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DSC6111JI3B-012.0000T DSC6111JI3B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000T DSC6011JI1B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC ULTTA LOW POWET LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JE2B-012.0000T DSC6001JE2B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6111JI2B-012.0000T DSC6111JI2B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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WILCS02IC-I/ZZX WILCS02IC-I/ZZX Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: WI-FI LINK CONTROLLER SOC, 802.1
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.412GHz ~ 2.472GHz
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 80mA ~ 86mA
Data Rate (Max): 54Mbps
Current - Transmitting: 216mA ~ 279mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 13
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WINCS02IC-V/ZZX WINCS02IC-V/ZZX Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: WI-FI NETWORK CONTROLLER SOC V,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 7
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 415 шт:
термін постачання 21-31 дні (днів)
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WINCS02IC-I/ZZX WINCS02IC-I/ZZX Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: WI-FI NETWORK CONTROLLER SOC, 80
Packaging: Tray
на замовлення 404 шт:
термін постачання 21-31 дні (днів)
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WILCS02IC-V/ZZX WILCS02IC-V/ZZX Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: WI-FI LINK CONTROLLER SOC V, 802
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 10
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
1+336.37 грн
25+294.39 грн
100+267.36 грн
В кошику  од. на суму  грн.
WINCS02PE-I/100 WINCS02PE-I/100 Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
на замовлення 141 шт:
термін постачання 21-31 дні (днів)
1+402.98 грн
В кошику  од. на суму  грн.
WILCS02PE-I/100 WILCS02PE-I/100 Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
на замовлення 134 шт:
термін постачання 21-31 дні (днів)
1+402.98 грн
В кошику  од. на суму  грн.
WINCS02UE-I/100 WINCS02UE-I/100 Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
1+416.14 грн
В кошику  од. на суму  грн.
WILCS02UE-I/100 WILCS02UE-I/100 Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
1+416.14 грн
В кошику  од. на суму  грн.
1N5239B 1N5239B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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DSC1001BE1-012.0000 DSC1001BE1-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
5+80.60 грн
10+75.39 грн
50+74.17 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC1001CE1-012.0000 DSC1001CE1-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
на замовлення 706 шт:
термін постачання 21-31 дні (днів)
5+80.60 грн
10+75.39 грн
50+74.17 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
JANTX1N6156 Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 29.7VWM 56.28V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 26.6A
Voltage - Reverse Standoff (Typ): 29.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 35.25V
Voltage - Clamping (Max) @ Ipp: 56.28V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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ATTINY15L-1PI ATTINY15L-1PI Microchip Technology doc1187.pdf description Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 1.6MHz
Program Memory Size: 1KB (512 x 16)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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MAPLAD30KP85A MAPLAD30KP85A Microchip Technology mplad30kp.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 216A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATSAME53J18A-AUT-EFP ATSAME53J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-AUT-EFP ATSAME53J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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DSC6003JI3B-032K768T DSC6003JI3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6101JL3B-032K768T DSC6101JL3B-032K768T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI3B-032K768T DSC6001JI3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6003HI3B-010.0000 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC6003HI3B-010.0000T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC6003HI3B-027.0000 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±20ppm
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6003HI3B-027.0000T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±20ppm
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6003HI3B-032K768T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6011HI1A-013.5600T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
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DSC6011HI1A-013.5600T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
на замовлення 357 шт:
термін постачання 21-31 дні (днів)
4+97.04 грн
10+91.47 грн
50+90.01 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6011ME2A-016.0000 DSC6011ME2A-016.0000 Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
4+92.93 грн
25+73.78 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6013MI1A-000.0000T DSC6013MI1A-000.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+75.86 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
DSC6013MI1A-000.0000T DSC6013MI1A-000.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
4+93.76 грн
25+75.96 грн
100+73.05 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6001HI2B-024.0000 DSC6001HI2B-024.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6101ML3B-027.0000 DSC6101ML3B-027.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
