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MIC5363-3.3YMT-T5 MIC5363-3.3YMT-T5 Microchip Technology MIC5363_4.pdf Description: IC REG LINEAR 3.3V 300MA 6TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 53 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (1.2x1.2)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 70dB (1kHz)
Voltage Dropout (Max): 0.38V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 70 µA
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DSC6011JI2B-019.2000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6003JI2B-019.2000 DSC6003JI2B-019.2000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6111CI1B-027.0000 DSC6111CI1B-027.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6101MI1B-027.0000 DSC6101MI1B-027.0000 Microchip Technology Description: OSC MEMS LOW PWR LVCMOS
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111HI1B-027.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111HI1B-027.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111CI1B-027.0000T DSC6111CI1B-027.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6011JE1B-027.0000T DSC6011JE1B-027.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-027.0000T DSC6001JI1B-027.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111JI1B-027.0000T DSC6111JI1B-027.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6013MI1B-027.0000T DSC6013MI1B-027.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6101MI1B-027.0000T DSC6101MI1B-027.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6013MI1B-027.0000 DSC6013MI1B-027.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-027.0000 DSC6001JI1B-027.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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HTM6101CI1B-027.0000 HTM6101CI1B-027.0000 Microchip Technology Description: HIGH TEMP MEMS BASED XO +3.3 VDC
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Current - Supply (Max): 4mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC400-4334Q0022KE1T DSC400-4334Q0022KE1T Microchip Technology DSC400-4334Q0022.pdf Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 125MHz
Frequency - Output 2: 100MHz
Frequency - Output 3: 100MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
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DSC400-4334Q0022KI1T DSC400-4334Q0022KI1T Microchip Technology DSC400-4334Q0022.pdf Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 125MHz
Frequency - Output 2: 100MHz
Frequency - Output 3: 100MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
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DSA400-4334Q0167KI2TVAO DSA400-4334Q0167KI2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: IC CLOCK GENERATOR 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: HCSL, LVDS
Frequency - Max: 460MHz
Type: Clock Generator
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.25V ~ 3.6V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-QFN (5x3.2)
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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SHA104-SSVCZ-T SHA104-SSVCZ-T Microchip Technology SHA104-CryptoAuthentication-Summary-Data-Sheet-DS40002467.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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SHA104-SSVCZ-T SHA104-SSVCZ-T Microchip Technology SHA104-CryptoAuthentication-Summary-Data-Sheet-DS40002467.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3195 шт:
термін постачання 21-31 дні (днів)
10+32.63 грн
25+26.79 грн
100+25.56 грн
Мінімальне замовлення: 10
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SHA105-SSVDA-T SHA105-SSVDA-T Microchip Technology SHA105-CryptoAuthentication-Summary-Data-Sheet-DS40002469.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3262 шт:
термін постачання 21-31 дні (днів)
8+39.79 грн
25+31.73 грн
100+30.84 грн
Мінімальне замовлення: 8
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SHA105-SSVDA-T SHA105-SSVDA-T Microchip Technology SHA105-CryptoAuthentication-Summary-Data-Sheet-DS40002469.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3262 шт:
термін постачання 21-31 дні (днів)
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ATECC608C-MAHDA-T Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 12336 шт:
термін постачання 21-31 дні (днів)
5+68.44 грн
25+54.41 грн
100+52.89 грн
Мінімальне замовлення: 5
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ATECC608C-MAHDA-S Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 2957 шт:
термін постачання 21-31 дні (днів)
5+70.83 грн
25+56.68 грн
100+54.79 грн
Мінімальне замовлення: 5
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ATECC608C-MAHCZ-T Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
5+68.44 грн
25+54.41 грн
100+52.89 грн
Мінімальне замовлення: 5
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ATECC608C-MAHCZ-S Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
5+70.83 грн
25+56.68 грн
100+54.79 грн
Мінімальне замовлення: 5
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ATECC608C-MAVDA-T Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 14980 шт:
термін постачання 21-31 дні (днів)
5+77.99 грн
25+62.72 грн
100+60.45 грн
Мінімальне замовлення: 5
