AE3/TR13 SMLJ18AE3/TR13 Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102.8A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMLJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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SMLJ18CAE3/TR13 SMLJ18CAE3/TR13 Microchip Technology Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102.8A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMLJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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1N938A/TR 1N938A/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 9 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DO-35 (DO-204AH)
Power - Max: 500 mW
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CD4581A CD4581A Microchip Technology 8365-cd4565-cd4584a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4581 CD4581 Microchip Technology 8365-cd4565-cd4584a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 75°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4583 CD4583 Microchip Technology 8365-cd4565-cd4584a-datasheet Description: DIODE ZENER 6.4V DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 75°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4583A CD4583A Microchip Technology 8365-cd4565-cd4584a-datasheet Description: DIODE ZENER 6.4V DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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SP6CA3 SP6CA3 Microchip Technology SP6CA3-Driver-Core-Board-SpecSheet-1700V-SP6LI.pdf Description: MODULE ADAPTER BOARD SP6LI - 170
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-17A1HP
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+7260.17 грн
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ATTINY824-XFR ATTINY824-XFR Microchip Technology ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf Description: IC MCU 8BIT 8KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2435 шт:
термін постачання 21-31 дні (днів)
5+70.03 грн
25+61.61 грн
100+55.75 грн
Мінімальне замовлення: 5
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2N6057 2N6057 Microchip Technology Description: TRANS NPN DARL 60V 12A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2V @ 24mA, 6A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 750 @ 6A, 3V
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 150 W
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2N6031 2N6031 Microchip Technology Description: TRANS PNP 140V 16A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 16 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 200 W
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2N6063 Microchip Technology Description: TRANS PNP 100V 50A TO-63
Packaging: Bulk
Package / Case: TO-211MB, TO-63-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-63
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 150 W
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2N6060 Microchip Technology Description: TRANS PNP 100V 50A TO-63
Packaging: Bulk
Package / Case: TO-211MB, TO-63-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Supplier Device Package: TO-63
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 262 W
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JAN1N755A-1 JAN1N755A-1 Microchip Technology Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 5 V
Grade: Military
Qualification: MIL-PRF-19500/127
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PIC18F57K42T-I/PT PIC18F57K42T-I/PT Microchip Technology PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf Description: IC MCU 8BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
1600+180.55 грн
Мінімальне замовлення: 1600
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PIC18F57K42T-I/PT PIC18F57K42T-I/PT Microchip Technology PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf Description: IC MCU 8BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 4238 шт:
термін постачання 21-31 дні (днів)
2+217.26 грн
25+191.46 грн
100+173.87 грн
Мінімальне замовлення: 2
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CD1A60 Microchip Technology 8377-cd5817-cd6759-cd1a20-datasheet Description: DIODE SCHOTTKY 60V 1A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Die
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 60 V
Grade: Military
Qualification: MIL-PRF-19500/586
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R4270TS Microchip Technology Description: STD RECTIFIER
Packaging: Bulk
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PIC18F26Q83-I/5N PIC18F26Q83-I/5N Microchip Technology PIC18F26-46-56Q83-Data-Sheet-40002253C.pdf Description: IC MCU 8BIT 64KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 558 шт:
термін постачання 21-31 дні (днів)
3+119.37 грн
25+105.82 грн
100+102.16 грн
Мінімальне замовлення: 3
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EVB-LAN7430 EVB-LAN7430 Microchip Technology EVB-LAN7430_Web.pdf Description: EVAL BOARD FOR LAN7430
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: LAN7430
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
1+7047.69 грн
В кошику  од. на суму  грн.
