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PIC16F17554-E/SS PIC16F17554-E/SS Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17555T-I/SS PIC16F17555T-I/SS Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17554-E/SO Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17555-E/STX PIC16F17555-E/STX Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F17555T-I/SO Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17556T-I/STX PIC16F17556T-I/STX Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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PIC16F17555-E/SS PIC16F17555-E/SS Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17556T-I/SS PIC16F17556T-I/SS Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F17555-E/SO Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17556T-I/SO Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
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PIC16F17556-E/STX PIC16F17556-E/STX Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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PIC16F17556-E/SS PIC16F17556-E/SS Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F17556-E/SO Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
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PIC16F17554-E/SP PIC16F17554-E/SP Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
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PIC16F17555-E/SP PIC16F17555-E/SP Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
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PIC16F17556-E/SP PIC16F17556-E/SP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
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1N4461 1N4461 Microchip Technology 1N4460-1N4496.1N6485-1N6491.pdf Description: DIODE ZENER 6.8V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 4.08 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+827.75 грн
100+740.55 грн
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JANTX1N4461 JANTX1N4461 Microchip Technology 1N4460-1N4496.1N6485-1N6491.pdf Description: DIODE ZENER 6.8V 1.5W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 4.08 V
Qualification: MIL-PRF-19500/406
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MASMCG17CA MASMCG17CA Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 17VWM 27.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.3A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N3997A JANTX1N3997A Microchip Technology 1N2970B-3015B.1N3993A-3998A.pdf Description: DIODE ZENER 5.6V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 1 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Qualification: MIL-PRF-19500/124
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AC164369 AC164369 Microchip Technology AC1643xx_AC1644xx_Web.pdf Description: PM3 UNIVERSAL 8L 5X6MM DFN SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Utilized IC / Part: MPLAB® PM3
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ATWINC1500-MR210PB1977-T Microchip Technology ATWINC1500_%20Datasheet.PDF Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tape & Reel (TR)
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 18.9dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 265mA ~ 269mA
Antenna Type: Integrated, Trace
Utilized IC / Part: ATWINC1500B
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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ATWINC1500-MR210PB1977 Microchip Technology ATWINC1500_%20Datasheet.PDF Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 18.9dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 265mA ~ 269mA
Antenna Type: Integrated, Trace
Utilized IC / Part: ATWINC1500B
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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JANTX1N6162A JANTX1N6162A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 51.7VWM 97.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.4A
Voltage - Reverse Standoff (Typ): 51.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 97.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6161A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 47.1VWM 85.3VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.6A
Voltage - Reverse Standoff (Typ): 47.1V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6163A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 56VWM 103.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.5A
Voltage - Reverse Standoff (Typ): 56V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6158A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 35.8VWM 64.6VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 35.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6157A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 32.7VWM 59.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.4A
Voltage - Reverse Standoff (Typ): 32.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 40.9V
Voltage - Clamping (Max) @ Ipp: 59.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6159A Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 38.8VWM 70.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 38.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MCP1624T-I/MC MCP1624T-I/MC Microchip Technology MCP1623-24-Data-Sheet-DS40001420.pdf Description: IC REG PIC MICROCTRLR 1OUT 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Voltage - Output: 2V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, PIC® Microcontrollers
Supplier Device Package: 8-DFN (2x3)
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MCP1624T-I/MC MCP1624T-I/MC Microchip Technology MCP1623-24-Data-Sheet-DS40001420.pdf Description: IC REG PIC MICROCTRLR 1OUT 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Voltage - Output: 2V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, PIC® Microcontrollers
Supplier Device Package: 8-DFN (2x3)
на замовлення 2130 шт:
термін постачання 21-31 дні (днів)
8+46.84 грн
25+37.76 грн
100+34.25 грн
Мінімальне замовлення: 8
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SMDB24e3/TR7 SMDB24e3/TR7 Microchip Technology SMDA.pdf Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+98.71 грн
Мінімальне замовлення: 500
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SMDB24e3/TR7 SMDB24e3/TR7 Microchip Technology SMDA.pdf Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
3+115.82 грн
Мінімальне замовлення: 3
