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PIC32CZ2051MC70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A MP6KE6.8A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N2983 2N2983 Microchip Technology Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N2985 2N2985 Microchip Technology Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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1N2982A 1N2982A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2987RB 1N2987RB Microchip Technology 1N2970B-1N3015B_1N3993A-1N3998A.pdf Description: DIODE ZENER 25V 10W DO4
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2980B 1N2980B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2980A 1N2980A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2985A 1N2985A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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1N2989A Microchip Technology 1N2970B-1N3015B_1N3993A-1N3998A.pdf Description: DIODE ZENER
Packaging: Bulk
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1N2984B 1N2984B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 20V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
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1N2980RB 1N2980RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2986B 1N2986B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2986RB 1N2986RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2982RB 1N2982RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2985RB 1N2985RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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JANTX1N2986B JANTX1N2986B Microchip Technology Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
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MSMCJ90A MSMCJ90A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1101CM1-010.0000T DSC1101CM1-010.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1101CM1-010.0000 DSC1101CM1-010.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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SW006024-2 Microchip Technology Description: MPLAB XC-DSC PRO COMPILER
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Operating System: Linux, macOS, Windows
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SW006024-2N Microchip Technology Description: MPLAB XC-DSC PRO COMPILER (NETWO
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Operating System: Linux, macOS, Windows
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термін постачання 21-31 дні (днів)
1+126642.26 грн
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MP6KE82A MP6KE82A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 70.1VWM 113VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.3A
Voltage - Reverse Standoff (Typ): 70.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SMX1001MR-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Bulk
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SD4145 SD4145 Microchip Technology 8500-coc-95-datasheet Description: DIODE SCHOTTKY 45V 30A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 30A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 680 mV @ 30 A
Current - Reverse Leakage @ Vr: 1.5 mA @ 45 V
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ZL30734BLDG1 Microchip Technology Description: 4-CHANNEL, 10-OUTPUT ENHANCED 15
Packaging: Tray
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ZL30733BLDG1 Microchip Technology Description: 3-CHANNEL, 10-OUTPUT ENHANCED 15
Packaging: Tray
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APTGX600SK170T6G Microchip Technology Description: PM-IGBT-TFS-SP6C
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 750 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.948 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
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AT90LS8535-4AC AT90LS8535-4AC Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4JC AT90LS8535-4JC Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4JI AT90LS8535-4JI Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4PC AT90LS8535-4PC Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4MI AT90LS8535-4MI Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 44VQFN
Packaging: Tube
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535L-8JUR ATMEGA8535L-8JUR Microchip Technology 2502S.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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MPLAD130KP275CV MPLAD130KP275CV Microchip Technology Description: TVS DIODE 275VWM 400VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 400V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD130KP275CA MPLAD130KP275CA Microchip Technology Description: TVS DIODE 275VWM 445VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 445V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD130KP275CV/TR MPLAD130KP275CV/TR Microchip Technology Description: TVS DIODE 275VWM 400VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 400V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AT93C46-10TI-2.7-T AT93C46-10TI-2.7-T Microchip Technology AT93C46%2C56%2C66.pdf Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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2EZ19D5 2EZ19D5 Microchip Technology 11109-sd8a-datasheet Description: DIODE ZENER 19V 2W DO204AL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 19 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 2 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 14.4 V
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2EZ19D5 2EZ19D5 Microchip Technology 11109-sd8a-datasheet Description: DIODE ZENER 19V 2W DO204AL
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 19 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 2 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 14.4 V
на замовлення 828 шт:
термін постачання 21-31 дні (днів)
2+268.05 грн
10+168.59 грн
25+144.77 грн
100+110.31 грн
Мінімальне замовлення: 2
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SM16LC24e3/TR13 SM16LC24e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
2500+292.82 грн
Мінімальне замовлення: 2500
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SM16LC24e3/TR13 SM16LC24e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 6320 шт:
термін постачання 21-31 дні (днів)
2+314.74 грн
100+281.97 грн
Мінімальне замовлення: 2
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SM1624e3/TR13 SM1624e3/TR13 Microchip Technology SM1603%28C%29-SM1624%28C%29.pdf Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
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SM1624e3/TR13 SM1624e3/TR13 Microchip Technology SM1603%28C%29-SM1624%28C%29.pdf Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 2292 шт:
термін постачання 21-31 дні (днів)
3+127.18 грн
100+113.54 грн
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SM16LC15/TR13 SM16LC15/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 15VWM 30VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 30V
Power - Peak Pulse: 500W
Power Line Protection: No
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SM16LC15/TR13 SM16LC15/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 15VWM 30VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 30V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 679 шт:
термін постачання 21-31 дні (днів)
1+625.45 грн
100+559.50 грн
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EV74H48A EV74H48A Microchip Technology Description: CURIOSITY PLATFORM DIM CONNECTOR
Packaging: Bulk
Mounting Type: Fixed
Type: DSP, MCU 32-Bit
Contents: Partially Populated Board(s) - Main IC/Module/Part Not Included
Utilized IC / Part: dsPIC33A, PIC32A
Platform: Curiosity
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
1+5269.25 грн
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PIC32CZ2051MC70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A 9518-mp6ke-pdf
MP6KE6.8A
Виробник: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N2983
2N2983
Виробник: Microchip Technology
Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N2985
2N2985
Виробник: Microchip Technology
Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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1N2982A 8914-lds-0075-datasheet
1N2982A
