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ATMXT144UD-AMBI2CVAO ATMXT144UD-AMBI2CVAO Microchip Technology Description: MAXTOUCH TOUCHSCREEN CTLR QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Touchscreen: 2 Wire Capacitive
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ATMXT144UD-AMTRI2CVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBSLI2CVA1 Microchip Technology Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.14V ~ 3.47V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTRSPIVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTSPIVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTI2CVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBSPIVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRI2CVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRSPIVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBI2CVA1 Microchip Technology mXT144UD_Touchscreen_Controller_Product_Brief.pdf Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRSLI2CVA1 Microchip Technology Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.14V ~ 3.47V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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PIC16F18176-E/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
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PIC16F18176-E/PT PIC16F18176-E/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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VXM7-9060-16M3840000TR VXM7-9060-16M3840000TR Microchip Technology VXM7-Website-April-2020.pdf Description: VXM7-9060-16M3840000TR
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 80 Ohms
Frequency: 16.384 MHz
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
1000+19.28 грн
Мінімальне замовлення: 1000
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VXM7-9060-16M3840000TR VXM7-9060-16M3840000TR Microchip Technology VXM7-Website-April-2020.pdf Description: VXM7-9060-16M3840000TR
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 80 Ohms
Frequency: 16.384 MHz
на замовлення 5989 шт:
термін постачання 21-31 дні (днів)
14+23.85 грн
25+22.74 грн
Мінімальне замовлення: 14
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CD-700-KAC-HCB-16M3840000 Microchip Technology Description: CD-700-KAC-HCB-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 16-CSMD, No Lead
Mounting Type: Surface Mount
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CD-700-LAC-GCB-16M3840000 Microchip Technology Description: CD-700-LAC-GCB-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 16-CSMD, No Lead
Mounting Type: Surface Mount
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VCC1-C3C-16M3840000 Microchip Technology 1243793-vcc1 Description: VCC1-C3C-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±100ppm
Voltage - Supply: 3V
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 16.384 MHz
Base Resonator: Crystal
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A40MX04-PL44I A40MX04-PL44I Microchip Technology 130699-ds2136-40mx-and-42mx-fpga-families-datasheet Description: IC FPGA 34 I/O 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MASMCG64A Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG64Ae3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0A MASMCG7.0A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 7VWM 12VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0Ae3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 7VWM 12VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG64CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 7VWM 12VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N6141AUS JAN1N6141AUS Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 6.9VWM 13.4VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 111.9A
Voltage - Reverse Standoff (Typ): 6.9V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.65V
Voltage - Clamping (Max) @ Ipp: 13.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N5647A JANTX1N5647A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 33.3VWM 53.9VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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M15KP24A M15KP24A Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 24VWM 40.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 369A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 40.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP26CA M15KP26CA Microchip Technology 9460-rf01011-m15kp-rev-e Description: TVS DIODE 26VWM 44VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 341A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP26CAE3 M15KP26CAE3 Microchip Technology 9460-rf01011-m15kp-rev-e Description: TVS DIODE 26VWM 44VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 341A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP220A M15KP220A Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 220VWM 356VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42A
Voltage - Reverse Standoff (Typ): 220V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 245V
Voltage - Clamping (Max) @ Ipp: 356V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP220Ae3 M15KP220Ae3 Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 220VWM 356VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42A
Voltage - Reverse Standoff (Typ): 220V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 245V
Voltage - Clamping (Max) @ Ipp: 356V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP240Ae3 M15KP240Ae3 Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 240VWM 388VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 39A
Voltage - Reverse Standoff (Typ): 240V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 267V
Voltage - Clamping (Max) @ Ipp: 388V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP260A M15KP260A Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 260VWM 419VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 260V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 289V
Voltage - Clamping (Max) @ Ipp: 419V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP260Ae3 M15KP260Ae3 Microchip Technology 9460-rf01011-m15kp-rev-e-datasheet Description: TVS DIODE 260VWM 419VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 260V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 289V
Voltage - Clamping (Max) @ Ipp: 419V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC18F27Q10T-E/STX Microchip Technology Description: 128KB FLASH, 3.6KB RAM, 256B EEP
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3.53K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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WP34C2R4NFEI-400B2 Microchip Technology 2110882_WinPath3_pb_127961.pdf Description: WP3 4C2R4 400 MHZ, LF BALLS, PBF
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-B1BGA (31x31)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+13888.92 грн
25+11116.56 грн
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WP32C2M6NELI-450B2 Microchip Technology Description: WP3 2C2M6 450 MHZ, LF BALLS, PBF
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-B1BGA (31x31)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+53474.17 грн
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SAM9X75D2GT-I/4TB SAM9X75D2GT-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tape & Reel (TR)
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2GT-I/4TB SAM9X75D2GT-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Cut Tape (CT)