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SMDB24Ce3/TR7 SMDB24Ce3/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+130.40 грн
Мінімальне замовлення: 500
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SMDB24Ce3/TR7 SMDB24Ce3/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
3+141.37 грн
100+125.57 грн
Мінімальне замовлення: 3
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PIC18F26Q84T-E/SS PIC18F26Q84T-E/SS Microchip Technology PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf Description: CAN-FD, 64KB FLASH, 8KB RAM, 12B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC18F26Q84-E/5N PIC18F26Q84-E/5N Microchip Technology PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf Description: CAN, 128KB FLASH, 13KB RAM, 12B
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
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ATTINY44-20PU ATTINY44-20PU Microchip Technology 8006S.pdf description Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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ATTINY44V-10PU ATTINY44V-10PU Microchip Technology 8006S.pdf Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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2N3920 2N3920 Microchip Technology Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 15 W
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2N6671 2N6671 Microchip Technology Description: TRANS PNP 300V 8A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
DC Current Gain (hFE) (Min) @ Ic, Vce: 10 @ 8A, 300V
Supplier Device Package: TO-3
Current - Collector (Ic) (Max): 8 A
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 150 W
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M1.5KE68A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 58.1VWM 92VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 16.3A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC2010FM2-A0001T DSC2010FM2-A0001T Microchip Technology DSC2010FM2-A0001.pdf Description: MEMS OSC XO 2.25V-3.6V 14SMD
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 148.5MHz
Type: Clock Generator
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Ratio - Input:Output: 0:1
Differential - Input:Output: No/No
Supplier Device Package: 14-QFN (3.2x2.5)
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
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MIC38C43AYMM MIC38C43AYMM Microchip Technology MCRLS04964-1.pdf?t.download=true&u=5oefqw Description: BICMOS CURRENT-MODE PWM CONTROLL
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Up, Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 500kHz
Topology: Buck, Boost, Flyback, Forward Converter
Voltage - Supply (Vcc/Vdd): 7.6V ~ 20V
Supplier Device Package: 8-MSOP
Synchronous Rectifier: Yes
Control Features: Frequency Control
Output Phases: 1
Duty Cycle (Max): 96%
Clock Sync: No
Number of Outputs: 1
на замовлення 5140 шт:
термін постачання 21-31 дні (днів)
222+106.04 грн
Мінімальне замовлення: 222
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BZV55C39 BZV55C39 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 39V DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 39 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
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MCP3551T-E/SN MCP3551T-E/SN Microchip Technology 20001950F.pdf Description: IC ADC 22BIT SIGMA-DELTA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 22
Configuration: ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 14
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 9900 шт:
термін постачання 21-31 дні (днів)
3300+211.83 грн
Мінімальне замовлення: 3300
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MCP3551T-E/SN MCP3551T-E/SN Microchip Technology 20001950F.pdf Description: IC ADC 22BIT SIGMA-DELTA 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 22
Configuration: ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 14
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 10379 шт:
термін постачання 21-31 дні (днів)
2+279.32 грн
25+224.53 грн
100+203.99 грн
Мінімальне замовлення: 2
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PIC16F17576-I/MP PIC16F17576-I/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
на замовлення 511 шт:
термін постачання 21-31 дні (днів)
3+123.48 грн
25+108.87 грн
100+98.78 грн
Мінімальне замовлення: 3
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PIC16F17576-I/P PIC16F17576-I/P Microchip Technology PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
на замовлення 164 шт:
термін постачання 21-31 дні (днів)
2+224.82 грн
25+198.22 грн
100+179.44 грн
Мінімальне замовлення: 2
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PIC16F17576-I/PT PIC16F17576-I/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576T-I/MP PIC16F17576T-I/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576T-I/PT PIC16F17576T-I/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/MP PIC16F17576-E/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576-E/PT PIC16F17576-E/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/P PIC16F17576-E/P Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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2N5115 2N5115 Microchip Technology 124387-lds-0006 Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 60 mA @ 15 V
Qualification: MIL-PRF-19500
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2N5115E3 2N5115E3 Microchip Technology 124387-lds-0006.pdf Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
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MV2N5115 MV2N5115 Microchip Technology 124387-lds-0006.pdf Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Qualification: MIL-PRF-19500
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MV2N5115UB MV2N5115UB Microchip Technology 123965-lds-0006-1.pdf Description: JFET P-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Qualification: MIL-PRF-19500
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2N5116 2N5116 Microchip Technology 124387-lds-0006 Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 175 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 15 V
Qualification: MIL-PRF-19500
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PIC16F17554-E/SS
PIC16F17554-E/SS
Виробник: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17555T-I/SS
PIC16F17555T-I/SS
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17554-E/SO
