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ATXMEGA128A3-MHR ATXMEGA128A3-MHR Microchip Technology Atmel-8068-8-and16-bit-AVR-XMEGA-A3-Microcontrollers_Datasheet.pdf Description: IC MCU 8/16BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 8/16-Bit
Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
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ATXMEGA128A3-MHR ATXMEGA128A3-MHR Microchip Technology Atmel-8068-8-and16-bit-AVR-XMEGA-A3-Microcontrollers_Datasheet.pdf Description: IC MCU 8/16BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 8/16-Bit
Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
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AT32UC3L0128-D3HT AT32UC3L0128-D3HT Microchip Technology Atmel-32145-32-bit-Flash-MCU-UCL0_datasheet.pdf Description: IC MCU 32BIT 128KB FLASH 48TLLGA
Packaging: Tray
Package / Case: 48-UFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-TLLGA (5.5x5.5)
Number of I/O: 36
DigiKey Programmable: Not Verified
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JAN1N6119US JAN1N6119US Microchip Technology lds-0277-1.pdf Description: TVS DIODE 27.4VWM 52.4VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 9.5A
Voltage - Reverse Standoff (Typ): 27.4V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 32.49V
Voltage - Clamping (Max) @ Ipp: 52.4V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MIC4128YME-TR MIC4128YME-TR Microchip Technology MIC4126-27-28-Data-Sheet-20006084A.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
на замовлення 602 шт:
термін постачання 21-31 дні (днів)
4+94.78 грн
25+75.27 грн
100+67.82 грн
Мінімальне замовлення: 4
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GC1501-00 Microchip Technology GC1500Series.pdf Description: SI TVAR NON HERMETIC CHIP
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1pF @ 4V, 1MHz
Q @ Vr, F: 3800 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C30
Supplier Device Package: Chip
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 3.4
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GC15010-00 Microchip Technology GC15000.pdf Description: SI TVAR NON HERMETIC CHIP
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 2pF @ 20V, 1MHz
Q @ Vr, F: 700 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C20
Supplier Device Package: Chip
Voltage - Peak Reverse (Max): 22 V
Capacitance Ratio: 13.0
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ATMEGA164PA-PU ATMEGA164PA-PU Microchip Technology ATmega164A_PA-324A_PA-644A_PA-1284_P_Data-Sheet-40002070B.pdf Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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1N6073US/TR 1N6073US/TR Microchip Technology 1N6073US-1N6081US.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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1N6073US/TR 1N6073US/TR Microchip Technology 1N6073US-1N6081US.pdf Description: UFR,FRR
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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JAN1N6073 JAN1N6073 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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1N6073 1N6073 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 50V 850MA AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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1N6073/TR 1N6073/TR Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 50V 850MA
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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JANTX1N6073 JANTX1N6073 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A-PAK
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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JANTXV1N6073 JANTXV1N6073 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A-PAK
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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MCP60721UT-E/LTY MCP60721UT-E/LTY Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SC-70-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+71.44 грн
Мінімальне замовлення: 3000
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MCP60721UT-E/LTY MCP60721UT-E/LTY Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SC-70-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3165 шт:
термін постачання 21-31 дні (днів)
4+94.78 грн
25+75.97 грн
100+68.80 грн
Мінімальне замовлення: 4
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MCP60721T-E/OT MCP60721T-E/OT Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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MCP60721T-E/OT MCP60721T-E/OT Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 2999 шт:
термін постачання 21-31 дні (днів)
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MCP60723T-E/CH MCP60723T-E/CH Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP W/ STDN, E
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-6
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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MCP60723T-E/CH MCP60723T-E/CH Microchip Technology MCP6072X-Family-Data-Sheet-DS20006916.pdf Description: SINGLE, 10MHZ OP AMP W/ STDN, E
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-6
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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AT93C46A-10SU-2.7-T AT93C46A-10SU-2.7-T Microchip Technology AT93C46A.pdf Description: IC EEPROM 1KBIT 3-WIRE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MCP9982DT-2E/RW MCP9982DT-2E/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+52.32 грн
Мінімальне замовлення: 3000
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MCP9982DT-2E/RW MCP9982DT-2E/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
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MCP9982DT-1E/RW MCP9982DT-1E/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+52.32 грн
