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PIC16F18156T-I/SS PIC16F18156T-I/SS Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
3+116.19 грн
25+102.90 грн
100+93.62 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F17156T-I/STX PIC16F17156T-I/STX Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+96.98 грн
Мінімальне замовлення: 3300
В кошику  од. на суму  грн.
PIC16F17156T-I/STX PIC16F17156T-I/STX Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3+116.98 грн
25+103.30 грн
100+93.39 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F17155T-I/SO PIC16F17155T-I/SO Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1600+96.98 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
PIC16F17155T-I/SO PIC16F17155T-I/SO Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
3+116.98 грн
25+103.30 грн
100+93.39 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC32MZ0512EFE100T-E/GJX PIC32MZ0512EFE100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ0512EFE100T-E/GJX PIC32MZ0512EFE100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CEC1734-S0-I/2HW Microchip Technology CEC173x_Data_Brief.pdf Description: CRYPTO EC WITH SUPPORT FOR ONE A
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
DigiKey Programmable: Not Verified
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PIC16LF15355-I/SO PIC16LF15355-I/SO Microchip Technology PIC16(L)F15354_55%20Data%20Sheet%2040001853C.pdf Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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DSC1123CE1-266.6670T DSC1123CE1-266.6670T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: OSC MEMS AUTO -20C-70C SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 266.667 MHz
Base Resonator: MEMS
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PIC32MZ2064DAL169-I/HF PIC32MZ2064DAL169-I/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1024EFF100T-E/GJX PIC32MZ1024EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ1024EFF100T-E/GJX PIC32MZ1024EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAM3N00BA-MU ATSAM3N00BA-MU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 16KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
4+95.50 грн
Мінімальне замовлення: 4
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ATSAM3N00BA-MU ATSAM3N00BA-MU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 16KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
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ATSAM3N0AA-MU ATSAM3N0AA-MU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 596 шт:
термін постачання 21-31 дні (днів)
2+254.66 грн
Мінімальне замовлення: 2
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ATSAM3N0BA-MU ATSAM3N0BA-MU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 32KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
2+259.43 грн
Мінімальне замовлення: 2
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ATSAM3N0CA-CU ATSAM3N0CA-CU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 32KB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 79
DigiKey Programmable: Not Verified
на замовлення 712 шт:
термін постачання 21-31 дні (днів)
1+330.26 грн
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ATSAM3N0BA-AU ATSAM3N0BA-AU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
2+263.41 грн
Мінімальне замовлення: 2
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ATSAM3N4AA-MU ATSAM3N4AA-MU Microchip Technology SAM3N_Series_Summary_Feb2012.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
5+74.81 грн
Мінімальне замовлення: 5
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QT113B-ISG QT113B-ISG Microchip Technology QT113B.pdf Description: INTEGRATEDCIRCUIT
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Open Drain, Push-Pull
Type: Button
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 600µA
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Proximity Detection: Yes
DigiKey Programmable: Not Verified
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M5KP54A M5KP54A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 54VWM 87.1VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N3827AUR-1/TR 1N3827AUR-1/TR Microchip Technology 1N3821AUR-1-1N3828AUR-1.pdf Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
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1N3827AUR-1/TR 1N3827AUR-1/TR Microchip Technology 1N3821AUR-1-1N3828AUR-1.pdf Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
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JANTX1N3827A-1 JANTX1N3827A-1 Microchip Technology Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: MIL-PRF-19500/115
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JAN1N945B-1/TR JAN1N945B-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945B-1 JAN1N945B-1 Microchip Technology 1N941-1%20thru%201N945x-1.pdf Description: DIODE ZENER 11.7V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945BUR-1 Microchip Technology Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945BUR-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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ZL30733ALDG1S Microchip Technology ZL3073x-PTP-and-SyncE-Network-Synchronizers-with-up-to-5-Channels-10-Inputs-20-Outputs-Product-Brief-DS20006629.pdf Description: 3-CHANNEL, 6-OUTPUT, IEEE1588 TI
Packaging: Tray
Package / Case: 48-QFN
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 750MHz
Type: Clock Synchronizer
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 3.3V
Ratio - Input:Output: 8:6
Differential - Input:Output: Yes/Yes
Supplier Device Package: 48-VQFN (7x7)
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
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ZL30735BLDG1 ZL30735BLDG1 Microchip Technology Description: FIVE-CHANNEL, 10-OUTPUT 1588 TIM
Packaging: Tray
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ZL30732BLDG1 ZL30732BLDG1 Microchip Technology Description: 2-CHANNEL, 10-OUTPUT 1588 TIMING
Packaging: Tray
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AT26DF081A-SU AT26DF081A-SU Microchip Technology description Description: IC FLASH 8MBIT SPI 70MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 70 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 7µs, 5ms
Memory Interface: SPI
Memory Organization: 256 Bytes x 4096 pages
DigiKey Programmable: Not Verified
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DSC6011JI2B-002K000T DSC6011JI2B-002K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
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DSC6011JI2B-002K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 2.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
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DSC6001MI2B-007.3728T DSC6001MI2B-007.3728T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JI2B-024.0000T DSC6011JI2B-024.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6011JI2B-024.0000 DSC6011JI2B-024.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6011HA2B-008.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC AUTO -40C-125C
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011HA2B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC AUTO -40C-125C
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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1N4154 1N4154 Microchip Technology 11580-lds-0239-datasheet Description: DIODE STANDARD 35V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 2 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 4V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 35 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 mA
