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JAN1N4621UR-1/TR JAN1N4621UR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621UR-1/TR JANTX1N4621UR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621UR-1/TR JANTXV1N4621UR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANHCA1N4621 Microchip Technology Description: DIODE ZENER 3.6V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4621CUR-1/TR JAN1N4621CUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4621DUR-1/TR JAN1N4621DUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621CUR-1/TR JANTX1N4621CUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621DUR-1/TR JANTX1N4621DUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621CUR-1/TR JANTXV1N4621CUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621DUR-1/TR JANTXV1N4621DUR-1/TR Microchip Technology Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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1N4622-1/TR 1N4622-1/TR Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 3.9V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
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1N4622/TR 1N4622/TR Microchip Technology Description: DIODE ZENER 3.9V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
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JANTX1N4622-1/TR JANTX1N4622-1/TR Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4622UR-1/TR JAN1N4622UR-1/TR Microchip Technology Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622C-1/TR JANTX1N4622C-1/TR Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622D-1/TR JANTX1N4622D-1/TR Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622CUR-1/TR JANTX1N4622CUR-1/TR Microchip Technology Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622DUR-1/TR JANTX1N4622DUR-1/TR Microchip Technology Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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CD3825A CD3825A Microchip Technology 8361-cd3821-cd3828a-datasheet Description: DIODE ZENER 4.7V DIE
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: Die
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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1N3825A-1/TR 1N3825A-1/TR Microchip Technology 5797-1n3821a-3828a-datasheet Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
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JAN1N3825A-1 JAN1N3825A-1 Microchip Technology 5797-1n3821a-3828a-datasheet Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JAN1N3825A-1/TR JAN1N3825A-1/TR Microchip Technology Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JANTX1N3825A-1/TR JANTX1N3825A-1/TR Microchip Technology Description: DIODE ZENER 4.7V 1W DO41
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: MIL-PRF-19500/115
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1N3825AUR-1/TR 1N3825AUR-1/TR Microchip Technology 1N3821AUR-1-1N3828AUR-1.pdf Description: DIODE ZENER 4.7V 1.5W DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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1N3825AUR-1/TR 1N3825AUR-1/TR Microchip Technology 1N3821AUR-1-1N3828AUR-1.pdf Description: DIODE ZENER 4.7V 1.5W DO213AB
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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JANTXV1N3825A-1/TR JANTXV1N3825A-1/TR Microchip Technology Description: DIODE ZENER 16V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 12.2 V
Qualification: MIL-PRF-19500/115
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ATMEGA3250A-AN ATMEGA3250A-AN Microchip Technology Atmel-8285-8-bit-AVR-Microcontroller-ATmega165A_PA_325A_PA_3250A_PA_645A_P_6450A_P_datasheet_Summary.pdf Description: IC MCU 8BIT 32KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MPLAD7.5KP13CAe3 MPLAD7.5KP13CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP13CA MPLAD7.5KP13CA Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13CA M5KP13CA Microchip Technology rf01010_rb.pdf Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13CAe3 M5KP13CAe3 Microchip Technology rf01010_rb.pdf Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP13CAe3 Microchip Technology rf01083_rev_b.pdf Description: TVS DIODE 13VWM 21.5VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP13CA Microchip Technology rf01083_rev_b.pdf Description: TVS DIODE 13VWM 21.5VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP13CAe3 MAPLAD7.5KP13CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP13CA MAPLAD7.5KP13CA Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP13CAe3 MXLPLAD6.5KP13CAe3 Microchip Technology rf01083_rev_b.pdf Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP13CAe3 MXLPLAD7.5KP13CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP13CA MA5KP13CA Microchip Technology rf01010_rb.pdf Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 233A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP13CAe3 MA5KP13CAe3 Microchip Technology rf01010_rb.pdf Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 233A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP13CAe3 MXPLAD6.5KP13CAe3 Microchip Technology rf01083_rev_b.pdf Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP13CAe3 MXPLAD7.5KP13CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP13CA MAPLAD15KP13CA Microchip Technology mplad15kp.pdf Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 696A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP13CAe3 MAPLAD15KP13CAe3 Microchip Technology mplad15kp.pdf Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 696A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AVR64DA64S-I/PT AVR64DA64S-I/PT Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-I/PT AVR64DA64ST-I/PT Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-E/5LX AVR64DA64ST-E/5LX Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64ST-E/PT AVR64DA64ST-E/PT Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64S-I/5LX AVR64DA64S-I/5LX Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64S-E/5LX AVR64DA64S-E/5LX Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64S-E/PT AVR64DA64S-E/PT Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-I/5LX AVR64DA64ST-I/5LX Microchip Technology Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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PIC32CM5164JH01048-I/U5B-SL3 PIC32CM5164JH01048-I/U5B-SL3 Microchip Technology PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf Description: 48QFN, 512KB FLASH, 48MHZ, TRAY,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM5164LS00048-I/U5B-SL3 PIC32CM5164LS00048-I/U5B-SL3 Microchip Technology 60001615E.pdf Description: QFN 48, 512 KB FLASH, 64 KB SRAM
