Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (339021) > Сторінка 1879 з 5651
| Фото | Назва | Виробник | Інформація |
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DSC1001CE2-019.2000T | Microchip Technology |
 Description: MEMS OSC XO 19.2000MHZ CMOS SMDPackaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 1.8V ~ 3.3V Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 19.2 MHz Base Resonator: MEMS |
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DSC1001CE2-012.2880T | Microchip Technology |
Description: MEMS OSC XO 12.2880MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 1.8V ~ 3.3V Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 12.288 MHz Base Resonator: MEMS |
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DSC1001CE2-018.4320T | Microchip Technology |
Description: MEMS OSC XO 18.4320MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 1.8V ~ 3.3V Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 18.432 MHz Base Resonator: MEMS |
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DSC1001CE2-012.0000T | Microchip Technology |
Description: MEMS OSC XO 12.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 1.8V ~ 3.3V Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 12 MHz Base Resonator: MEMS |
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В кошику од. на суму грн. | ||||||
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DSC1001CE2-010.0000 | Microchip Technology |
Description: MEMS OSC XO 10.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 1.7V ~ 3.6V Ratings: AEC-Q100 Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 10 MHz Base Resonator: MEMS |
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APTDF200KK60D16AG | Microchip Technology |
Description: PM-DIODE-FRED-D-D1 Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 160 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 460A Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 2.5 V @ 200 A Current - Reverse Leakage @ Vr: 50 µA @ 600 V |
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APTDF200KK120D16AG | Microchip Technology |
Description: PM-DIODE-FRED-D-D1 Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 385 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 410A Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A Current - Reverse Leakage @ Vr: 200 µA @ 1200 V |
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APTDF200A120D16AG | Microchip Technology |
Description: PM-DIODE-FRED-D-D1 Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 385 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 410A Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A Current - Reverse Leakage @ Vr: 200 µA @ 1200 V |
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ATAES132-MAH-EQ-T | Microchip Technology |
Description: IC AUTHENTICATION CHIP 8UDFN Packaging: Cut Tape (CT) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Type: Authentication Chip Applications: Networking and Communications Supplier Device Package: 8-UDFN (2x3) DigiKey Programmable: Not Verified |
на замовлення 1303 шт: термін постачання 21-31 дні (днів) |
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| EV97M19A | Microchip Technology |
Description: SHA 104/105 MIKROBUS BOARD Packaging: Box Function: Security Type: Interface Contents: Board(s) Utilized IC / Part: SHA104, SHA105 Platform: mikroBUS™ Click™ |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SHA104-MAVDA-T | Microchip Technology |
Description: IC AUTHENTICATION CHIP 8UDFN Packaging: Tape & Reel (TR) Package / Case: 8-UFDFN Exposed Pad Mounting Type: Surface Mount Type: Authentication Chip Supplier Device Package: 8-UDFN (2x3) |
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SHA104-RBVCZ-B | Microchip Technology |
Description: IC AUTHENTICATION CHIP 3SMD Packaging: Tube Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Type: Authentication Chip Supplier Device Package: 3-SMD |
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SHA104-RBVCZ-T | Microchip Technology |
Description: IC AUTHENTICATION CHIP 3SMD Packaging: Tape & Reel (TR) Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Type: Authentication Chip Supplier Device Package: 3-SMD |
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SG3524D | Microchip Technology |
Description: IC REG CTRLR MULT TOP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Transistor Driver Mounting Type: Surface Mount Function: Step-Down, Step-Up/Step-Down Operating Temperature: 0°C ~ 70°C (TA) Output Configuration: Positive Frequency - Switching: 100kHz ~ 300kHz Topology: Buck, Flyback, Push-Pull Voltage - Supply (Vcc/Vdd): 8V ~ 40V Supplier Device Package: 16-SOIC Synchronous Rectifier: Yes Control Features: Enable Output Phases: 1 Duty Cycle (Max): 49% Clock Sync: No Number of Outputs: 2 |
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JANTXV1N5640A/TR | Microchip Technology |
Description: TVS DIODE 17.1VWM 27.7VC DO13 Packaging: Tape & Reel (TR) Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 54A Voltage - Reverse Standoff (Typ): 17.1V Supplier Device Package: DO-13 (DO-202AA) Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 27.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/500 |
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JANTXV1N5640A | Microchip Technology |
Description: TVS DIODE 17.1VWM 27.7VC DO13 Packaging: Bulk Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 54A Voltage - Reverse Standoff (Typ): 17.1V Supplier Device Package: DO-13 (DO-202AA) Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 27.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/500 |
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MIC4834YMM | Microchip Technology |
Description: IC EL LAMP DRIVER 350KHZ 10MSOP Packaging: Tube Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 35kHz ~ 350kHz Type: EL Lamp Driver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.3V ~ 5.8V Supplier Device Package: 10-MSOP Dimming: No Current - Output Source/Sink: 5mA Current - Supply: 152 µA |