Виробник: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17555-E/STX
PIC16F17555-E/STX
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F17555T-I/SO
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17556T-I/STX
PIC16F17556T-I/STX
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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PIC16F17555-E/SS
PIC16F17555-E/SS
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17556T-I/SS
PIC16F17556T-I/SS
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F17555-E/SO
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17556T-I/SO
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
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PIC16F17556-E/STX
PIC16F17556-E/STX
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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PIC16F17556-E/SS
PIC16F17556-E/SS
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F17556-E/SO
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
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PIC16F17554-E/SP
PIC16F17554-E/SP
Виробник: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
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PIC16F17555-E/SP
PIC16F17555-E/SP
Виробник: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
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PIC16F17556-E/SP
PIC16F17556-E/SP
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
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1N4461 1N4460-1N4496.1N6485-1N6491.pdf
1N4461
Виробник: Microchip Technology
Description: DIODE ZENER 6.8V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 4.08 V
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+827.75 грн
100+740.55 грн
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JANTX1N4461 1N4460-1N4496.1N6485-1N6491.pdf
JANTX1N4461
Виробник: Microchip Technology
Description: DIODE ZENER 6.8V 1.5W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 4.08 V
Qualification: MIL-PRF-19500/406
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MASMCG17CA rf01001_rev_b_final-pd-000307351.pdf
MASMCG17CA
Виробник: Microchip Technology
Description: TVS DIODE 17VWM 27.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.3A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N3997A 1N2970B-3015B.1N3993A-3998A.pdf
JANTX1N3997A
Виробник: Microchip Technology
Description: DIODE ZENER 5.6V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 1 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Qualification: MIL-PRF-19500/124
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AC164369 AC1643xx_AC1644xx_Web.pdf
AC164369
Виробник: Microchip Technology
Description: PM3 UNIVERSAL 8L 5X6MM DFN SOCKE
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Utilized IC / Part: MPLAB® PM3
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ATWINC1500-MR210PB1977-T ATWINC1500_%20Datasheet.PDF
Виробник: Microchip Technology
Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tape & Reel (TR)
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 18.9dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 265mA ~ 269mA
Antenna Type: Integrated, Trace
Utilized IC / Part: ATWINC1500B
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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ATWINC1500-MR210PB1977 ATWINC1500_%20Datasheet.PDF
Виробник: Microchip Technology
Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 18.9dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 265mA ~ 269mA
Antenna Type: Integrated, Trace
Utilized IC / Part: ATWINC1500B
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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JANTX1N6162A 1N6138_1N6173A.pdf
JANTX1N6162A
Виробник: Microchip Technology
Description: TVS DIODE 51.7VWM 97.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.4A
Voltage - Reverse Standoff (Typ): 51.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 97.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6161A 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 47.1VWM 85.3VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.6A
Voltage - Reverse Standoff (Typ): 47.1V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6163A 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 56VWM 103.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.5A
Voltage - Reverse Standoff (Typ): 56V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6158A 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 35.8VWM 64.6VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 35.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6157A 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 32.7VWM 59.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.4A
Voltage - Reverse Standoff (Typ): 32.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 40.9V
Voltage - Clamping (Max) @ Ipp: 59.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6159A 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 38.8VWM 70.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 38.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MCP1624T-I/MC MCP1623-24-Data-Sheet-DS40001420.pdf
MCP1624T-I/MC
Виробник: Microchip Technology
Description: IC REG PIC MICROCTRLR 1OUT 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Voltage - Output: 2V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, PIC® Microcontrollers
Supplier Device Package: 8-DFN (2x3)
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MCP1624T-I/MC MCP1623-24-Data-Sheet-DS40001420.pdf
MCP1624T-I/MC
Виробник: Microchip Technology
Description: IC REG PIC MICROCTRLR 1OUT 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Voltage - Output: 2V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, PIC® Microcontrollers
Supplier Device Package: 8-DFN (2x3)
на замовлення 2130 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+46.84 грн
25+37.76 грн
100+34.25 грн
Мінімальне замовлення: 8
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SMDB24e3/TR7 SMDA.pdf
SMDB24e3/TR7
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+98.71 грн
Мінімальне замовлення: 500
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SMDB24e3/TR7 SMDA.pdf
SMDB24e3/TR7
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+115.82 грн
Мінімальне замовлення: 3
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SMDB24Ce3/TR7 132313-smda-datasheet
SMDB24Ce3/TR7