Мінімальне замовлення: 3000
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MCP9982DT-1E/RW MCP9982DT-1E/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
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MCP9982DT-1E/A3 MCP9982DT-1E/A3 Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
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MCP9982DT-1E/A3 MCP9982DT-1E/A3 Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2477 шт:
термін постачання 21-31 дні (днів)
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
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MCP9982DT-2E/A3 MCP9982DT-2E/A3 Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
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MCP9982DT-2E/A3 MCP9982DT-2E/A3 Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2274 шт:
термін постачання 21-31 дні (днів)
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
AT25160A-10TU-1.8 AT25160A-10TU-1.8 Microchip Technology doc3347.pdf Description: IC EEPROM 16KBIT SPI 8TSSOP
Packaging: Tube
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AUT-EFP ATSAMD51N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AUT-EFP ATSAMD51N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AF ATSAME53N20A-AF Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AUT-EFP ATSAME53N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AUT-EFP ATSAME53N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AFT ATSAMD51N20A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 81
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAMD51N20A-AFT ATSAMD51N20A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 81
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAME53N20A-AFT ATSAME53N20A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AFT ATSAME53N20A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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UM4306SM UM4306SM Microchip Technology UM4300Series.pdf Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF
Diode Type: PIN - Single
Capacitance @ Vr, F: 2.2pF @ 100V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 600V
Power Dissipation (Max): 15 W
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UM2101SM UM2101SM Microchip Technology 11315-um2100-series-datasheet Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 175°C
Capacitance @ Vr, F: 2.5pF @ 100V, 1MHz
Resistance @ If, F: 2Ohm @ 100mA, 2MHz
Voltage - Peak Reverse (Max): 100V
Power Dissipation (Max): 15 W
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2N6373 2N6373 Microchip Technology Description: TRANS PNP 60V 6A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 40 W
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PIC32CX1012BZ24032T-E/S8B PIC32CX1012BZ24032T-E/S8B Microchip Technology PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX1012BZ24032T-E/S8B PIC32CX1012BZ24032T-E/S8B Microchip Technology PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3297 шт:
термін постачання 21-31 дні (днів)
2+247.28 грн
25+216.39 грн
100+196.64 грн
Мінімальне замовлення: 2
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PIC32CX1012BZ24032T-I/S8B PIC32CX1012BZ24032T-I/S8B Microchip Technology PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX1012BZ24032T-I/S8B PIC32CX1012BZ24032T-I/S8B Microchip Technology PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3294 шт:
термін постачання 21-31 дні (днів)
2+247.28 грн
25+216.39 грн
100+196.64 грн
Мінімальне замовлення: 2
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BZV55C2V4 BZV55C2V4 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 2.4V DO213AA
Packaging: Bulk
Tolerance: ±8%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.4 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
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CURIOSITY-PIC64GX1000-KIT-ES CURIOSITY-PIC64GX1000-KIT-ES Microchip Technology Description: CURIOSITY PIC64GX1000 KIT ES
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: RISC-V
Utilized IC / Part: PIC64GX1000
Platform: Curiosity
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+12558.94 грн
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VC-826-EDE-KAAN-100M000000TR Microchip Technology VC-826-April-2020.pdf Description: VC-826-EDE-KAAN-100M000000TR
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 17mA
Height - Seated (Max): 0.041" (1.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
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VC-826-EDE-KAAN-100M000000TR Microchip Technology VC-826-April-2020.pdf Description: VC-826-EDE-KAAN-100M000000TR
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 17mA
Height - Seated (Max): 0.041" (1.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
на замовлення 2972 шт:
термін постачання 21-31 дні (днів)
2+269.69 грн
25+216.85 грн
100+197.49 грн
Мінімальне замовлення: 2
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MSCSM120X10CTYZBNMG Microchip Technology MSCSM120X10CTYZBNMG-SiC-MOSFET-module.pdf Description: PM-MOSFET-SIC-SBD-6HPD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 116W (Tc), 196W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 28A (Tc), 49A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 838pF @ 1000V, 1990pF @ 1000V
Rds On (Max) @ Id, Vgs: 100mOhm @ 15A, 20V, 50mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 64nC @ 20V, 137nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA, 2.7V @ 2mA
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MSCSM120VR1M16CT3AG Microchip Technology MSCSM120VR1M16CT3AG-SiC-MOSFET-module-DS00004703.pdf Description: SIC 2N-CH 1200V 173A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 745W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 173A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