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ATECC608C-SSVDA-T Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 3927 шт:
термін постачання 21-31 дні (днів)
5+77.99 грн
25+62.72 грн
100+60.45 грн
Мінімальне замовлення: 5
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ATECC608C-MAVDA-S Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 2798 шт:
термін постачання 21-31 дні (днів)
4+80.38 грн
25+64.25 грн
100+62.34 грн
Мінімальне замовлення: 4
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ATECC608C-RBHCZ-T Microchip Technology ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
4+97.09 грн
25+77.09 грн
100+74.62 грн
Мінімальне замовлення: 4
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PIC16F18074-I/PT PIC16F18074-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
на замовлення 369 шт:
термін постачання 21-31 дні (днів)
3+124.15 грн
25+109.34 грн
100+98.62 грн
Мінімальне замовлення: 3
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S40A10 Microchip Technology Description: DIODE GEN PURP 40A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-5 (DO-203AB)
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 40 A
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JAN1N976CUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 43V 500MW DO213AA
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 43 V
Impedance (Max) (Zzt): 93 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 33 V
Qualification: MIL-PRF-19500/117
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MIC2870YFT-TR MIC2870YFT-TR Microchip Technology MIC2870-1.5A-Synchronous-Boost-Flash-LED-Driver-with-I2C-Interface-DS20006078A.pdf Description: IC LED DRV RGLTR I2C 1.5A 16TQFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Voltage - Output: 5.2V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 125°C (TJ)
Applications: Camera Flash
Current - Output / Channel: 1.5A (Flash)
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-TQFN (2x2)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5V
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MIC5322-PPYMT-TR MIC5322-PPYMT-TR Microchip Technology mic5322.pdf Description: IC REG LINEAR 3V/3V 6TMLF
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 190 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 6-TMLF® (1.6x1.6)
Voltage - Output (Min/Fixed): 3V, 3V
Control Features: Enable
PSRR: 75dB ~ 45dB (1kHz ~ 20kHz)
Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
Protection Features: Over Current, Over Temperature
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MIC5322-PPYMT-TR MIC5322-PPYMT-TR Microchip Technology mic5322.pdf Description: IC REG LINEAR 3V/3V 6TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 190 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 6-TMLF® (1.6x1.6)
Voltage - Output (Min/Fixed): 3V, 3V
Control Features: Enable
PSRR: 75dB ~ 45dB (1kHz ~ 20kHz)
Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
Protection Features: Over Current, Over Temperature
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1N3741R Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP REV 800V 275A DO205AB
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 800 V
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EVB-USB5806 EVB-USB5806 Microchip Technology 50002543A.pdf Description: EVB-USB5806 EVALUATION BOARD
Packaging: Bulk
Function: USB Hub
Type: Interface
Contents: Board(s)
Utilized IC / Part: USB5806
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+32831.13 грн
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EVB-USB5926 EVB-USB5926 Microchip Technology 50002536B.pdf Description: EVAL BOARD 6 PORT USB 3 HUB
Packaging: Bulk
Function: USB Hub
Type: Interface
Contents: Board(s)
Utilized IC / Part: USB5926
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+43806.93 грн
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DSC6111JE1B-054.0000 DSC6111JE1B-054.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111HE1B-054.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111HE1B-054.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111JE1B-054.0000T DSC6111JE1B-054.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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EEC1005-I/WC-UB2 Microchip Technology EEC1005-Data-Sheet-DS00003392B.pdf Description: UBM CONTROLLER, 144-PIN, SFF-TA-
Packaging: Tray
Package / Case: 144-WFBGA
Mounting Type: Surface Mount
Interface: BMC, I2C, SGPIO, UBM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1005
Applications: Storage Backplane Management
Core Processor: ARM® Cortex®-M4
Supplier Device Package: 144-WFBGA (10x10)
Number of I/O: 3
на замовлення 149 шт:
термін постачання 21-31 дні (днів)
1+836.40 грн
25+671.34 грн
100+648.53 грн
