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MIC2132YML-TR MIC2132YML-TR Microchip Technology MIC2132.pdf Description: 75V, DUAL PHASE ADVANCED COT PWM
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 8V ~ 75V
Supplier Device Package: 32-VQFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Dead Time Control, Enable, Frequency Control, Phase Control, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 85%
Clock Sync: No
Number of Outputs: 2
на замовлення 3280 шт:
термін постачання 21-31 дні (днів)
2+214.24 грн
25+172.46 грн
100+156.71 грн
Мінімальне замовлення: 2
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APT35GP120B2SC20 Microchip Technology Description: IGBT PT MOS 7 COMBI 1200 V 35 A
Packaging: Tube
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M1.5KE100A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 85.5VWM 137VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 85.5V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AT9933LG-GVAO Microchip Technology 20005597A.pdf Description: BUCK (CUK) LED DRIVER IC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Internal Switch(s): No
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Dimming: PWM
Voltage - Supply (Max): 75V
Grade: Automotive
Qualification: AEC-Q100
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APTGX800U120D4G Microchip Technology Description: PM-IGBT-TFS-D4
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 800A
NTC Thermistor: No
Current - Collector (Ic) (Max): 1.05 kA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2.459 kW
Current - Collector Cutoff (Max): 60 µA
Input Capacitance (Cies) @ Vce: 160000 pF @ 25 V
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BZV55C33 BZV55C33 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 33V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
на замовлення 449 шт:
термін постачання 21-31 дні (днів)
2+196.39 грн
100+175.13 грн
Мінімальне замовлення: 2
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BZV55C8V2 BZV55C8V2 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 8.2V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
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PG164110 PG164110 Microchip Technology MPLAB-PICkit-Basic-In-Circuit-Debugger-User-Guide-DS50003844.pdf Description: MPLAB PICKIT BASIC
Packaging: Bulk
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: AVR, dsPIC, SAM, PIC
на замовлення 862 шт:
термін постачання 21-31 дні (днів)
1+2087.34 грн
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DSC1101NL5-PROG DSC1101NL5-PROG Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: OSC MEMS PROGRAMMABLE SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 3.3 MHz ~ 170 MHz
Base Resonator: MEMS
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JAN1N5544B-1 JAN1N5544B-1 Microchip Technology 123956-lds-0037-1-datasheet Description: DIODE ZENER 28V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 28 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 25.2 V
Qualification: MIL-PRF-19500/437
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ATMXT640UD-CCUR002 ATMXT640UD-CCUR002 Microchip Technology mXT640UD-CCU002%202.0.pdf Description: MAXTOUCH UD SERIES, 640 CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Supplier Device Package: 88-UFBGA (6x6)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Current - Supply: 40 mA
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ATMXT640UD-CCUR002 ATMXT640UD-CCUR002 Microchip Technology mXT640UD-CCU002%202.0.pdf Description: MAXTOUCH UD SERIES, 640 CHANNEL
Packaging: Cut Tape (CT)
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Supplier Device Package: 88-UFBGA (6x6)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Current - Supply: 40 mA
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ATMXT640T-DEV-PCB Microchip Technology maXTouch-T-brochure.pdf Description: EVAL BOARD FOR MXT640T
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640T
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ATMXT641TAT-I2C-PCB Microchip Technology maXTouch-T-brochure.pdf Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATMXT641T-DEV-PCB Microchip Technology maXTouch-T-brochure.pdf Description: EVAL BOARD FOR MXT641T
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641T
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ATMXT640U-DEV-PCB Microchip Technology Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATEVK-MXT641TAT-A Microchip Technology maXTouch-T-brochure.pdf Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATEVK-MXT640U-A Microchip Technology Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATMXT640T-CCU048 Microchip Technology maXTouch-T-brochure.pdf Description: IC SCREEN CNTRL TOUCH
Packaging: Tray
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
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ATMXT640U-CCUR001 ATMXT640U-CCUR001 Microchip Technology mXT640U_1v0_Datasheet_FX.pdf Description: IC TOUCHSCREEN CTLR SMD
Packaging: Tray
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Resolution (Bits): 12 b
Supplier Device Package: 88-UFBGA (6x6)
Current - Supply: 0.25 µA
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ATMXT641TD-ABVA2 ATMXT641TD-ABVA2 Microchip Technology mXT641TD-A%20Touchscreen%20Controller%20Product%20Brief.pdf Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT641TD-ATRVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ABRVA2 ATMXT641TD-ABRVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ATVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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1N5119/TR 1N5119/TR Microchip Technology Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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1N5119 1N5119 Microchip Technology Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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VCC1-B3F-10M0000000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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VCC4-B3F-10M0000000 Microchip Technology VCC4A-CMOS-Crystal-Oscillator-DS20006749.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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MCP4017T-104E/LTY MCP4017T-104E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGT POT 100KOHM 128TAP SC70-6
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-502E/LTY MCP4017T-502E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 5KOHM 128TAP SC70-6
Resistance (Ohms): 5k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTY MCP4017T-103E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 10KOHM 128TAP SC70-6
Resistance (Ohms): 10k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-503E/LTY MCP4017T-503E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 50KOHM 128TAP SC70-6
Resistance (Ohms): 50k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTYVAO MCP4017T-103E/LTYVAO Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 10KOHM 128TAP SC70-6
Resistance (Ohms): 10k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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PIC32CZ2051CA70100-I/E5X PIC32CZ2051CA70100-I/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-I/Z8X PIC32CZ2051CA70144-I/Z8X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/E5X PIC32CZ2051CA70100T-I/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-V/E5X PIC32CZ2051CA70100T-V/E5X Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-V/E5X PIC32CZ2051CA70100-V/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/Z8X PIC32CZ2051CA70144-V/Z8X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064T-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70100-I/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064-V/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051MC70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A MP6KE6.8A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MIC2132YML-TR MIC2132.pdf
MIC2132YML-TR
Виробник: Microchip Technology
Description: 75V, DUAL PHASE ADVANCED COT PWM
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 8V ~ 75V