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+130.40 грн
Мінімальне замовлення: 500
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SMDB24Ce3/TR7 132313-smda-datasheet
SMDB24Ce3/TR7
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+141.37 грн
100+125.57 грн
Мінімальне замовлення: 3
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PIC18F26Q84T-E/SS PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf
PIC18F26Q84T-E/SS
Виробник: Microchip Technology
Description: CAN-FD, 64KB FLASH, 8KB RAM, 12B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC18F26Q84-E/5N PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf
PIC18F26Q84-E/5N
Виробник: Microchip Technology
Description: CAN, 128KB FLASH, 13KB RAM, 12B
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
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ATTINY44-20PU description 8006S.pdf
ATTINY44-20PU
Виробник: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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ATTINY44V-10PU 8006S.pdf
ATTINY44V-10PU
Виробник: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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2N3920
2N3920
Виробник: Microchip Technology
Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 15 W
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2N6671
2N6671
Виробник: Microchip Technology
Description: TRANS PNP 300V 8A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
DC Current Gain (hFE) (Min) @ Ic, Vce: 10 @ 8A, 300V
Supplier Device Package: TO-3
Current - Collector (Ic) (Max): 8 A
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 150 W
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M1.5KE68A RF01008_rE.pdf
Виробник: Microchip Technology
Description: TVS DIODE 58.1VWM 92VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 16.3A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC2010FM2-A0001T DSC2010FM2-A0001.pdf
DSC2010FM2-A0001T
Виробник: Microchip Technology
Description: MEMS OSC XO 2.25V-3.6V 14SMD
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 148.5MHz
Type: Clock Generator
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Ratio - Input:Output: 0:1
Differential - Input:Output: No/No
Supplier Device Package: 14-QFN (3.2x2.5)
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
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MIC38C43AYMM MCRLS04964-1.pdf?t.download=true&u=5oefqw
MIC38C43AYMM
Виробник: Microchip Technology
Description: BICMOS CURRENT-MODE PWM CONTROLL
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Up, Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 500kHz
Topology: Buck, Boost, Flyback, Forward Converter
Voltage - Supply (Vcc/Vdd): 7.6V ~ 20V
Supplier Device Package: 8-MSOP
Synchronous Rectifier: Yes
Control Features: Frequency Control
Output Phases: 1
Duty Cycle (Max): 96%
Clock Sync: No
Number of Outputs: 1
на замовлення 5140 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
222+106.04 грн
Мінімальне замовлення: 222
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BZV55C39 8298-bzv55-c2v4-c75-datasheet
BZV55C39
Виробник: Microchip Technology
Description: DIODE ZENER 39V DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 39 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
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MCP3551T-E/SN 20001950F.pdf
MCP3551T-E/SN
Виробник: Microchip Technology
Description: IC ADC 22BIT SIGMA-DELTA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 22
Configuration: ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 14
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 9900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+211.83 грн
Мінімальне замовлення: 3300
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MCP3551T-E/SN 20001950F.pdf
MCP3551T-E/SN
Виробник: Microchip Technology
Description: IC ADC 22BIT SIGMA-DELTA 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 22
Configuration: ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 14
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 8-SOIC
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 10379 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+279.32 грн
25+224.53 грн
100+203.99 грн
Мінімальне замовлення: 2
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PIC16F17576-I/MP
PIC16F17576-I/MP
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
на замовлення 511 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+123.48 грн
25+108.87 грн
100+98.78 грн
Мінімальне замовлення: 3
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PIC16F17576-I/P PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf
PIC16F17576-I/P
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
на замовлення 164 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+224.82 грн
25+198.22 грн
100+179.44 грн
Мінімальне замовлення: 2
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PIC16F17576-I/PT
PIC16F17576-I/PT
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576T-I/MP
PIC16F17576T-I/MP
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576T-I/PT
PIC16F17576T-I/PT
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/MP
PIC16F17576-E/MP
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576-E/PT
PIC16F17576-E/PT
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/P
PIC16F17576-E/P
Виробник: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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2N5115 124387-lds-0006
2N5115
Виробник: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 60 mA @ 15 V
Qualification: MIL-PRF-19500
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2N5115E3 124387-lds-0006.pdf
2N5115E3
Виробник: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
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MV2N5115 124387-lds-0006.pdf
MV2N5115
Виробник: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Qualification: MIL-PRF-19500
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MV2N5115UB 123965-lds-0006-1.pdf
MV2N5115UB
Виробник: Microchip Technology
Description: JFET P-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Qualification: MIL-PRF-19500
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2N5116 124387-lds-0006
2N5116
Виробник: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 175 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 15 V
Qualification: MIL-PRF-19500
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