Current - Reverse Leakage @ Vr: 100 nA @ 25 V
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DSC1123CM1-375.0000 DSC1123CM1-375.0000 Microchip Technology Description: MEMS OSC LOW JITTER 375MHZ LVDS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 375 MHz
Base Resonator: MEMS
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DSC1123CM1-375.0000T DSC1123CM1-375.0000T Microchip Technology Description: MEMS OSC LOW JITTER 375MHZ LVDS
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 375 MHz
Base Resonator: MEMS
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KSZ8895MLXI-TR KSZ8895MLXI-TR Microchip Technology KSZ8895MQX-RQX-FQX-MLX-Integrated-5-Port-10-100-Managed-Ethernet-Switch-with-MII-RMII-Interface-DS00002246C.pdf Description: 5-PORT 10/100 MANAGED SWITCH W/
Packaging: Cut Tape (CT)
Package / Case: 128-LQFP
Function: Switch
Interface: MII
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Current - Supply: 107mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-LQFP (14x14)
DigiKey Programmable: Not Verified
на замовлення 1039 шт:
термін постачання 21-31 дні (днів)
1+570.60 грн
25+456.80 грн
100+441.32 грн
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PIC16LF15344T-I/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+72.73 грн
Мінімальне замовлення: 3300
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PIC16LF15344T-I/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
4+86.74 грн
25+76.42 грн
100+70.04 грн
Мінімальне замовлення: 4
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PIC16LF15344-E/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 637 шт:
термін постачання 21-31 дні (днів)
4+92.31 грн
25+82.06 грн
100+73.58 грн
Мінімальне замовлення: 4
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UPD350C/Q8X UPD350C/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350C-I/Q8X UPD350C-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT/Q8X UPD350AT/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT/Q8X UPD350AT/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT/Q8X UPD350BT/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT/Q8X UPD350BT/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT-I/Q8X UPD350AT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT-I/Q8X UPD350AT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER I2C 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT-I/Q8X UPD350BT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT-I/Q8X UPD350BT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350DT-I/Q8X UPD350DT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350DT-I/Q8X UPD350DT-I/Q8X Microchip Technology UPD350-Data-Sheet-DS00002643C.pdf Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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CDLL6016 Microchip Technology Description: DIODE ZENER
Packaging: Bulk
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PIC16F18156T-I/SS PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18156T-I/SS
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.19 грн
25+102.90 грн
100+93.62 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F17156T-I/STX PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17156T-I/STX
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+96.98 грн
Мінімальне замовлення: 3300
В кошику  од. на суму  грн.
PIC16F17156T-I/STX PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17156T-I/STX
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.98 грн
25+103.30 грн
100+93.39 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F17155T-I/SO PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17155T-I/SO
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+96.98 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
PIC16F17155T-I/SO PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17155T-I/SO
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.98 грн
25+103.30 грн
100+93.39 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC32MZ0512EFE100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ0512EFE100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ0512EFE100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ0512EFE100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CEC1734-S0-I/2HW CEC173x_Data_Brief.pdf
Виробник: Microchip Technology
Description: CRYPTO EC WITH SUPPORT FOR ONE A
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
DigiKey Programmable: Not Verified
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PIC16LF15355-I/SO PIC16(L)F15354_55%20Data%20Sheet%2040001853C.pdf
PIC16LF15355-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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DSC1123CE1-266.6670T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CE1-266.6670T
Виробник: Microchip Technology
Description: OSC MEMS AUTO -20C-70C SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 266.667 MHz
Base Resonator: MEMS
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PIC32MZ2064DAL169-I/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ2064DAL169-I/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1024EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ1024EFF100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ1024EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ1024EFF100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAM3N00BA-MU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N00BA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+95.50 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
ATSAM3N00BA-MU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N00BA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
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ATSAM3N0AA-MU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N0AA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 596 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+254.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ATSAM3N0BA-MU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N0BA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+259.43 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ATSAM3N0CA-CU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N0CA-CU
Виробник: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 79
DigiKey Programmable: Not Verified
на замовлення 712 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+330.26 грн
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ATSAM3N0BA-AU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N0BA-AU
Виробник: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+263.41 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ATSAM3N4AA-MU SAM3N_Series_Summary_Feb2012.pdf
ATSAM3N4AA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+74.81 грн
Мінімальне замовлення: 5
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QT113B-ISG QT113B.pdf
QT113B-ISG
Виробник: Microchip Technology
Description: INTEGRATEDCIRCUIT
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Open Drain, Push-Pull
Type: Button
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 600µA
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Proximity Detection: Yes
DigiKey Programmable: Not Verified
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M5KP54A rf01010_rb.pdf
M5KP54A
Виробник: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N3827AUR-1/TR 1N3821AUR-1-1N3828AUR-1.pdf
1N3827AUR-1/TR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