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MIC2003-1.2YML-TR MIC2003-1.2YML-TR Microchip Technology mic20xx.pdf Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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MIC2003-1.2YML-TR MIC2003-1.2YML-TR Microchip Technology mic20xx.pdf Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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DSC6111JI1B-001.8432 DSC6111JI1B-001.8432 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111CI1B-001.8432 DSC6111CI1B-001.8432 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111HI1B-001.8432 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111HI1B-001.8432T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111CI1B-001.8432T DSC6111CI1B-001.8432T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6011JI1B-001.0000T DSC6011JI1B-001.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6111JI1B-001.8432T DSC6111JI1B-001.8432T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6003MI1B-001.8432T DSC6003MI1B-001.8432T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6003MI1B-001.8432 DSC6003MI1B-001.8432 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6001HE1B-001.0000T DSC6001HE1B-001.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1 MHz
Base Resonator: MEMS
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dsPIC33EP128GS806-E/PT dsPIC33EP128GS806-E/PT Microchip Technology dsPIC33EPXXXGS70X-80X-Family-Data-Sheet-DS70005258C.pdf Description: IC MCU 16BIT 128KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 128KB (43K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 22x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 51
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 477 шт:
термін постачання 21-31 дні (днів)
1+596.86 грн
25+525.95 грн
100+477.36 грн
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MA330043 MA330043 Microchip Technology dsPIC33EP128GS806-Digital-Power-PIM-Users-Guide-DS50002761A.pdf Description: DSPIC33EP128GS806 DIGITAL POWER
Packaging: Bulk
For Use With/Related Products: dsPIC33EP128GS806
Accessory Type: Plug-In Module (PIM)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+5647.07 грн
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DSC1001CL5-025.0000T DSC1001CL5-025.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
на замовлення 750 шт:
термін постачання 21-31 дні (днів)
2+291.27 грн
10+267.07 грн
50+253.70 грн
Мінімальне замовлення: 2
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MIC5363-3.3YMT-T5 MIC5363_4.pdf
MIC5363-3.3YMT-T5
Виробник: Microchip Technology
Description: IC REG LINEAR 3.3V 300MA 6TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 53 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (1.2x1.2)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 70dB (1kHz)
Voltage Dropout (Max): 0.38V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 70 µA
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DSC6011JI2B-019.2000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6003JI2B-019.2000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-019.2000
Виробник: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6111CI1B-027.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111CI1B-027.0000
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6101MI1B-027.0000
DSC6101MI1B-027.0000
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111HI1B-027.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111HI1B-027.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111CI1B-027.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111CI1B-027.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6011JE1B-027.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JE1B-027.0000T
Виробник: Microchip Technology
Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-027.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001JI1B-027.0000T
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6111JI1B-027.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI1B-027.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6013MI1B-027.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6013MI1B-027.0000T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6101MI1B-027.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101MI1B-027.0000T
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6013MI1B-027.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6013MI1B-027.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-027.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001JI1B-027.0000
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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HTM6101CI1B-027.0000
HTM6101CI1B-027.0000
Виробник: Microchip Technology
Description: HIGH TEMP MEMS BASED XO +3.3 VDC
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Current - Supply (Max): 4mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC400-4334Q0022KE1T DSC400-4334Q0022.pdf
DSC400-4334Q0022KE1T
Виробник: Microchip Technology
Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 125MHz
Frequency - Output 2: 100MHz
Frequency - Output 3: 100MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
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DSC400-4334Q0022KI1T DSC400-4334Q0022.pdf
DSC400-4334Q0022KI1T
Виробник: Microchip Technology
Description: MEMS OSC XO 2.25V-3.6V 20SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Frequency - Output 1: 125MHz
Frequency - Output 2: 100MHz
Frequency - Output 3: 100MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
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DSA400-4334Q0167KI2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
DSA400-4334Q0167KI2TVAO
Виробник: Microchip Technology