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MIC4826BMM | Microchip Technology |
 Description: IC EL LAMP DRIVER 1KHZ 8MSOPPackaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 60Hz ~ 1kHz Type: EL Lamp Driver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 8-MSOP Dimming: No Current - Supply: 21 µA |
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MIC4827BMM | Microchip Technology |
Description: IC EL LAMP DRIVER 1KHZ 8MSOP Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 60Hz ~ 1kHz Type: EL Lamp Driver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 8-MSOP Dimming: No Current - Supply: 21 µA |
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DSC400-1111Q0085KE1T | Microchip Technology |
Description: MEMS OSC XO 2.25V-3.6V 20SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVCMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Frequency - Output 1: 25MHz Frequency - Output 2: 25MHz Frequency - Output 3: 25MHz Frequency - Output 4: 125MHz Base Resonator: MEMS |
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JAN1N4477C | Microchip Technology |
Description: DIODE ZENER 33V 1.5W DO41 Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: DO-204AL (DO-41) Grade: Military Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA Current - Reverse Leakage @ Vr: 50 nA @ 26.4 V Qualification: MIL-PRF-19500/406 |
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CD4683 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 800 nA @ 1 V |
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CD4680 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 2.2 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 4 µA @ 1 V |
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CD4684 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3.3 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 7.5 µA @ 1.5 V |
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CD4685 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3.6 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V |
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CD4687 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 4.3 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 4 µA @ 2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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CD4688 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 4.7 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 10 µA @ 3 V |
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В кошику од. на суму грн. | ||||||
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CD4682 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 2.7 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 1 µA @ 1 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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CD4686 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3.9 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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CD4681 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 2.4 V Supplier Device Package: Die Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 2 µA @ 1 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DSC6111MA3B-050.0000 | Microchip Technology |
Description: MEMS OSC XO 50.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 50 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DSC6011MA3B-020.0000 | Microchip Technology |
Description: MEMS OSC XO 20.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 20 MHz Base Resonator: MEMS |
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В кошику од. на суму грн. | ||||||
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DSC6011MA3B-006K000 | Microchip Technology |
Description: MEMS OSC XO 6.0000KHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 6 kHz Base Resonator: MEMS |
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В кошику од. на суму грн. | ||||||
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DSC6011MA3B-025.0000 | Microchip Technology |
Description: MEMS OSC XO 25.0000MHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
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В кошику од. на суму грн. | ||||||
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DSC6011MA3B-002K000 | Microchip Technology |
Description: MEMS OSC XO 2.0000KHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 2 kHz Base Resonator: MEMS |
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В кошику од. на суму грн. | ||||||
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DSC6011MA3B-022K000 | Microchip Technology |
Description: MEMS OSC XO 22.0000KHZ CMOS SMD Packaging: Strip Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±20ppm Voltage - Supply: 1.71V ~ 3.63V Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 22 kHz Base Resonator: MEMS |
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| VT-820-1087-25M0000000 | Microchip Technology |
Description: TCXO OSCILLATOR Packaging: Bulk Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Height - Seated (Max): 0.039" (1.00mm) |
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| 2N4905 | Microchip Technology |
Description: NPN SILICON TRANSISTOR Packaging: Bulk |
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2N2604UB | Microchip Technology |
Description: TRANS PNP 60V 0.03A UB Packaging: Bulk Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA Current - Collector Cutoff (Max): 10nA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V Supplier Device Package: UB Current - Collector (Ic) (Max): 30 mA Voltage - Collector Emitter Breakdown (Max): 60 V Power - Max: 400 mW |
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В кошику од. на суму грн. | ||||||
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2N2605UB | Microchip Technology |