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
на замовлення 465 шт:
термін постачання 21-31 дні (днів)
1+1778.88 грн
25+1427.58 грн
100+1378.86 грн
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SAMA7G54D2GT-I/4UB SAMA7G54D2GT-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2GT-I/4UB SAMA7G54D2GT-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Cut Tape (CT)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
на замовлення 744 шт:
термін постачання 21-31 дні (днів)
1+1094.63 грн
25+966.69 грн
100+875.66 грн
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M15KP90CA/TR M15KP90CA/TR Microchip Technology Description: TVS 90V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP90CA MAPLAD15KP90CA Microchip Technology 9522-mplad15kp-datasheet Description: TVS DIODE 90VWM 146VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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UES1001 UES1001 Microchip Technology Description: DIODE GEN PURP 50V 1A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1001/TR UES1001/TR Microchip Technology Description: DIODE GEN PURP 50V 1A A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1002/TR UES1002/TR Microchip Technology Description: DIODE GEN PURP 100V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1002SM UES1002SM Microchip Technology Description: DIODE GEN PURP A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Supplier Device Package: A, Axial
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1003SM-1 UES1003SM-1 Microchip Technology Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 150 V
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UES1002SM-1 UES1002SM-1 Microchip Technology Description: DIODE GEN PURP 100V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1001SM UES1001SM Microchip Technology Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 50 V
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UES1003SM/TR Microchip Technology Description: RECTIFIER UFR,FRR
Packaging: Tape & Reel (TR)
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UES1002SM/TR UES1002SM/TR Microchip Technology Description: DIODE GEN PURP A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Supplier Device Package: A, Axial
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1002SM-1/TR UES1002SM-1/TR Microchip Technology Description: DIODE GEN PURP 100V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1001SM/TR UES1001SM/TR Microchip Technology Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 50 V
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UES1003SM-1/TR UES1003SM-1/TR Microchip Technology Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 150 V
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UES1003 UES1003 Microchip Technology Description: DIODE GEN PURP 150V 1A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1003/TR UES1003/TR Microchip Technology Description: DIODE GEN PURP 150V 1A A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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MPLAD7.5KP13A/TR Microchip Technology Description: 13V, 5%, 8000W, UNI, MINI-PLAD,
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13A M5KP13A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATMXT144UD-AMBI2CVAO
ATMXT144UD-AMBI2CVAO
Виробник: Microchip Technology
Description: MAXTOUCH TOUCHSCREEN CTLR QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Touchscreen: 2 Wire Capacitive
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ATMXT144UD-AMTRI2CVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBSLI2CVA1
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.14V ~ 3.47V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTRSPIVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTSPIVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMTI2CVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBSPIVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRI2CVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRSPIVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBI2CVA1 mXT144UD_Touchscreen_Controller_Product_Brief.pdf
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT144UD-AMBRSLI2CVA1
Виробник: Microchip Technology
Description: 144NODE MAXTOUCH
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.14V ~ 3.47V
Supplier Device Package: 56-VQFN (7x7)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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PIC16F18176-E/MP
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
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PIC16F18176-E/PT
PIC16F18176-E/PT
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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VXM7-9060-16M3840000TR VXM7-Website-April-2020.pdf
VXM7-9060-16M3840000TR
Виробник: Microchip Technology
Description: VXM7-9060-16M3840000TR
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 80 Ohms
Frequency: 16.384 MHz
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+19.28 грн
Мінімальне замовлення: 1000
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VXM7-9060-16M3840000TR VXM7-Website-April-2020.pdf
VXM7-9060-16M3840000TR
Виробник: Microchip Technology
Description: VXM7-9060-16M3840000TR
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 80 Ohms
Frequency: 16.384 MHz
на замовлення 5989 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+23.85 грн
25+22.74 грн
Мінімальне замовлення: 14
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CD-700-KAC-HCB-16M3840000
Виробник: Microchip Technology
Description: CD-700-KAC-HCB-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 16-CSMD, No Lead
Mounting Type: Surface Mount
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CD-700-LAC-GCB-16M3840000
Виробник: Microchip Technology
Description: CD-700-LAC-GCB-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 16-CSMD, No Lead
Mounting Type: Surface Mount
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VCC1-C3C-16M3840000 1243793-vcc1
Виробник: Microchip Technology
Description: VCC1-C3C-16M3840000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±100ppm
Voltage - Supply: 3V
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 16.384 MHz
Base Resonator: Crystal
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A40MX04-PL44I 130699-ds2136-40mx-and-42mx-fpga-families-datasheet
A40MX04-PL44I
Виробник: Microchip Technology
Description: IC FPGA 34 I/O 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MASMCG64A 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG64Ae3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0A rf01001_rev_b_final-pd-000307351.pdf
MASMCG7.0A
Виробник: Microchip Technology
Description: TVS DIODE 7VWM 12VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0Ae3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 7VWM 12VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG64CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 64VWM 103VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG7.0CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 7VWM 12VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N6141AUS 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
JAN1N6141AUS
Виробник: Microchip Technology
Description: TVS DIODE 6.9VWM 13.4VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 111.9A
Voltage - Reverse Standoff (Typ): 6.9V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.65V
Voltage - Clamping (Max) @ Ipp: 13.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N5647A LDS-0096-REV3.pdf
