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USBF1600T-I/MFVAO USBF1600T-I/MFVAO Microchip Technology USBF1600-USB-Firmware-Memory-Data-Sheet-DS20005929A.pdf Description: IC FLASH 16MBIT SPI/QUAD 8WDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WDFN (5x6)
Grade: Automotive
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 2M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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USBF1600T-I/SNVAO USBF1600T-I/SNVAO Microchip Technology USBF1600-USB-Firmware-Memory-Data-Sheet-DS20005929A.pdf Description: IC FLASH 16MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Grade: Automotive
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 2M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MIC94345-MYMT-TR MIC94345-MYMT-TR Microchip Technology MIC94325.pdf Description: IC REG LINEAR 2.8V 500MA 6TDFN
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 250 µA
Voltage - Input (Max): 3.6V
Number of Regulators: 1
Supplier Device Package: 6-TDFN (1.6x1.6)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 85dB ~ 50dB (100Hz ~ 5MHz)
Voltage Dropout (Max): 0.2V @ 500mA
Protection Features: Over Current, Over Temperature
на замовлення 2900 шт:
термін постачання 21-31 дні (днів)
10+35.42 грн
25+28.34 грн
100+24.88 грн
Мінімальне замовлення: 10
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2N6377 2N6377 Microchip Technology Description: PNP TRANSISTOR
Packaging: Bulk
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AVR64EA28-E/SS AVR64EA28-E/SS Microchip Technology AVR64EA-28-32-48-DataSheet-DS40002443.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
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AVR64EA28T-I/SO AVR64EA28T-I/SO Microchip Technology AVR64EA-28-32-48-DataSheet-DS40002443.pdf Description: 64KB, RWW, 6KB RAM, 28P SOIC, 85
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
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DSC1001DL2-032.0000 DSC1001DL2-032.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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DSC1121DL2-032.0000 DSC1121DL2-032.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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VCC6-VCF-200M000000 Microchip Technology VCC6-April-2020.pdf Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-212M500000 Microchip Technology VCC6-April-2020.pdf Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-250M000000 Microchip Technology VCC6-April-2020.pdf Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-25M0000000 Microchip Technology VCC6-April-2020.pdf Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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PIC18F26Q24T-I/STX PIC18F26Q24T-I/STX Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+95.81 грн
Мінімальне замовлення: 3300
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PIC18F26Q24T-I/STX PIC18F26Q24T-I/STX Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28VFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3+109.47 грн
25+96.68 грн
100+92.27 грн
Мінімальне замовлення: 3
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PIC18F26Q24T-I/SS PIC18F26Q24T-I/SS Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
2100+102.52 грн
Мінімальне замовлення: 2100
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PIC18F26Q24T-I/SS PIC18F26Q24T-I/SS Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
3+115.11 грн
25+101.85 грн
100+98.72 грн
Мінімальне замовлення: 3
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1N2228A 1N2228A Microchip Technology S%2CR20.pdf Description: DIODE GEN PURP 50V 16A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 16A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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JAN1N6169AUS JAN1N6169AUS Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 98.8VWM 178.8V SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 98.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 123.5V
Voltage - Clamping (Max) @ Ipp: 178.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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BR230D-290B1-28V-018L Microchip Technology Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Chassis Mount
Coil Voltage: 28VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Solder Hook
Relay Type: General Purpose
Coil Current: 96.6 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 5.1 VDC
Must Operate Voltage: 18 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
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BR230D-890C1-48V-026L Microchip Technology Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Through Hole
Coil Voltage: 48VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Plug In
Relay Type: General Purpose
Coil Current: 53.9 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 11 VDC
Must Operate Voltage: 36 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
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JAN1N6322US JAN1N6322US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 8.2V 500MW MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 6 V
Qualification: MIL-PRF-19500/533
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AVR16DU20T-I/REB AVR16DU20T-I/REB Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 14
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AVR16DU20T-I/REB AVR16DU20T-I/REB Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 14
на замовлення 3270 шт:
термін постачання 21-31 дні (днів)
5+78.89 грн
25+69.45 грн
100+62.82 грн
Мінімальне замовлення: 5
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AVR16DU14T-I/SL AVR16DU14T-I/SL Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 5x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 8
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AVR16DU14T-I/SL AVR16DU14T-I/SL Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 5x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 8
на замовлення 2597 шт:
термін постачання 21-31 дні (днів)
4+82.91 грн
25+73.48 грн
100+70.25 грн
Мінімальне замовлення: 4
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AVR16DU28T-I/STX Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 20
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+74.82 грн
Мінімальне замовлення: 3300
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AVR16DU28T-I/STX Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 20
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
4+85.33 грн
25+75.65 грн
100+72.05 грн
Мінімальне замовлення: 4
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AVR16DU28T-I/SS AVR16DU28T-I/SS Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 20
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
2100+85.27 грн
Мінімальне замовлення: 2100
В кошику  од. на суму  грн.