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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DSC1001BL5-016.0000 DSC1001BL5-016.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
на замовлення 560 шт:
термін постачання 21-31 дні (днів)
2+224.52 грн
10+210.82 грн
50+207.40 грн
Мінімальне замовлення: 2
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PIC24FJ1024GB610T-I/PT PIC24FJ1024GB610T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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PIC24FJ1024GB610T-I/PT PIC24FJ1024GB610T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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ZL40294LDF6 ZL40294LDF6 Microchip Technology ZL40294-20-Output-DB2000QL-Buffer-with-Ultra-Low-Additive-Jitter-DS20006768.pdf Description: 20-OUTPUT DB2000QL BUFFER
Packaging: Tape & Reel (TR)
Package / Case: 80-WFQFN Dual Rows, Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-GQFN (6x6)
Number of Circuits: 1
Frequency - Max: 250 MHz
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ZL40294LDF6 ZL40294LDF6 Microchip Technology ZL40294-20-Output-DB2000QL-Buffer-with-Ultra-Low-Additive-Jitter-DS20006768.pdf Description: 20-OUTPUT DB2000QL BUFFER
Packaging: Cut Tape (CT)
Package / Case: 80-WFQFN Dual Rows, Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-GQFN (6x6)
Number of Circuits: 1
Frequency - Max: 250 MHz
на замовлення 3490 шт:
термін постачання 21-31 дні (днів)
3+132.41 грн
25+106.03 грн
100+102.61 грн
Мінімальне замовлення: 3
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MCP6567-E/SNVAO MCP6567-E/SNVAO Microchip Technology MCP6566-6R-6U-7-9-1.8V-Low-Power-Open-Drain-Output-Comparator-DS20002143G.pdf Description: DUAL 1.8V OPEN DRAIN COMPARATOR,
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: CMOS, Open-Drain, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Single/Dual (±): 1.8V ~ 5.5V
Supplier Device Package: 8-SOIC
Propagation Delay (Max): 80ns
Current - Quiescent (Max): 130µA
Voltage - Input Offset (Max): 10mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 30mA
CMRR, PSRR (Typ): 66dB CMRR, 70dB PSRR
Hysteresis: 5mV
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UTX4110 UTX4110 Microchip Technology Description: DIODE STANDARD 100V 4A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 100 ns
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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JAN1N4621UR-1/TR
JAN1N4621UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621UR-1/TR
JANTX1N4621UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621UR-1/TR
JANTXV1N4621UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANHCA1N4621
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4621CUR-1/TR
JAN1N4621CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4621DUR-1/TR
JAN1N4621DUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621CUR-1/TR
JANTX1N4621CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4621DUR-1/TR
JANTX1N4621DUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621CUR-1/TR
JANTXV1N4621CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTXV1N4621DUR-1/TR
JANTXV1N4621DUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 1700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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1N4622-1/TR 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
1N4622-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
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1N4622/TR
1N4622/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO7
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-7
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
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JANTX1N4622-1/TR 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
JANTX1N4622-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JAN1N4622UR-1/TR
JAN1N4622UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622C-1/TR 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
JANTX1N4622C-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622D-1/TR 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
JANTX1N4622D-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622CUR-1/TR
JANTX1N4622CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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JANTX1N4622DUR-1/TR
JANTX1N4622DUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 3.9V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 1650 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2.5 µA @ 2 V
Qualification: MIL-PRF-19500/435
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CD3825A 8361-cd3821-cd3828a-datasheet
CD3825A
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V DIE
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: Die
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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1N3825A-1/TR 5797-1n3821a-3828a-datasheet
1N3825A-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
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JAN1N3825A-1 5797-1n3821a-3828a-datasheet
JAN1N3825A-1
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JAN1N3825A-1/TR
JAN1N3825A-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JANTX1N3825A-1/TR
JANTX1N3825A-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO41
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: MIL-PRF-19500/115
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1N3825AUR-1/TR 1N3821AUR-1-1N3828AUR-1.pdf
1N3825AUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1.5W DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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1N3825AUR-1/TR 1N3821AUR-1-1N3828AUR-1.pdf
1N3825AUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1.5W DO213AB
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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JANTXV1N3825A-1/TR