Description: IC CLOCK GENERATOR 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: HCSL, LVDS
Frequency - Max: 460MHz
Type: Clock Generator
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.25V ~ 3.6V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-QFN (5x3.2)
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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SHA104-SSVCZ-T SHA104-CryptoAuthentication-Summary-Data-Sheet-DS40002467.pdf
SHA104-SSVCZ-T
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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SHA104-SSVCZ-T SHA104-CryptoAuthentication-Summary-Data-Sheet-DS40002467.pdf
SHA104-SSVCZ-T
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3195 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+32.63 грн
25+26.79 грн
100+25.56 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
SHA105-SSVDA-T SHA105-CryptoAuthentication-Summary-Data-Sheet-DS40002469.pdf
SHA105-SSVDA-T
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3262 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+39.79 грн
25+31.73 грн
100+30.84 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
SHA105-SSVDA-T SHA105-CryptoAuthentication-Summary-Data-Sheet-DS40002469.pdf
SHA105-SSVDA-T
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
на замовлення 3262 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
ATECC608C-MAHDA-T ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 12336 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+68.44 грн
25+54.41 грн
100+52.89 грн
Мінімальне замовлення: 5
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ATECC608C-MAHDA-S ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 2957 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+70.83 грн
25+56.68 грн
100+54.79 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ATECC608C-MAHCZ-T ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+68.44 грн
25+54.41 грн
100+52.89 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ATECC608C-MAHCZ-S ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+70.83 грн
25+56.68 грн
100+54.79 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ATECC608C-MAVDA-T ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 14980 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+77.99 грн
25+62.72 грн
100+60.45 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ATECC608C-SSVDA-T ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 3927 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+77.99 грн
25+62.72 грн
100+60.45 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ATECC608C-MAVDA-S ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 2798 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+80.38 грн
25+64.25 грн
100+62.34 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
ATECC608C-RBHCZ-T ATECC608B-CryptoAuthentication-Device-Summary-Data-Sheet-DS40002239B.pdf
Виробник: Microchip Technology
Description: IC AUTHENTICATION CHIP
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+97.09 грн
25+77.09 грн
100+74.62 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18074-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-I/PT
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
на замовлення 369 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+124.15 грн
25+109.34 грн
100+98.62 грн
Мінімальне замовлення: 3
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S40A10
Виробник: Microchip Technology
Description: DIODE GEN PURP 40A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-5 (DO-203AB)
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 40 A
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JAN1N976CUR-1 125313-lds-0287-1-datasheet
Виробник: Microchip Technology
Description: DIODE ZENER 43V 500MW DO213AA
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 43 V
Impedance (Max) (Zzt): 93 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 33 V
Qualification: MIL-PRF-19500/117
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MIC2870YFT-TR MIC2870-1.5A-Synchronous-Boost-Flash-LED-Driver-with-I2C-Interface-DS20006078A.pdf
MIC2870YFT-TR
Виробник: Microchip Technology
Description: IC LED DRV RGLTR I2C 1.5A 16TQFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Voltage - Output: 5.2V
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 125°C (TJ)
Applications: Camera Flash
Current - Output / Channel: 1.5A (Flash)
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-TQFN (2x2)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5V
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MIC5322-PPYMT-TR mic5322.pdf
MIC5322-PPYMT-TR
Виробник: Microchip Technology
Description: IC REG LINEAR 3V/3V 6TMLF
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 190 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 6-TMLF® (1.6x1.6)
Voltage - Output (Min/Fixed): 3V, 3V
Control Features: Enable
PSRR: 75dB ~ 45dB (1kHz ~ 20kHz)
Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
Protection Features: Over Current, Over Temperature
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MIC5322-PPYMT-TR mic5322.pdf
MIC5322-PPYMT-TR
Виробник: Microchip Technology
Description: IC REG LINEAR 3V/3V 6TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 190 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 6-TMLF® (1.6x1.6)