Description: TRANS PNP 60V 0.03A UB Packaging: Bulk Package / Case: 4-SMD, No Lead Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA Current - Collector Cutoff (Max): 10nA DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500µA, 5V Supplier Device Package: UB Current - Collector (Ic) (Max): 30 mA Voltage - Collector Emitter Breakdown (Max): 60 V Power - Max: 400 mW |
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| JAN2N2604 | Microchip Technology |
Description: TRANS PNP 60V 0.03A TO46 Packaging: Bulk Package / Case: TO-206AB, TO-46-3 Metal Can Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA Current - Collector Cutoff (Max): 10nA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V Supplier Device Package: TO-46 (TO-206AB) Grade: Military Current - Collector (Ic) (Max): 30 mA Voltage - Collector Emitter Breakdown (Max): 60 V Power - Max: 400 mW Qualification: MIL-PRF-19500/354 |
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AT89C51RB2-SLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.6x16.6) Number of I/O: 32 DigiKey Programmable: Verified |
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AT89C51RB2-SLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Cut Tape (CT) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.6x16.6) Number of I/O: 32 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-SLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Cut Tape (CT) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.6x16.6) Number of I/O: 32 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-RLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44VQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-RLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44VQFP Packaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-RLRUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44VQFP Packaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-RLTUM | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44VQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 32 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-RLTUL | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44VQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-SLRUM | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.6x16.6) Number of I/O: 32 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AT89C51RB2-SLRUM | Microchip Technology |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Cut Tape (CT) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.6x16.6) Number of I/O: 32 DigiKey Programmable: Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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ATMEGA324P-20PU | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 40-PDIP Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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1N957B | Microchip Technology |
Description: DIODE ZENER 6.8V 500MW DO7 Packaging: Bulk Tolerance: ±5% Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 4.5 Ohms Supplier Device Package: DO-7 Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 150 µA @ 5.2 V |
на замовлення 148 шт: термін постачання 21-31 дні (днів) |
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MASMBG10A | Microchip Technology |
Description: TVS DIODE 10VWM 17VC SMBG Packaging: Bulk Package / Case: DO-215AA, SMB Gull Wing Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 35.3A Voltage - Reverse Standoff (Typ): 10V Supplier Device Package: DO-214AA (SMBG) Unidirectional Channels: 1 Voltage - Breakdown (Min): 11.1V Voltage - Clamping (Max) @ Ipp: 17V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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1N5922BUR-1/TR | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 3 Ohms Supplier Device Package: DO-213AB (MELF, LL41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 6 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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1N5922BUR-1/TR | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Cut Tape (CT) Tolerance: ±5% Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 3 Ohms Supplier Device Package: DO-213AB (MELF, LL41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 6 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
1N5921A | Microchip Technology |
Description: DIODE ZENER Packaging: Bulk Tolerance: ±10% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 2.5 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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1N5921C | Microchip Technology |
Description: DIODE ZENER Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 2.5 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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1N5921D | Microchip Technology |
Description: DIODE ZENER Packaging: Bulk Tolerance: ±1% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 2.5 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
JAN1N6310 | Microchip Technology |
Description: DIODE ZENER 2.7V 500MW DO35 Packaging: Bulk Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: DO-204AH (DO-35) Grade: Military Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A Current - Reverse Leakage @ Vr: 60 µA @ 1 V Qualification: MIL-PRF-19500/533 |
товару немає в наявності |
В кошику од. на суму грн. |
| DSC1001CE2-019.2000T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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В кошику
од. на суму грн.
| DSC1001CE2-012.2880T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику
од. на суму грн.
| DSC1001CE2-018.4320T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 18.4320MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 18.432 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 18.4320MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 18.432 MHz
Base Resonator: MEMS
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В кошику
од. на суму грн.
| DSC1001CE2-012.0000T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику
од. на суму грн.