JANTXV1N3825A-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 16V 1W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 12.2 V
Qualification: MIL-PRF-19500/115
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ATMEGA3250A-AN Atmel-8285-8-bit-AVR-Microcontroller-ATmega165A_PA_325A_PA_3250A_PA_645A_P_6450A_P_datasheet_Summary.pdf
ATMEGA3250A-AN
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MPLAD7.5KP13CAe3 132315-plad7-5kp-datasheet
MPLAD7.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP13CA 132315-plad7-5kp-datasheet
MPLAD7.5KP13CA
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13CA rf01010_rb.pdf
M5KP13CA
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP13CAe3 rf01010_rb.pdf
M5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP13CAe3 rf01083_rev_b.pdf
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP13CA rf01083_rev_b.pdf
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP13CAe3 132315-plad7-5kp-datasheet
MAPLAD7.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP13CA 132315-plad7-5kp-datasheet
MAPLAD7.5KP13CA
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP13CAe3 rf01083_rev_b.pdf
MXLPLAD6.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP13CAe3 132315-plad7-5kp-datasheet
MXLPLAD7.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP13CA rf01010_rb.pdf
MA5KP13CA
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 233A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP13CAe3 rf01010_rb.pdf
MA5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 233A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP13CAe3 rf01083_rev_b.pdf
MXPLAD6.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 302A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP13CAe3 132315-plad7-5kp-datasheet
MXPLAD7.5KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC MINIPLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 349A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP13CA mplad15kp.pdf
MAPLAD15KP13CA
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 696A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD15KP13CAe3 mplad15kp.pdf
MAPLAD15KP13CAe3
Виробник: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 696A
Voltage - Reverse Standoff (Typ): 13V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AVR64DA64S-I/PT
AVR64DA64S-I/PT
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-I/PT
AVR64DA64ST-I/PT
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-E/5LX
AVR64DA64ST-E/5LX
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64ST-E/PT
AVR64DA64ST-E/PT
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64S-I/5LX
AVR64DA64S-I/5LX
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64S-E/5LX
AVR64DA64S-E/5LX
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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AVR64DA64S-E/PT
AVR64DA64S-E/PT
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
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AVR64DA64ST-I/5LX
AVR64DA64ST-I/5LX
Виробник: Microchip Technology
Description: 64KB,8KB,64P,24 MHZ,PDID,12B ADC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 22x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 54
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PIC32CM5164JH01048-I/U5B-SL3 PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf
PIC32CM5164JH01048-I/U5B-SL3
Виробник: Microchip Technology
Description: 48QFN, 512KB FLASH, 48MHZ, TRAY,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM5164LS00048-I/U5B-SL3 60001615E.pdf
PIC32CM5164LS00048-I/U5B-SL3
Виробник: Microchip Technology
Description: QFN 48, 512 KB FLASH, 64 KB SRAM
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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DSC1001BL5-016.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-016.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
на замовлення 560 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+224.52 грн
10+210.82 грн
50+207.40 грн
Мінімальне замовлення: 2
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PIC24FJ1024GB610T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ1024GB610T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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PIC24FJ1024GB610T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ1024GB610T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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ZL40294LDF6 ZL40294-20-Output-DB2000QL-Buffer-with-Ultra-Low-Additive-Jitter-DS20006768.pdf
ZL40294LDF6
Виробник: Microchip Technology
Description: 20-OUTPUT DB2000QL BUFFER
Packaging: Tape & Reel (TR)
Package / Case: 80-WFQFN Dual Rows, Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-GQFN (6x6)
Number of Circuits: 1
Frequency - Max: 250 MHz
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ZL40294LDF6 ZL40294-20-Output-DB2000QL-Buffer-with-Ultra-Low-Additive-Jitter-DS20006768.pdf
ZL40294LDF6
Виробник: Microchip Technology
Description: 20-OUTPUT DB2000QL BUFFER
Packaging: Cut Tape (CT)
Package / Case: 80-WFQFN Dual Rows, Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-GQFN (6x6)
Number of Circuits: 1
Frequency - Max: 250 MHz
на замовлення 3490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+132.41 грн
25+106.03 грн
100+102.61 грн
Мінімальне замовлення: 3
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MCP6567-E/SNVAO MCP6566-6R-6U-7-9-1.8V-Low-Power-Open-Drain-Output-Comparator-DS20002143G.pdf
MCP6567-E/SNVAO
Виробник: Microchip Technology
Description: DUAL 1.8V OPEN DRAIN COMPARATOR,
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: CMOS, Open-Drain, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Single/Dual (±): 1.8V ~ 5.5V
Supplier Device Package: 8-SOIC
Propagation Delay (Max): 80ns
Current - Quiescent (Max): 130µA
Voltage - Input Offset (Max): 10mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 30mA
CMRR, PSRR (Typ): 66dB CMRR, 70dB PSRR
Hysteresis: 5mV
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UTX4110
UTX4110
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 4A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 100 ns
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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