AVR16DU28T-I/SS AVR16DU28T-I/SS Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 20
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
4+97.40 грн
25+85.61 грн
100+82.11 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
AVR16DU32T-I/RXB AVR16DU32T-I/RXB Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 24
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+84.17 грн
Мінімальне замовлення: 5000
В кошику  од. на суму  грн.
AVR16DU32T-I/RXB AVR16DU32T-I/RXB Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 24
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
4+95.79 грн
25+85.02 грн
100+81.06 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
AVR16DU32T-I/PT AVR16DU32T-I/PT Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1600+88.85 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
AVR16DU32T-I/PT AVR16DU32T-I/PT Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
4+100.62 грн
25+87.90 грн
100+85.56 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
JAN1N5807/TR JAN1N5807/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 50V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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1N5807/TR 1N5807/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JANTX1N5807/TR JANTX1N5807/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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1N5807US/TR 1N5807US/TR Microchip Technology Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JAN1N5807US/TR JAN1N5807US/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTX1N5807US/TR JANTX1N5807US/TR Microchip Technology Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807US/TR JANTXV1N5807US/TR Microchip Technology Description: DIODE GEN PURP 50V 3A D-5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807/TR JANTXV1N5807/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JAN1N5807URS/TR JAN1N5807URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANHCE1N5807 Microchip Technology Description: DIODE GEN PURP 50V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTX1N5807URS/TR JANTX1N5807URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807URS/TR JANTXV1N5807URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANS1N5807 JANS1N5807 Microchip Technology Description: DIODE GEN PURP 50V 6A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807/TR JANS1N5807/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 50V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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1N5807URS 1N5807URS Microchip Technology Description: DIODE GEN PURP 50V 3A SQ-MELF B
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JANS1N5807US JANS1N5807US Microchip Technology Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807US/TR JANS1N5807US/TR Microchip Technology Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807URS JANS1N5807URS Microchip Technology Description: DIODE GEN PURP 50V 6A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807URS/TR JANS1N5807URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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DSC6101MI1B-019.2000 DSC6101MI1B-019.2000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6011MI2B-019.2000 DSC6011MI2B-019.2000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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UZ211 UZ211 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Supplier Device Package: A, Axial
Power - Max: 3 W
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MIC2155YML-TR MIC2155YML-TR Microchip Technology MIC2155-Two-Phase-Single-Output-PWM-Synchronous-Buck-Control-IC-Data-Sheet-20006106A.pdf Description: IC REG CTRLR BUCK 32MLF
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 500kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 14.5V
Supplier Device Package: 32-QFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Enable, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 80%
Clock Sync: Yes
Number of Outputs: 2
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MIC2155YML-TR MIC2155YML-TR Microchip Technology MIC2155-Two-Phase-Single-Output-PWM-Synchronous-Buck-Control-IC-Data-Sheet-20006106A.pdf Description: IC REG CTRLR BUCK 32MLF
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 500kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 14.5V
Supplier Device Package: 32-QFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Enable, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 80%
Clock Sync: Yes
Number of Outputs: 2
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PIC16F15213T-E/SN PIC16F15213T-E/SN Microchip Technology PIC16F15213-14-23-24-43-44-Microcontroller-Data-Sheet-40002195.pdf Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
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PIC16F15213T-E/SN PIC16F15213T-E/SN Microchip Technology PIC16F15213-14-23-24-43-44-Microcontroller-Data-Sheet-40002195.pdf Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
на замовлення 1957 шт:
термін постачання 21-31 дні (днів)
10+34.61 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
BZV55C9V1 BZV55C9V1 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 9.1V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
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USBF1600T-I/MFVAO USBF1600-USB-Firmware-Memory-Data-Sheet-DS20005929A.pdf
USBF1600T-I/MFVAO
Виробник: Microchip Technology
Description: IC FLASH 16MBIT SPI/QUAD 8WDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WDFN (5x6)
Grade: Automotive
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 2M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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USBF1600T-I/SNVAO USBF1600-USB-Firmware-Memory-Data-Sheet-DS20005929A.pdf
USBF1600T-I/SNVAO
Виробник: Microchip Technology
Description: IC FLASH 16MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Grade: Automotive
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 2M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MIC94345-MYMT-TR MIC94325.pdf
MIC94345-MYMT-TR
Виробник: Microchip Technology
Description: IC REG LINEAR 2.8V 500MA 6TDFN
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 250 µA
Voltage - Input (Max): 3.6V