| DSC1001CE2-010.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику
од. на суму грн.
| APTDF200KK60D16AG |
|
Виробник: Microchip Technology
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 460A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.5 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 160 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 460A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.5 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
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В кошику
од. на суму грн.
| APTDF200KK120D16AG |
|
Виробник: Microchip Technology
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 385 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 410A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 1200 V
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 385 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 410A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 1200 V
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В кошику
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| APTDF200A120D16AG |
|
Виробник: Microchip Technology
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 385 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 410A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 1200 V
Description: PM-DIODE-FRED-D-D1
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 385 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 410A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 1200 V
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В кошику
од. на суму грн.
| ATAES132-MAH-EQ-T |
|
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
DigiKey Programmable: Not Verified
Description: IC AUTHENTICATION CHIP 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
DigiKey Programmable: Not Verified
на замовлення 1303 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 14+ | 24.99 грн |
| 25+ | 17.06 грн |
| 100+ | 15.39 грн |
| EV97M19A |
|
Виробник: Microchip Technology
Description: SHA 104/105 MIKROBUS BOARD
Packaging: Box
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SHA104, SHA105
Platform: mikroBUS™ Click™
Description: SHA 104/105 MIKROBUS BOARD
Packaging: Box
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SHA104, SHA105
Platform: mikroBUS™ Click™
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2102.35 грн |
| SHA104-MAVDA-T |
|
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
Description: IC AUTHENTICATION CHIP 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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| SHA104-RBVCZ-B |
|
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 3SMD
Packaging: Tube
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 3-SMD
Description: IC AUTHENTICATION CHIP 3SMD
Packaging: Tube
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 3-SMD
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| SHA104-RBVCZ-T |
|
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 3SMD
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 3-SMD
Description: IC AUTHENTICATION CHIP 3SMD
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 3-SMD
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| SG3524D |
|
Виробник: Microchip Technology
Description: IC REG CTRLR MULT TOP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-SOIC
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
Description: IC REG CTRLR MULT TOP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-SOIC
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
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| JANTXV1N5640A/TR |
Виробник: Microchip Technology
Description: TVS DIODE 17.1VWM 27.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 54A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
Description: TVS DIODE 17.1VWM 27.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 54A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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| JANTXV1N5640A |
Виробник: Microchip Technology
Description: TVS DIODE 17.1VWM 27.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 54A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
Description: TVS DIODE 17.1VWM 27.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 54A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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| MIC4834YMM |
|
Виробник: Microchip Technology
Description: IC EL LAMP DRIVER 350KHZ 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 35kHz ~ 350kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.8V
Supplier Device Package: 10-MSOP
Dimming: No
Current - Output Source/Sink: 5mA
Current - Supply: 152 µA
Description: IC EL LAMP DRIVER 350KHZ 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 35kHz ~ 350kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.8V
Supplier Device Package: 10-MSOP
Dimming: No
Current - Output Source/Sink: 5mA
Current - Supply: 152 µA
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| MIC4826BMM | |
|
Виробник: Microchip Technology
Description: IC EL LAMP DRIVER 1KHZ 8MSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 60Hz ~ 1kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 8-MSOP
Dimming: No
Current - Supply: 21 µA
Description: IC EL LAMP DRIVER 1KHZ 8MSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 60Hz ~ 1kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 8-MSOP
Dimming: No
Current - Supply: 21 µA
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| MIC4827BMM |
|
Виробник: Microchip Technology
Description: IC EL LAMP DRIVER 1KHZ 8MSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 60Hz ~ 1kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 8-MSOP
Dimming: No
Current - Supply: 21 µA
Description: IC EL LAMP DRIVER 1KHZ 8MSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 60Hz ~ 1kHz
Type: EL Lamp Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 8-MSOP
Dimming: No
Current - Supply: 21 µA
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| DSC400-1111Q0085KE1T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 25MHz
Frequency - Output 2: 25MHz
Frequency - Output 3: 25MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 25MHz
Frequency - Output 2: 25MHz
Frequency - Output 3: 25MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
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| JAN1N4477C |
|
Виробник: Microchip Technology
Description: DIODE ZENER 33V 1.5W DO41
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 26.4 V
Qualification: MIL-PRF-19500/406
Description: DIODE ZENER 33V 1.5W DO41
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 26.4 V
Qualification: MIL-PRF-19500/406
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| CD4683 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 800 nA @ 1 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 800 nA @ 1 V
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| CD4680 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.2 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.2 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
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| CD4684 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1.5 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1.5 V