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2987RB 1N2970B-1N3015B_1N3993A-1N3998A.pdf
1N2987RB
Виробник: Microchip Technology
Description: DIODE ZENER 25V 10W DO4
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2980B 8914-lds-0075-datasheet
1N2980B
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2980A 8914-lds-0075-datasheet
1N2980A
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2985A 8914-lds-0075-datasheet
1N2985A
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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1N2989A 1N2970B-1N3015B_1N3993A-1N3998A.pdf
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
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1N2984B 8914-lds-0075-datasheet
1N2984B
Виробник: Microchip Technology
Description: DIODE ZENER 20V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
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1N2980RB 8914-lds-0075-datasheet
1N2980RB
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2986B 8914-lds-0075-datasheet
1N2986B
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2986RB 8914-lds-0075-datasheet
1N2986RB
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2982RB 8914-lds-0075-datasheet
1N2982RB
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2985RB 8914-lds-0075-datasheet
1N2985RB
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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JANTX1N2986B
JANTX1N2986B
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
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MSMCJ90A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ90A
Виробник: Microchip Technology
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1101CM1-010.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CM1-010.0000T
Виробник: Microchip Technology
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1101CM1-010.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CM1-010.0000
Виробник: Microchip Technology
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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SW006024-2
Виробник: Microchip Technology
Description: MPLAB XC-DSC PRO COMPILER
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Operating System: Linux, macOS, Windows
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SW006024-2N
Виробник: Microchip Technology
Description: MPLAB XC-DSC PRO COMPILER (NETWO
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Operating System: Linux, macOS, Windows
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+126642.26 грн
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MP6KE82A 9518-mp6ke-pdf
MP6KE82A
Виробник: Microchip Technology
Description: TVS DIODE 70.1VWM 113VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.3A
Voltage - Reverse Standoff (Typ): 70.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SMX1001MR-M1
Виробник: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Bulk
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SD4145 8500-coc-95-datasheet
SD4145
Виробник: Microchip Technology
Description: DIODE SCHOTTKY 45V 30A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 30A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 680 mV @ 30 A
Current - Reverse Leakage @ Vr: 1.5 mA @ 45 V
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ZL30734BLDG1
Виробник: Microchip Technology
Description: 4-CHANNEL, 10-OUTPUT ENHANCED 15
Packaging: Tray
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ZL30733BLDG1
Виробник: Microchip Technology
Description: 3-CHANNEL, 10-OUTPUT ENHANCED 15
Packaging: Tray
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APTGX600SK170T6G
Виробник: Microchip Technology
Description: PM-IGBT-TFS-SP6C
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 750 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.948 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
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AT90LS8535-4AC doc1041.pdf
AT90LS8535-4AC
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4JC doc1041.pdf
AT90LS8535-4JC
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4JI doc1041.pdf
AT90LS8535-4JI
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4PC doc1041.pdf
AT90LS8535-4PC
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT90LS8535-4MI doc1041.pdf
AT90LS8535-4MI
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44VQFN
Packaging: Tube
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535L-8JUR 2502S.pdf
ATMEGA8535L-8JUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Cut Tape (CT)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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MPLAD130KP275CV
MPLAD130KP275CV
Виробник: Microchip Technology
Description: TVS DIODE 275VWM 400VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 400V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD130KP275CA
MPLAD130KP275CA
Виробник: Microchip Technology
Description: TVS DIODE 275VWM 445VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 445V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD130KP275CV/TR
MPLAD130KP275CV/TR
Виробник: Microchip Technology
Description: TVS DIODE 275VWM 400VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 292A
Voltage - Reverse Standoff (Typ): 275V (Max)
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 300V
Voltage - Clamping (Max) @ Ipp: 400V
Power - Peak Pulse: 40000W (40kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AT93C46-10TI-2.7-T AT93C46%2C56%2C66.pdf
AT93C46-10TI-2.7-T
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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2EZ19D5 11109-sd8a-datasheet
2EZ19D5
Виробник: Microchip Technology
Description: DIODE ZENER 19V 2W DO204AL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 19 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 2 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 14.4 V
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2EZ19D5 11109-sd8a-datasheet
2EZ19D5
Виробник: Microchip Technology
Description: DIODE ZENER 19V 2W DO204AL
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 19 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 2 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 14.4 V
на замовлення 828 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+268.05 грн
10+168.59 грн
25+144.77 грн
100+110.31 грн
Мінімальне замовлення: 2
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SM16LC24e3/TR13 SM16LC.pdf
SM16LC24e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+292.82 грн
Мінімальне замовлення: 2500
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SM16LC24e3/TR13 SM16LC.pdf
SM16LC24e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 6320 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+314.74 грн
100+281.97 грн
Мінімальне замовлення: 2
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SM1624e3/TR13 SM1603%28C%29-SM1624%28C%29.pdf
SM1624e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
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SM1624e3/TR13 SM1603%28C%29-SM1624%28C%29.pdf
SM1624e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 55VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 2292 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+127.18 грн
100+113.54 грн
Мінімальне замовлення: 3
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SM16LC15/TR13 SM16LC.pdf
SM16LC15/TR13
Виробник: Microchip Technology
Description: TVS DIODE 15VWM 30VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 30V
Power - Peak Pulse: 500W
Power Line Protection: No
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SM16LC15/TR13 SM16LC.pdf
SM16LC15/TR13
Виробник: Microchip Technology
Description: TVS DIODE 15VWM 30VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 30V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 679 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+625.45 грн
100+559.50 грн
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EV74H48A
EV74H48A
Виробник: Microchip Technology
Description: CURIOSITY PLATFORM DIM CONNECTOR
Packaging: Bulk
Mounting Type: Fixed
Type: DSP, MCU 32-Bit
Contents: Partially Populated Board(s) - Main IC/Module/Part Not Included
Utilized IC / Part: dsPIC33A, PIC32A
Platform: Curiosity
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5269.25 грн
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