на замовлення 365 шт:
термін постачання 21-31 дні (днів)
5+80.60 грн
10+75.95 грн
50+74.73 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC6301CI2CA-036.0000T Microchip Technology 20005808A.pdf Description: MEMS OSC XO 36.0000MHZ LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 36 MHz
Base Resonator: MEMS
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DSC6301CI2CA-036.0000T Microchip Technology 20005808A.pdf Description: MEMS OSC XO 36.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 36 MHz
Base Resonator: MEMS
на замовлення 929 шт:
термін постачання 21-31 дні (днів)
4+92.11 грн
10+86.24 грн
50+84.88 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6003MA3B-032K768T DSC6003MA3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC 2016 20PPM
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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AT49f4096A-70TC AT49f4096A-70TC Microchip Technology AT49F4096A_Rev2000.pdf Description: IC FLASH 4MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 50µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
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PM8650A1-FEI PM8650A1-FEI Microchip Technology 00003534.pdf Description: NVME2108HC, W/ THINNER Z HEIGHT
Packaging: Tray
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Controller Type: NVMe Controller
Supplier Device Package: Module
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M1.5KE6.8A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 5.8VWM 10.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 143A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1123CL1-287.0000T DSC1123CL1-287.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000T DSC1103AL1-287.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1123CL1-287.0000 DSC1123CL1-287.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000 DSC1103AL1-287.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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BZV55C5V1 BZV55C5V1 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 5.1V DO213AA
Packaging: Bulk
Tolerance: ±6%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
на замовлення 290 шт:
термін постачання 21-31 дні (днів)
2+218.76 грн
100+196.31 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MTCH1060T-I/REB MTCH1060T-I/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MTCH1060T-I/REB MTCH1060T-I/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 2601 шт:
термін постачання 21-31 дні (днів)
5+65.79 грн
25+58.32 грн
100+52.28 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MTCH1030-E/ST MTCH1030-E/ST Microchip Technology MTCH1030-DataSheet-DS40002457.pdf Description: 3 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 3
на замовлення 986 шт:
термін постачання 21-31 дні (днів)
5+70.73 грн
25+63.01 грн
100+56.97 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MTCH1060-E/REB MTCH1060-E/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 741 шт:
термін постачання 21-31 дні (днів)
5+72.37 грн
25+63.67 грн
100+57.64 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MIC9130BM MIC9130BM Microchip Technology mic9130.pdf Description: IC REG CTRLR TELECOM 1OUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
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MIC9130BQS MIC9130BQS Microchip Technology mic9130.pdf Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
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DSC6111JI3B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI3B-012.0000T
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI1B-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC ULTTA LOW POWET LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JE2B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001JE2B-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6111JI2B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI2B-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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WILCS02IC-I/ZZX WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02IC-I/ZZX
Виробник: Microchip Technology
Description: WI-FI LINK CONTROLLER SOC, 802.1
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.412GHz ~ 2.472GHz
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 80mA ~ 86mA
Data Rate (Max): 54Mbps
Current - Transmitting: 216mA ~ 279mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 13
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WINCS02IC-V/ZZX WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02IC-V/ZZX
Виробник: Microchip Technology
Description: WI-FI NETWORK CONTROLLER SOC V,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 7
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 415 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WINCS02IC-I/ZZX WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02IC-I/ZZX
Виробник: Microchip Technology
Description: WI-FI NETWORK CONTROLLER SOC, 80
Packaging: Tray
на замовлення 404 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+230.28 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
WILCS02IC-V/ZZX WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02IC-V/ZZX
Виробник: Microchip Technology
Description: WI-FI LINK CONTROLLER SOC V, 802
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 10
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+336.37 грн
25+294.39 грн
100+267.36 грн
В кошику  од. на суму  грн.
WINCS02PE-I/100 WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02PE-I/100
Виробник: Microchip Technology
Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
на замовлення 141 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+402.98 грн
В кошику  од. на суму  грн.