Number of Regulators: 1
Supplier Device Package: 6-TDFN (1.6x1.6)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 85dB ~ 50dB (100Hz ~ 5MHz)
Voltage Dropout (Max): 0.2V @ 500mA
Protection Features: Over Current, Over Temperature
на замовлення 2900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+35.42 грн
25+28.34 грн
100+24.88 грн
Мінімальне замовлення: 10
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2N6377
2N6377
Виробник: Microchip Technology
Description: PNP TRANSISTOR
Packaging: Bulk
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AVR64EA28-E/SS AVR64EA-28-32-48-DataSheet-DS40002443.pdf
AVR64EA28-E/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
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AVR64EA28T-I/SO AVR64EA-28-32-48-DataSheet-DS40002443.pdf
AVR64EA28T-I/SO
Виробник: Microchip Technology
Description: 64KB, RWW, 6KB RAM, 28P SOIC, 85
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
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DSC1001DL2-032.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-032.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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DSC1121DL2-032.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121DL2-032.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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VCC6-VCF-200M000000 VCC6-April-2020.pdf
Виробник: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-212M500000 VCC6-April-2020.pdf
Виробник: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-250M000000 VCC6-April-2020.pdf
Виробник: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC6-VCF-25M0000000 VCC6-April-2020.pdf
Виробник: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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PIC18F26Q24T-I/STX PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/STX
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+95.81 грн
Мінімальне замовлення: 3300
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PIC18F26Q24T-I/STX PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/STX
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28VFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+109.47 грн
25+96.68 грн
100+92.27 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC18F26Q24T-I/SS PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2100+102.52 грн
Мінімальне замовлення: 2100
В кошику  од. на суму  грн.
PIC18F26Q24T-I/SS PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+115.11 грн
25+101.85 грн
100+98.72 грн
Мінімальне замовлення: 3
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1N2228A S%2CR20.pdf
1N2228A
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 16A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 16A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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JAN1N6169AUS 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
JAN1N6169AUS
Виробник: Microchip Technology
Description: TVS DIODE 98.8VWM 178.8V SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 98.8V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 123.5V
Voltage - Clamping (Max) @ Ipp: 178.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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BR230D-290B1-28V-018L
Виробник: Microchip Technology
Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Chassis Mount
Coil Voltage: 28VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Solder Hook
Relay Type: General Purpose
Coil Current: 96.6 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 5.1 VDC
Must Operate Voltage: 18 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
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BR230D-890C1-48V-026L
Виробник: Microchip Technology
Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Through Hole
Coil Voltage: 48VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Plug In
Relay Type: General Purpose
Coil Current: 53.9 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 11 VDC
Must Operate Voltage: 36 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
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JAN1N6322US 11083-lds-0193-1-datasheet
JAN1N6322US
Виробник: Microchip Technology
Description: DIODE ZENER 8.2V 500MW MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 6 V
Qualification: MIL-PRF-19500/533
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AVR16DU20T-I/REB AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU20T-I/REB
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 14
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AVR16DU20T-I/REB AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU20T-I/REB
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 14
на замовлення 3270 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+78.89 грн
25+69.45 грн
100+62.82 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
AVR16DU14T-I/SL AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU14T-I/SL
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 5x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 8
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AVR16DU14T-I/SL AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU14T-I/SL
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 5x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 8
на замовлення 2597 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+82.91 грн
25+73.48 грн
100+70.25 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
AVR16DU28T-I/STX AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 20
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+74.82 грн
Мінімальне замовлення: 3300
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AVR16DU28T-I/STX AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 20
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+85.33 грн
25+75.65 грн
100+72.05 грн
Мінімальне замовлення: 4
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AVR16DU28T-I/SS AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU28T-I/SS
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 20
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2100+85.27 грн
Мінімальне замовлення: 2100