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MSCSM120HM16TBL3NG Microchip Technology MSCSM120HM16TBL3NG-SiC-MOSFET-module-DS00004632.pdf Description: SIC 6N-CH 1200V 150A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (Phase Leg)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 560W
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 150A
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
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1N6170AUS/TR 1N6170AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.3A
Voltage - Reverse Standoff (Typ): 114V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 142.5V
Voltage - Clamping (Max) @ Ipp: 206.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6170AUS/TR 1N6170AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.3A
Voltage - Reverse Standoff (Typ): 114V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 142.5V
Voltage - Clamping (Max) @ Ipp: 206.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
1+1422.53 грн
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1N6171US/TR 1N6171US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.9A
Voltage - Reverse Standoff (Typ): 121.6V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 152V
Voltage - Clamping (Max) @ Ipp: 218.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
100+1605.86 грн
Мінімальне замовлення: 100
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1N6171US/TR 1N6171US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.9A
Voltage - Reverse Standoff (Typ): 121.6V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 152V
Voltage - Clamping (Max) @ Ipp: 218.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
1+1729.27 грн
В кошику  од. на суму  грн.
1N6172US/TR 1N6172US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 245.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
100+1605.86 грн
Мінімальне замовлення: 100
В кошику  од. на суму  грн.
1N6172US/TR 1N6172US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 245.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
1+1729.27 грн
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ATXMEGA128A3-MHR Atmel-8068-8-and16-bit-AVR-XMEGA-A3-Microcontrollers_Datasheet.pdf
ATXMEGA128A3-MHR
Виробник: Microchip Technology
Description: IC MCU 8/16BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 8/16-Bit
Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
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ATXMEGA128A3-MHR Atmel-8068-8-and16-bit-AVR-XMEGA-A3-Microcontrollers_Datasheet.pdf
ATXMEGA128A3-MHR
Виробник: Microchip Technology
Description: IC MCU 8/16BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 8/16-Bit
Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
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AT32UC3L0128-D3HT Atmel-32145-32-bit-Flash-MCU-UCL0_datasheet.pdf
AT32UC3L0128-D3HT
Виробник: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TLLGA
Packaging: Tray
Package / Case: 48-UFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-TLLGA (5.5x5.5)
Number of I/O: 36
DigiKey Programmable: Not Verified
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JAN1N6119US lds-0277-1.pdf
JAN1N6119US
Виробник: Microchip Technology
Description: TVS DIODE 27.4VWM 52.4VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 9.5A
Voltage - Reverse Standoff (Typ): 27.4V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 32.49V
Voltage - Clamping (Max) @ Ipp: 52.4V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MIC4128YME-TR MIC4126-27-28-Data-Sheet-20006084A.pdf
MIC4128YME-TR
Виробник: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
на замовлення 602 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+94.78 грн
25+75.27 грн
100+67.82 грн
Мінімальне замовлення: 4
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GC1501-00 GC1500Series.pdf
Виробник: Microchip Technology
Description: SI TVAR NON HERMETIC CHIP
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1pF @ 4V, 1MHz
Q @ Vr, F: 3800 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C30
Supplier Device Package: Chip
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 3.4
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GC15010-00 GC15000.pdf
Виробник: Microchip Technology
Description: SI TVAR NON HERMETIC CHIP
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 2pF @ 20V, 1MHz
Q @ Vr, F: 700 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C20
Supplier Device Package: Chip
Voltage - Peak Reverse (Max): 22 V
Capacitance Ratio: 13.0
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ATMEGA164PA-PU ATmega164A_PA-324A_PA-644A_PA-1284_P_Data-Sheet-40002070B.pdf
ATMEGA164PA-PU
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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1N6073US/TR 1N6073US-1N6081US.pdf
1N6073US/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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1N6073US/TR 1N6073US-1N6081US.pdf
1N6073US/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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JAN1N6073 10971-sa7-53-datasheet
JAN1N6073
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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1N6073 10971-sa7-53-datasheet
1N6073
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 850MA AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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1N6073/TR 10971-sa7-53-datasheet
1N6073/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 850MA
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
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JANTX1N6073 10971-sa7-53-datasheet
JANTX1N6073
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A-PAK
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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JANTXV1N6073 10971-sa7-53-datasheet
JANTXV1N6073
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A-PAK