JANTX1N5647A
Виробник: Microchip Technology
Description: TVS DIODE 33.3VWM 53.9VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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M15KP24A 9460-rf01011-m15kp-rev-e-datasheet
M15KP24A
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 40.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 369A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 40.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP26CA 9460-rf01011-m15kp-rev-e
M15KP26CA
Виробник: Microchip Technology
Description: TVS DIODE 26VWM 44VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 341A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP26CAE3 9460-rf01011-m15kp-rev-e
M15KP26CAE3
Виробник: Microchip Technology
Description: TVS DIODE 26VWM 44VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 341A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP220A 9460-rf01011-m15kp-rev-e-datasheet
M15KP220A
Виробник: Microchip Technology
Description: TVS DIODE 220VWM 356VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42A
Voltage - Reverse Standoff (Typ): 220V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 245V
Voltage - Clamping (Max) @ Ipp: 356V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP220Ae3 9460-rf01011-m15kp-rev-e-datasheet
M15KP220Ae3
Виробник: Microchip Technology
Description: TVS DIODE 220VWM 356VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42A
Voltage - Reverse Standoff (Typ): 220V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 245V
Voltage - Clamping (Max) @ Ipp: 356V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP240Ae3 9460-rf01011-m15kp-rev-e-datasheet
M15KP240Ae3
Виробник: Microchip Technology
Description: TVS DIODE 240VWM 388VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 39A
Voltage - Reverse Standoff (Typ): 240V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 267V
Voltage - Clamping (Max) @ Ipp: 388V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP260A 9460-rf01011-m15kp-rev-e-datasheet
M15KP260A
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 419VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 260V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 289V
Voltage - Clamping (Max) @ Ipp: 419V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP260Ae3 9460-rf01011-m15kp-rev-e-datasheet
M15KP260Ae3
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 419VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 260V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 289V
Voltage - Clamping (Max) @ Ipp: 419V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC18F27Q10T-E/STX
Виробник: Microchip Technology
Description: 128KB FLASH, 3.6KB RAM, 256B EEP
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3.53K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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WP34C2R4NFEI-400B2 2110882_WinPath3_pb_127961.pdf
Виробник: Microchip Technology
Description: WP3 4C2R4 400 MHZ, LF BALLS, PBF
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-B1BGA (31x31)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13888.92 грн
25+11116.56 грн
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WP32C2M6NELI-450B2
Виробник: Microchip Technology
Description: WP3 2C2M6 450 MHZ, LF BALLS, PBF
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-B1BGA (31x31)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+53474.17 грн
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SAM9X75D2GT-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D2GT-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tape & Reel (TR)
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2GT-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D2GT-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Cut Tape (CT)
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
на замовлення 465 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1778.88 грн
25+1427.58 грн
100+1378.86 грн
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SAMA7G54D2GT-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D2GT-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2GT-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D2GT-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Cut Tape (CT)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
на замовлення 744 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1094.63 грн
25+966.69 грн
100+875.66 грн
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M15KP90CA/TR
M15KP90CA/TR
Виробник: Microchip Technology
Description: TVS 90V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP90CA 9522-mplad15kp-datasheet
MAPLAD15KP90CA
Виробник: Microchip Technology
Description: TVS DIODE 90VWM 146VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 102A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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UES1001
UES1001
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 1A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1001/TR
UES1001/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 1A A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1002/TR
UES1002/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 100V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1002SM
UES1002SM
Виробник: Microchip Technology
Description: DIODE GEN PURP A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Supplier Device Package: A, Axial
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1003SM-1
UES1003SM-1
Виробник: Microchip Technology
Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 150 V
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UES1002SM-1
UES1002SM-1
Виробник: Microchip Technology
Description: DIODE GEN PURP 100V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1001SM
UES1001SM
Виробник: Microchip Technology
Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 50 V
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UES1003SM/TR
Виробник: Microchip Technology
Description: RECTIFIER UFR,FRR
Packaging: Tape & Reel (TR)
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UES1002SM/TR
UES1002SM/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Supplier Device Package: A, Axial
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1002SM-1/TR
UES1002SM-1/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 100V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 100 V
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UES1001SM/TR
UES1001SM/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 50 V
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UES1003SM-1/TR
UES1003SM-1/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 1A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 150 V
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UES1003
UES1003
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 1A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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UES1003/TR
UES1003/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 1A A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 975 mV @ 1 A
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MPLAD7.5KP13A/TR
Виробник: Microchip Technology
Description: 13V, 5%, 8000W, UNI, MINI-PLAD,
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13A 9461-m5kp-pdf
M5KP13A
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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