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| CD4685 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V
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| CD4687 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 4 µA @ 2 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.3 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 4 µA @ 2 V
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| CD4688 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 3 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 3 V
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| CD4682 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.7 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 1 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.7 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 1 V
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| CD4686 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
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| CD4681 |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.4 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 1 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.4 V
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 1 V
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| DSC6111MA3B-050.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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| DSC6011MA3B-020.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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| DSC6011MA3B-006K000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 6.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 6 kHz
Base Resonator: MEMS
Description: MEMS OSC XO 6.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 6 kHz
Base Resonator: MEMS
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| DSC6011MA3B-025.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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| DSC6011MA3B-002K000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 2.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
Description: MEMS OSC XO 2.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 2 kHz
Base Resonator: MEMS
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| DSC6011MA3B-022K000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 22.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 22 kHz
Base Resonator: MEMS
Description: MEMS OSC XO 22.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 22 kHz
Base Resonator: MEMS
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| VT-820-1087-25M0000000 |
|
Виробник: Microchip Technology
Description: TCXO OSCILLATOR
Packaging: Bulk
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max): 0.039" (1.00mm)
Description: TCXO OSCILLATOR
Packaging: Bulk
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max): 0.039" (1.00mm)
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| 2N2604UB |
|
Виробник: Microchip Technology
Description: TRANS PNP 60V 0.03A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
Description: TRANS PNP 60V 0.03A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
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| 2N2605UB |
|
Виробник: Microchip Technology
Description: TRANS PNP 60V 0.03A UB
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500µA, 5V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
Description: TRANS PNP 60V 0.03A UB
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 500µA, 5V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
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| JAN2N2604 |
|
Виробник: Microchip Technology
Description: TRANS PNP 60V 0.03A TO46
Packaging: Bulk
Package / Case: TO-206AB, TO-46-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V
Supplier Device Package: TO-46 (TO-206AB)
Grade: Military
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
Qualification: MIL-PRF-19500/354
Description: TRANS PNP 60V 0.03A TO46
Packaging: Bulk
Package / Case: TO-206AB, TO-46-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 500µA, 5V
Supplier Device Package: TO-46 (TO-206AB)
Grade: Military
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 400 mW
Qualification: MIL-PRF-19500/354
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| AT89C51RB2-SLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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| AT89C51RB2-SLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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| AT89C51RB2-SLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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| AT89C51RB2-RLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| AT89C51RB2-RLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| AT89C51RB2-RLRUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| AT89C51RB2-RLTUM |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Verified
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| AT89C51RB2-RLTUL |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| AT89C51RB2-SLRUM |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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| AT89C51RB2-SLRUM |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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| ATMEGA324P-20PU |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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| 1N957B |
|
Виробник: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO7
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 150 µA @ 5.2 V
Description: DIODE ZENER 6.8V 500MW DO7
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 150 µA @ 5.2 V
на замовлення 148 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 231.78 грн |
| 100+ | 207.10 грн |
| MASMBG10A |
|
Виробник: Microchip Technology
Description: TVS DIODE 10VWM 17VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 35.3A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 10VWM 17VC SMBG
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 35.3A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| 1N5922BUR-1/TR |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 6 V
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 6 V
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| 1N5922BUR-1/TR |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 6 V
Description: VOLTAGE REGULATOR
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 6 V
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| 1N5921A |
|
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
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| 1N5921C |
|
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
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| 1N5921D |
|
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 5.2 V
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| JAN1N6310 |
|
Виробник: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO35
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 60 µA @ 1 V
Qualification: MIL-PRF-19500/533
Description: DIODE ZENER 2.7V 500MW DO35
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 60 µA @ 1 V
Qualification: MIL-PRF-19500/533
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