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 50 V
Qualification: MIL-PRF-19500/503
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MCP60721UT-E/LTY MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60721UT-E/LTY
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SC-70-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+71.44 грн
Мінімальне замовлення: 3000
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MCP60721UT-E/LTY MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60721UT-E/LTY
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SC-70-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3165 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+94.78 грн
25+75.97 грн
100+68.80 грн
Мінімальне замовлення: 4
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MCP60721T-E/OT MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60721T-E/OT
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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MCP60721T-E/OT MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60721T-E/OT
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 2999 шт:
термін постачання 21-31 дні (днів)
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MCP60723T-E/CH MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60723T-E/CH
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP W/ STDN, E
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-6
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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MCP60723T-E/CH MCP6072X-Family-Data-Sheet-DS20006916.pdf
MCP60723T-E/CH
Виробник: Microchip Technology
Description: SINGLE, 10MHZ OP AMP W/ STDN, E
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Single Ended, Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 720µA
Slew Rate: 15V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 0.4 pA
Voltage - Input Offset: 25 µV
Supplier Device Package: SOT-23-6
Number of Circuits: 1
Current - Output / Channel: 57 mA
Voltage - Supply Span (Min): 2.2 V
Voltage - Supply Span (Max): 5.5 V
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AT93C46A-10SU-2.7-T AT93C46A.pdf
AT93C46A-10SU-2.7-T
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT 3-WIRE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MCP9982DT-2E/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-2E/RW
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+52.32 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
MCP9982DT-2E/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-2E/RW
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MCP9982DT-1E/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-1E/RW
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+52.32 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
MCP9982DT-1E/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-1E/RW
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MCP9982DT-1E/A3 MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-1E/A3
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
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MCP9982DT-1E/A3 MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-1E/A3
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2477 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MCP9982DT-2E/A3 MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-2E/A3
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
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MCP9982DT-2E/A3 MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982DT-2E/A3
Виробник: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTI
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2274 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+65.48 грн
25+61.66 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
AT25160A-10TU-1.8 doc3347.pdf
AT25160A-10TU-1.8
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 8TSSOP
Packaging: Tube
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51N20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51N20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AF SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N20A-AF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAMD51N20A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51N20A-AFT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 81
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAMD51N20A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51N20A-AFT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 81
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAME53N20A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N20A-AFT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N20A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N20A-AFT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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UM4306SM UM4300Series.pdf
UM4306SM
Виробник: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF
Diode Type: PIN - Single
Capacitance @ Vr, F: 2.2pF @ 100V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 600V
Power Dissipation (Max): 15 W
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UM2101SM 11315-um2100-series-datasheet
UM2101SM
Виробник: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 175°C
Capacitance @ Vr, F: 2.5pF @ 100V, 1MHz
Resistance @ If, F: 2Ohm @ 100mA, 2MHz
Voltage - Peak Reverse (Max): 100V
Power Dissipation (Max): 15 W
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2N6373
2N6373
Виробник: Microchip Technology
Description: TRANS PNP 60V 6A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 40 W
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PIC32CX1012BZ24032T-E/S8B PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf
PIC32CX1012BZ24032T-E/S8B
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX1012BZ24032T-E/S8B PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf
PIC32CX1012BZ24032T-E/S8B
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3297 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+247.28 грн
25+216.39 грн
100+196.64 грн
Мінімальне замовлення: 2
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PIC32CX1012BZ24032T-I/S8B PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf
PIC32CX1012BZ24032T-I/S8B
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX1012BZ24032T-I/S8B PIC32CX-BZ2-and-WBZ45-Family-Data-Sheet-DS70005504.pdf
PIC32CX1012BZ24032T-I/S8B
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -103dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.2, Zigbee®
Current - Receiving: 20.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24.9mA
Supplier Device Package: 32-VQFN (5x5)
GPIO: 16
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, PWM, SPI, USART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3294 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+247.28 грн
25+216.39 грн
100+196.64 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
BZV55C2V4 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C2V4
Виробник: Microchip Technology
Description: DIODE ZENER 2.4V DO213AA
Packaging: Bulk
Tolerance: ±8%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.4 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
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CURIOSITY-PIC64GX1000-KIT-ES
CURIOSITY-PIC64GX1000-KIT-ES
Виробник: Microchip Technology
Description: CURIOSITY PIC64GX1000 KIT ES
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: RISC-V
Utilized IC / Part: PIC64GX1000
Platform: Curiosity
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12558.94 грн
В кошику  од. на суму  грн.
VC-826-EDE-KAAN-100M000000TR VC-826-April-2020.pdf
Виробник: Microchip Technology
Description: VC-826-EDE-KAAN-100M000000TR
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 17mA
Height - Seated (Max): 0.041" (1.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
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VC-826-EDE-KAAN-100M000000TR VC-826-April-2020.pdf
Виробник: Microchip Technology
Description: VC-826-EDE-KAAN-100M000000TR
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 17mA
Height - Seated (Max): 0.041" (1.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
на замовлення 2972 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+269.69 грн
25+216.85 грн
100+197.49 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MSCSM120X10CTYZBNMG MSCSM120X10CTYZBNMG-SiC-MOSFET-module.pdf
Виробник: Microchip Technology
Description: PM-MOSFET-SIC-SBD-6HPD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (3-Phase Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 116W (Tc), 196W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 28A (Tc), 49A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 838pF @ 1000V, 1990pF @ 1000V
Rds On (Max) @ Id, Vgs: 100mOhm @ 15A, 20V, 50mOhm @ 40A, 20V
Gate Charge (Qg) (Max) @ Vgs: 64nC @ 20V, 137nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 1mA, 2.7V @ 2mA
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MSCSM120VR1M16CT3AG MSCSM120VR1M16CT3AG-SiC-MOSFET-module-DS00004703.pdf
Виробник: Microchip Technology
Description: SIC 2N-CH 1200V 173A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 745W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 173A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
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MSCSM120HM16TBL3NG MSCSM120HM16TBL3NG-SiC-MOSFET-module-DS00004632.pdf
Виробник: Microchip Technology
Description: SIC 6N-CH 1200V 150A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (Phase Leg)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 560W
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 150A
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
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1N6170AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6170AUS/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.3A
Voltage - Reverse Standoff (Typ): 114V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 142.5V
Voltage - Clamping (Max) @ Ipp: 206.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6170AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6170AUS/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.3A
Voltage - Reverse Standoff (Typ): 114V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 142.5V
Voltage - Clamping (Max) @ Ipp: 206.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1422.53 грн
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1N6171US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6171US/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.9A
Voltage - Reverse Standoff (Typ): 121.6V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 152V
Voltage - Clamping (Max) @ Ipp: 218.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+1605.86 грн
Мінімальне замовлення: 100
В кошику  од. на суму  грн.
1N6171US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6171US/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.9A
Voltage - Reverse Standoff (Typ): 121.6V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 152V
Voltage - Clamping (Max) @ Ipp: 218.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1729.27 грн
В кошику  од. на суму  грн.
1N6172US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6172US/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 245.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+1605.86 грн
Мінімальне замовлення: 100
В кошику  од. на суму  грн.
1N6172US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6172US/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 245.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1729.27 грн
В кошику  од. на суму  грн.
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