AT86RF215IQ-ZU AT86RF215IQ-ZU Microchip Technology Atmel-42415-WIRELESS-AT86RF215_Datasheet.pdf Description: IC RF TXRX 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 389.5MHz ~ 510MHz, 779MHz ~ 1.02GHz, 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 16dBm
Current - Receiving: 5mA ~ 33mA
Data Rate (Max): 2.4Mbps
Current - Transmitting: 62mA ~ 64mA
Supplier Device Package: 48-QFN (7x7)
Modulation: FSK, OFDM, O-QPSK
RF Family/Standard: 802.15.4, General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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M5KP51AE3/TR Microchip Technology Description: TVS DIODE 51VWM 82.4VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60.7A
Voltage - Reverse Standoff (Typ): 51V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 56.7V
Voltage - Clamping (Max) @ Ipp: 82.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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ATR0885-PFQW ATR0885-PFQW Microchip Technology ATR0885_Summary.pdf Description: IC LASER DRVR 5.5V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver (Blu-Ray, CD/DVD)
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 24-QFN (4x4)
Number of Channels: 3
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MCP2021AT-500E/SN MCP2021AT-500E/SN Microchip Technology 20002298C.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-500E/SN MCP2021AT-500E/SN Microchip Technology 20002298C.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-500E/MDVAO MCP2021T-500E/MDVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021-500E/SNVAO MCP2021-500E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-500E/SNVAO MCP2021T-500E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-330E/SNVAO MCP2021T-330E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-500E/MDVAO MCP2021AT-500E/MDVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-330E/SNVAO MCP2021AT-330E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-330E/SNVAO MCP2021A-330E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-500E/SNVAO MCP2021A-500E/SNVAO Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-500E/P MCP2021A-500E/P Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-PDIP
Receiver Hysteresis: 175 mV
Duplex: Half
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ATTINY461-20MU Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf
ATTINY461-20MU
Виробник: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 16
DigiKey Programmable: Verified
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+181.44 грн
25+159.92 грн
100+144.52 грн
Мінімальне замовлення: 2
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JANTXV1N3822A-1 5797-1n3821a-3828a-datasheet
JANTXV1N3822A-1
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
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MSMLJ150A 10563-msml-datasheet
MSMLJ150A
Виробник: Microchip Technology
Description: TVS DIODE 150VWM 243VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30A 10560-msmb-datasheet
MSMBG30A
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30Ae3 10560-msmb-datasheet
MSMBG30Ae3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30CA 10560-msmb-datasheet
MSMBG30CA
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG30CAe3 10560-msmb-datasheet
MSMBG30CAe3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30CA 10560-msmb-datasheet
MASMBG30CA
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30CAe3 10560-msmb-datasheet
MASMBG30CAe3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30A 10560-msmb-datasheet
MASMBG30A
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG30Ae3 10560-msmb-datasheet
MASMBG30Ae3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30A/TR
Виробник: Microchip Technology
Description: TVS 30V 5% 600W UNI
Packaging: Tape & Reel (TR)
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30A 10560-msmb-datasheet
MXLSMBG30A
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30CA 10560-msmb-datasheet
MXLSMBG30CA
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG30CAe3 10560-msmb-datasheet
MXLSMBG30CAe3
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXSMBG30CA 10560-msmb-datasheet
MXSMBG30CA
Виробник: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMBG (DO-215AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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Jan2N3418S 124287-lds-0192-1-datasheet
Jan2N3418S
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jan2N3418 124375-lds-0192-datasheet
Jan2N3418
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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2N3418S 124287-lds-0192-1-datasheet
2N3418S
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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2N3418 124375-lds-0192-datasheet
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantx2N3418S 124287-lds-0192-1-datasheet
Jantx2N3418S
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantx2N3418 124375-lds-0192-datasheet
Jantx2N3418
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantxv2N3418S 124287-lds-0192-1-datasheet
Jantxv2N3418S
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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Jantxv2N3418 124375-lds-0192-datasheet
Jantxv2N3418
Виробник: Microchip Technology
Description: TRANS NPN 60V 3A TO5
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 200mA, 2A
Current - Collector Cutoff (Max): 5µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 2V
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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SMDB03/TR7 132313-smda-datasheet
SMDB03/TR7
Виробник: Microchip Technology
Description: TVS DIODE 3.3VWM 9VC 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 600pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V
Supplier Device Package: 8-SO
Unidirectional Channels: 4
Voltage - Breakdown (Min): 4V
Voltage - Clamping (Max) @ Ipp: 9V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB03C/TR7 132313-smda-datasheet
SMDB03C/TR7
Виробник: Microchip Technology
Description: TVS DIODE 3.3VWM 9VC 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 300pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V
Supplier Device Package: 8-SO
Bidirectional Channels: 4
Voltage - Breakdown (Min): 4V
Voltage - Clamping (Max) @ Ipp: 9V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMLJ18AE3/TR13
SMLJ18AE3/TR13
Виробник: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102.8A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMLJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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SMLJ18CAE3/TR13
SMLJ18CAE3/TR13
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102.8A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMLJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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1N938A/TR
1N938A/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 9 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DO-35 (DO-204AH)