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1N3827AUR-1/TR 1N3821AUR-1-1N3828AUR-1.pdf
1N3827AUR-1/TR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
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JANTX1N3827A-1
JANTX1N3827A-1
Виробник: Microchip Technology
Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: MIL-PRF-19500/115
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JAN1N945B-1/TR
JAN1N945B-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945B-1 1N941-1%20thru%201N945x-1.pdf
JAN1N945B-1
Виробник: Microchip Technology
Description: DIODE ZENER 11.7V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945BUR-1
Виробник: Microchip Technology
Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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JAN1N945BUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Qualification: MIL-PRF-19500/157
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ZL30733ALDG1S ZL3073x-PTP-and-SyncE-Network-Synchronizers-with-up-to-5-Channels-10-Inputs-20-Outputs-Product-Brief-DS20006629.pdf
Виробник: Microchip Technology
Description: 3-CHANNEL, 6-OUTPUT, IEEE1588 TI
Packaging: Tray
Package / Case: 48-QFN
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 750MHz
Type: Clock Synchronizer
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 3.3V
Ratio - Input:Output: 8:6
Differential - Input:Output: Yes/Yes
Supplier Device Package: 48-VQFN (7x7)
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
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ZL30735BLDG1
ZL30735BLDG1
Виробник: Microchip Technology
Description: FIVE-CHANNEL, 10-OUTPUT 1588 TIM
Packaging: Tray
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ZL30732BLDG1
ZL30732BLDG1
Виробник: Microchip Technology
Description: 2-CHANNEL, 10-OUTPUT 1588 TIMING
Packaging: Tray
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AT26DF081A-SU description
AT26DF081A-SU
Виробник: Microchip Technology
Description: IC FLASH 8MBIT SPI 70MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 70 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 7µs, 5ms
Memory Interface: SPI
Memory Organization: 256 Bytes x 4096 pages
DigiKey Programmable: Not Verified
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DSC6011JI2B-002K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI2B-002K000T
Виробник: Microchip Technology
Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
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DSC6011JI2B-002K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 2.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
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DSC6001MI2B-007.3728T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001MI2B-007.3728T
Виробник: Microchip Technology
Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JI2B-024.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI2B-024.0000T
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6011JI2B-024.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6011JI2B-024.0000
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6011HA2B-008.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Виробник: Microchip Technology
Description: MEMS OSC AUTO -40C-125C
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011HA2B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Виробник: Microchip Technology
Description: MEMS OSC AUTO -40C-125C
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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1N4154 11580-lds-0239-datasheet
1N4154
Виробник: Microchip Technology
Description: DIODE STANDARD 35V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 2 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 4V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 35 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 mA
Current - Reverse Leakage @ Vr: 100 nA @ 25 V
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DSC1123CM1-375.0000
DSC1123CM1-375.0000
Виробник: Microchip Technology
Description: MEMS OSC LOW JITTER 375MHZ LVDS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 375 MHz
Base Resonator: MEMS
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DSC1123CM1-375.0000T
DSC1123CM1-375.0000T
Виробник: Microchip Technology
Description: MEMS OSC LOW JITTER 375MHZ LVDS
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 375 MHz
Base Resonator: MEMS
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KSZ8895MLXI-TR KSZ8895MQX-RQX-FQX-MLX-Integrated-5-Port-10-100-Managed-Ethernet-Switch-with-MII-RMII-Interface-DS00002246C.pdf
KSZ8895MLXI-TR
Виробник: Microchip Technology
Description: 5-PORT 10/100 MANAGED SWITCH W/
Packaging: Cut Tape (CT)
Package / Case: 128-LQFP
Function: Switch
Interface: MII
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Current - Supply: 107mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-LQFP (14x14)
DigiKey Programmable: Not Verified
на замовлення 1039 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+570.60 грн
25+456.80 грн
100+441.32 грн
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PIC16LF15344T-I/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
Виробник: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+72.73 грн
Мінімальне замовлення: 3300
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PIC16LF15344T-I/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
Виробник: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+86.74 грн
25+76.42 грн
100+70.04 грн
Мінімальне замовлення: 4
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PIC16LF15344-E/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
Виробник: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
на замовлення 637 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.31 грн
25+82.06 грн
100+73.58 грн
Мінімальне замовлення: 4
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UPD350C/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350C/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350C-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350C-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350AT/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350AT/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350BT/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350BT/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350BT/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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UPD350AT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350AT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
UPD350AT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350AT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER I2C 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: I2C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
UPD350BT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350BT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
UPD350BT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350BT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
UPD350DT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350DT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
UPD350DT-I/Q8X UPD350-Data-Sheet-DS00002643C.pdf
UPD350DT-I/Q8X
Виробник: Microchip Technology
Description: IC USB CONTROLLER SPI 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Protocol: USB
Standards: USB 3.0
Supplier Device Package: 28-QFN (4x4)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
CDLL6016
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
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