Supplier Device Package: 32-VQFN (5x5)
Synchronous Rectifier: Yes
Control Features: Current Limit, Dead Time Control, Enable, Frequency Control, Phase Control, Power Good, Soft Start
Output Phases: 2
Duty Cycle (Max): 85%
Clock Sync: No
Number of Outputs: 2
на замовлення 3280 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+214.24 грн
25+172.46 грн
100+156.71 грн
Мінімальне замовлення: 2
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APT35GP120B2SC20
Виробник: Microchip Technology
Description: IGBT PT MOS 7 COMBI 1200 V 35 A
Packaging: Tube
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M1.5KE100A RF01008_rE.pdf
Виробник: Microchip Technology
Description: TVS DIODE 85.5VWM 137VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 85.5V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AT9933LG-GVAO 20005597A.pdf
Виробник: Microchip Technology
Description: BUCK (CUK) LED DRIVER IC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Internal Switch(s): No
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Dimming: PWM
Voltage - Supply (Max): 75V
Grade: Automotive
Qualification: AEC-Q100
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APTGX800U120D4G
Виробник: Microchip Technology
Description: PM-IGBT-TFS-D4
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 800A
NTC Thermistor: No
Current - Collector (Ic) (Max): 1.05 kA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2.459 kW
Current - Collector Cutoff (Max): 60 µA
Input Capacitance (Cies) @ Vce: 160000 pF @ 25 V
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BZV55C33 8298-bzv55-c2v4-c75-datasheet
BZV55C33
Виробник: Microchip Technology
Description: DIODE ZENER 33V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
на замовлення 449 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+196.39 грн
100+175.13 грн
Мінімальне замовлення: 2
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BZV55C8V2 8298-bzv55-c2v4-c75-datasheet
BZV55C8V2
Виробник: Microchip Technology
Description: DIODE ZENER 8.2V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
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PG164110 MPLAB-PICkit-Basic-In-Circuit-Debugger-User-Guide-DS50003844.pdf
PG164110
Виробник: Microchip Technology
Description: MPLAB PICKIT BASIC
Packaging: Bulk
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: AVR, dsPIC, SAM, PIC
на замовлення 862 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2087.34 грн
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DSC1101NL5-PROG DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101NL5-PROG
Виробник: Microchip Technology
Description: OSC MEMS PROGRAMMABLE SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 3.3 MHz ~ 170 MHz
Base Resonator: MEMS
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JAN1N5544B-1 123956-lds-0037-1-datasheet
JAN1N5544B-1
Виробник: Microchip Technology
Description: DIODE ZENER 28V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 28 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 25.2 V
Qualification: MIL-PRF-19500/437
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ATMXT640UD-CCUR002 mXT640UD-CCU002%202.0.pdf
ATMXT640UD-CCUR002
Виробник: Microchip Technology
Description: MAXTOUCH UD SERIES, 640 CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Supplier Device Package: 88-UFBGA (6x6)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Current - Supply: 40 mA
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ATMXT640UD-CCUR002 mXT640UD-CCU002%202.0.pdf
ATMXT640UD-CCUR002
Виробник: Microchip Technology
Description: MAXTOUCH UD SERIES, 640 CHANNEL
Packaging: Cut Tape (CT)
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Supplier Device Package: 88-UFBGA (6x6)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Current - Supply: 40 mA
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ATMXT640T-DEV-PCB maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT640T
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640T
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ATMXT641TAT-I2C-PCB maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATMXT641T-DEV-PCB maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT641T
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641T
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ATMXT640U-DEV-PCB
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATEVK-MXT641TAT-A maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATEVK-MXT640U-A
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATMXT640T-CCU048 maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: IC SCREEN CNTRL TOUCH
Packaging: Tray
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
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ATMXT640U-CCUR001 mXT640U_1v0_Datasheet_FX.pdf
ATMXT640U-CCUR001
Виробник: Microchip Technology
Description: IC TOUCHSCREEN CTLR SMD
Packaging: Tray
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Resolution (Bits): 12 b
Supplier Device Package: 88-UFBGA (6x6)
Current - Supply: 0.25 µA
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ATMXT641TD-ABVA2 mXT641TD-A%20Touchscreen%20Controller%20Product%20Brief.pdf
ATMXT641TD-ABVA2
Виробник: Microchip Technology
Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT641TD-ATRVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ABRVA2
ATMXT641TD-ABRVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ATVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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1N5119/TR
1N5119/TR
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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1N5119
1N5119
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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VCC1-B3F-10M0000000 VCC1-April-2020.pdf
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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VCC4-B3F-10M0000000 VCC4A-CMOS-Crystal-Oscillator-DS20006749.pdf
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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MCP4017T-104E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-104E/LTY
Виробник: Microchip Technology
Description: IC DGT POT 100KOHM 128TAP SC70-6
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-502E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-502E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 5KOHM 128TAP SC70-6
Resistance (Ohms): 5k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-103E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Resistance (Ohms): 10k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-503E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-503E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 50KOHM 128TAP SC70-6
Resistance (Ohms): 50k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTYVAO MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-103E/LTYVAO
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Resistance (Ohms): 10k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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PIC32CZ2051CA70100-I/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100-I/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-I/Z8X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70144-I/Z8X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100T-I/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-V/E5X
PIC32CZ2051CA70100T-V/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-V/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100-V/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/Z8X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70144-V/Z8X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064T-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70100-I/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064-V/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051MC70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A 9518-mp6ke-pdf
MP6KE6.8A
Виробник: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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