Power - Max: 500 mW
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CD4581A 8365-cd4565-cd4584a-datasheet
CD4581A
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4581 8365-cd4565-cd4584a-datasheet
CD4581
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 75°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4583 8365-cd4565-cd4584a-datasheet
CD4583
Виробник: Microchip Technology
Description: DIODE ZENER 6.4V DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 75°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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CD4583A 8365-cd4565-cd4584a-datasheet
CD4583A
Виробник: Microchip Technology
Description: DIODE ZENER 6.4V DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: Die
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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SP6CA3 SP6CA3-Driver-Core-Board-SpecSheet-1700V-SP6LI.pdf
SP6CA3
Виробник: Microchip Technology
Description: MODULE ADAPTER BOARD SP6LI - 170
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-17A1HP
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7260.17 грн
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ATTINY824-XFR ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf
ATTINY824-XFR
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 2435 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+70.03 грн
25+61.61 грн
100+55.75 грн
Мінімальне замовлення: 5
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2N6057
2N6057
Виробник: Microchip Technology
Description: TRANS NPN DARL 60V 12A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2V @ 24mA, 6A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 750 @ 6A, 3V
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 150 W
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2N6031
2N6031
Виробник: Microchip Technology
Description: TRANS PNP 140V 16A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 16 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 200 W
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2N6063
Виробник: Microchip Technology
Description: TRANS PNP 100V 50A TO-63
Packaging: Bulk
Package / Case: TO-211MB, TO-63-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-63
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 150 W
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2N6060
Виробник: Microchip Technology
Description: TRANS PNP 100V 50A TO-63
Packaging: Bulk
Package / Case: TO-211MB, TO-63-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Supplier Device Package: TO-63
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 262 W
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JAN1N755A-1
JAN1N755A-1
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 5 V
Grade: Military
Qualification: MIL-PRF-19500/127
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PIC18F57K42T-I/PT PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf
PIC18F57K42T-I/PT
Виробник: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+180.55 грн
Мінімальне замовлення: 1600
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PIC18F57K42T-I/PT PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf
PIC18F57K42T-I/PT
Виробник: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 4238 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+217.26 грн
25+191.46 грн
100+173.87 грн
Мінімальне замовлення: 2
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CD1A60 8377-cd5817-cd6759-cd1a20-datasheet
Виробник: Microchip Technology
Description: DIODE SCHOTTKY 60V 1A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Die
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 60 V
Grade: Military
Qualification: MIL-PRF-19500/586
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R4270TS
Виробник: Microchip Technology
Description: STD RECTIFIER
Packaging: Bulk
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PIC18F26Q83-I/5N PIC18F26-46-56Q83-Data-Sheet-40002253C.pdf
PIC18F26Q83-I/5N
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 558 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+119.37 грн
25+105.82 грн
100+102.16 грн
Мінімальне замовлення: 3
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EVB-LAN7430 EVB-LAN7430_Web.pdf
EVB-LAN7430
Виробник: Microchip Technology
Description: EVAL BOARD FOR LAN7430
Packaging: Bulk
Function: Ethernet
Type: Interface
Utilized IC / Part: LAN7430
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7047.69 грн
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AT86RF215IQ-ZU Atmel-42415-WIRELESS-AT86RF215_Datasheet.pdf
AT86RF215IQ-ZU
Виробник: Microchip Technology
Description: IC RF TXRX 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 389.5MHz ~ 510MHz, 779MHz ~ 1.02GHz, 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 16dBm
Current - Receiving: 5mA ~ 33mA
Data Rate (Max): 2.4Mbps
Current - Transmitting: 62mA ~ 64mA
Supplier Device Package: 48-QFN (7x7)
Modulation: FSK, OFDM, O-QPSK
RF Family/Standard: 802.15.4, General ISM < 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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M5KP51AE3/TR
Виробник: Microchip Technology
Description: TVS DIODE 51VWM 82.4VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60.7A
Voltage - Reverse Standoff (Typ): 51V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 56.7V
Voltage - Clamping (Max) @ Ipp: 82.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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ATR0885-PFQW ATR0885_Summary.pdf
ATR0885-PFQW
Виробник: Microchip Technology
Description: IC LASER DRVR 5.5V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver (Blu-Ray, CD/DVD)
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 24-QFN (4x4)
Number of Channels: 3
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MCP2021AT-500E/SN 20002298C.pdf
MCP2021AT-500E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-500E/SN 20002298C.pdf
MCP2021AT-500E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-500E/MDVAO 20002018H.pdf
MCP2021T-500E/MDVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021-500E/SNVAO 20002018H.pdf
MCP2021-500E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-500E/SNVAO 20002018H.pdf
MCP2021T-500E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021T-330E/SNVAO 20002018H.pdf
MCP2021T-330E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-500E/MDVAO 20002018H.pdf
MCP2021AT-500E/MDVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021AT-330E/SNVAO 20002018H.pdf
MCP2021AT-330E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-330E/SNVAO 20002018H.pdf
MCP2021A-330E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-500E/SNVAO 20002018H.pdf
MCP2021A-500E/SNVAO
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MCP2021A-500E/P 20002018H.pdf
MCP2021A-500E/P
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-PDIP
Receiver Hysteresis: 175 mV
Duplex: Half
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