Voltage - Output (Min/Fixed): 3V, 3V
Control Features: Enable
PSRR: 75dB ~ 45dB (1kHz ~ 20kHz)
Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
Protection Features: Over Current, Over Temperature
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1N3741R 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP REV 800V 275A DO205AB
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 800 V
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EVB-USB5806 50002543A.pdf
EVB-USB5806
Виробник: Microchip Technology
Description: EVB-USB5806 EVALUATION BOARD
Packaging: Bulk
Function: USB Hub
Type: Interface
Contents: Board(s)
Utilized IC / Part: USB5806
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+32831.13 грн
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EVB-USB5926 50002536B.pdf
EVB-USB5926
Виробник: Microchip Technology
Description: EVAL BOARD 6 PORT USB 3 HUB
Packaging: Bulk
Function: USB Hub
Type: Interface
Contents: Board(s)
Utilized IC / Part: USB5926
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+43806.93 грн
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DSC6111JE1B-054.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JE1B-054.0000
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111HE1B-054.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111HE1B-054.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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DSC6111JE1B-054.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JE1B-054.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 54 MHz
Base Resonator: MEMS
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EEC1005-I/WC-UB2 EEC1005-Data-Sheet-DS00003392B.pdf
Виробник: Microchip Technology
Description: UBM CONTROLLER, 144-PIN, SFF-TA-
Packaging: Tray
Package / Case: 144-WFBGA
Mounting Type: Surface Mount
Interface: BMC, I2C, SGPIO, UBM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1005
Applications: Storage Backplane Management
Core Processor: ARM® Cortex®-M4
Supplier Device Package: 144-WFBGA (10x10)
Number of I/O: 3
на замовлення 149 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+836.40 грн
25+671.34 грн
100+648.53 грн
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MIC2003-1.2YML-TR mic20xx.pdf
MIC2003-1.2YML-TR
Виробник: Microchip Technology
Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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MIC2003-1.2YML-TR mic20xx.pdf
MIC2003-1.2YML-TR
Виробник: Microchip Technology
Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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DSC6111JI1B-001.8432 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI1B-001.8432
Виробник: Microchip Technology
Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111CI1B-001.8432 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111CI1B-001.8432
Виробник: Microchip Technology
Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111HI1B-001.8432 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111HI1B-001.8432T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6111CI1B-001.8432T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111CI1B-001.8432T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6011JI1B-001.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI1B-001.0000T
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6111JI1B-001.8432T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI1B-001.8432T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6003MI1B-001.8432T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI1B-001.8432T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6003MI1B-001.8432 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI1B-001.8432
Виробник: Microchip Technology
Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC6001HE1B-001.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HE1B-001.0000T
Виробник: Microchip Technology
Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 1 MHz
Base Resonator: MEMS
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dsPIC33EP128GS806-E/PT dsPIC33EPXXXGS70X-80X-Family-Data-Sheet-DS70005258C.pdf
dsPIC33EP128GS806-E/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 128KB (43K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 22x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 51
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 477 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+596.86 грн
25+525.95 грн
100+477.36 грн
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MA330043 dsPIC33EP128GS806-Digital-Power-PIM-Users-Guide-DS50002761A.pdf
MA330043
Виробник: Microchip Technology
Description: DSPIC33EP128GS806 DIGITAL POWER
Packaging: Bulk
For Use With/Related Products: dsPIC33EP128GS806
Accessory Type: Plug-In Module (PIM)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5647.07 грн
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DSC1001CL5-025.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-025.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
на замовлення 750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+291.27 грн
10+267.07 грн
50+253.70 грн
Мінімальне замовлення: 2
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