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AVR16DU28T-I/SS AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU28T-I/SS
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 20
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+97.40 грн
25+85.61 грн
100+82.11 грн
Мінімальне замовлення: 4
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AVR16DU32T-I/RXB AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU32T-I/RXB
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 24
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+84.17 грн
Мінімальне замовлення: 5000
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AVR16DU32T-I/RXB AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU32T-I/RXB
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 24
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+95.79 грн
25+85.02 грн
100+81.06 грн
Мінімальне замовлення: 4
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AVR16DU32T-I/PT AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU32T-I/PT
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+88.85 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
AVR16DU32T-I/PT AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU32T-I/PT
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 21x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 24
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+100.62 грн
25+87.90 грн
100+85.56 грн
Мінімальне замовлення: 4
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JAN1N5807/TR 123509-lds-0168-datasheet
JAN1N5807/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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1N5807/TR 123509-lds-0168-datasheet
1N5807/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JANTX1N5807/TR 123509-lds-0168-datasheet
JANTX1N5807/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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1N5807US/TR
1N5807US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JAN1N5807US/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JAN1N5807US/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTX1N5807US/TR
JANTX1N5807US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807US/TR
JANTXV1N5807US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A D-5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807/TR 123509-lds-0168-datasheet
JANTXV1N5807/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JAN1N5807URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JAN1N5807URS/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANHCE1N5807
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTX1N5807URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANTX1N5807URS/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5807URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANTXV1N5807URS/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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JANS1N5807
JANS1N5807
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 6A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807/TR 123509-lds-0168-datasheet
JANS1N5807/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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1N5807URS
1N5807URS
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A SQ-MELF B
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
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JANS1N5807US
JANS1N5807US
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807US/TR
JANS1N5807US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807URS
JANS1N5807URS
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 6A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANS1N5807URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANS1N5807URS/TR
Виробник: Microchip Technology
Description: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 50 V
Qualification: MIL-PRF-19500/477
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DSC6101MI1B-019.2000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101MI1B-019.2000
Виробник: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC6011MI2B-019.2000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011MI2B-019.2000
Виробник: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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UZ211
UZ211
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Supplier Device Package: A, Axial
Power - Max: 3 W
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MIC2155YML-TR MIC2155-Two-Phase-Single-Output-PWM-Synchronous-Buck-Control-IC-Data-Sheet-20006106A.pdf
MIC2155YML-TR
Виробник: Microchip Technology
Description: IC REG CTRLR BUCK 32MLF
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 500kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 14.5V
Supplier Device Package: 32-QFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Enable, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 80%
Clock Sync: Yes
Number of Outputs: 2
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MIC2155YML-TR MIC2155-Two-Phase-Single-Output-PWM-Synchronous-Buck-Control-IC-Data-Sheet-20006106A.pdf
MIC2155YML-TR
Виробник: Microchip Technology
Description: IC REG CTRLR BUCK 32MLF
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 500kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 14.5V
Supplier Device Package: 32-QFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Enable, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 80%
Clock Sync: Yes
Number of Outputs: 2
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PIC16F15213T-E/SN PIC16F15213-14-23-24-43-44-Microcontroller-Data-Sheet-40002195.pdf
PIC16F15213T-E/SN
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
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PIC16F15213T-E/SN PIC16F15213-14-23-24-43-44-Microcontroller-Data-Sheet-40002195.pdf
PIC16F15213T-E/SN
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
на замовлення 1957 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+34.61 грн
Мінімальне замовлення: 10
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BZV55C9V1 8298-bzv55-c2v4-c75-datasheet
BZV55C9V1
Виробник: Microchip Technology
Description: DIODE ZENER 9.1V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
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