WILCS02PE-I/100 WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02PE-I/100
Виробник: Microchip Technology
Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
на замовлення 134 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+402.98 грн
В кошику  од. на суму  грн.
WINCS02UE-I/100 WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02UE-I/100
Виробник: Microchip Technology
Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.14 грн
В кошику  од. на суму  грн.
WILCS02UE-I/100 WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02UE-I/100
Виробник: Microchip Technology
Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.14 грн
В кошику  од. на суму  грн.
1N5239B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5239B
Виробник: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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DSC1001BE1-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-012.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+80.60 грн
10+75.39 грн
50+74.17 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC1001CE1-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-012.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
на замовлення 706 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+80.60 грн
10+75.39 грн
50+74.17 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
JANTX1N6156 1N6138_1N6173A.pdf
Виробник: Microchip Technology
Description: TVS DIODE 29.7VWM 56.28V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 26.6A
Voltage - Reverse Standoff (Typ): 29.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 35.25V
Voltage - Clamping (Max) @ Ipp: 56.28V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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ATTINY15L-1PI description doc1187.pdf
ATTINY15L-1PI
Виробник: Microchip Technology
Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 1.6MHz
Program Memory Size: 1KB (512 x 16)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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MAPLAD30KP85A mplad30kp.pdf
MAPLAD30KP85A
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 216A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATSAME53J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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DSC6003JI3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI3B-032K768T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6101JL3B-032K768T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JL3B-032K768T
Виробник: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001JI3B-032K768T
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6003HI3B-010.0000
Виробник: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC6003HI3B-010.0000T
Виробник: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC6003HI3B-027.0000
Виробник: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±20ppm
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6003HI3B-027.0000T
Виробник: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±20ppm
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6003HI3B-032K768T
Виробник: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6011HI1A-013.5600T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
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DSC6011HI1A-013.5600T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
на замовлення 357 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+97.04 грн
10+91.47 грн
50+90.01 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6011ME2A-016.0000 DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011ME2A-016.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.93 грн
25+73.78 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6013MI1A-000.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6013MI1A-000.0000T
Виробник: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+75.86 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
DSC6013MI1A-000.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6013MI1A-000.0000T
Виробник: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+93.76 грн
25+75.96 грн
100+73.05 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6001HI2B-024.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-024.0000
Виробник: Microchip Technology
Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6101ML3B-027.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101ML3B-027.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
на замовлення 365 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+80.60 грн
10+75.95 грн
50+74.73 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC6301CI2CA-036.0000T 20005808A.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 36.0000MHZ LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 36 MHz
Base Resonator: MEMS
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DSC6301CI2CA-036.0000T 20005808A.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 36.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 36 MHz
Base Resonator: MEMS
на замовлення 929 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.11 грн
10+86.24 грн
50+84.88 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
DSC6003MA3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032K768T
Виробник: Microchip Technology
Description: MEMS OSC 2016 20PPM
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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AT49f4096A-70TC AT49F4096A_Rev2000.pdf
AT49f4096A-70TC
Виробник: Microchip Technology
Description: IC FLASH 4MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 50µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
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PM8650A1-FEI 00003534.pdf
PM8650A1-FEI
Виробник: Microchip Technology
Description: NVME2108HC, W/ THINNER Z HEIGHT
Packaging: Tray
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Controller Type: NVMe Controller
Supplier Device Package: Module
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M1.5KE6.8A RF01008_rE.pdf
Виробник: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 143A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1123CL1-287.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CL1-287.0000T
Виробник: Microchip Technology
Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103AL1-287.0000T
Виробник: Microchip Technology
Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1123CL1-287.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CL1-287.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103AL1-287.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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BZV55C5V1 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C5V1
Виробник: Microchip Technology
Description: DIODE ZENER 5.1V DO213AA
Packaging: Bulk
Tolerance: ±6%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
на замовлення 290 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+218.76 грн
100+196.31 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MTCH1060T-I/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060T-I/REB
Виробник: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MTCH1060T-I/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060T-I/REB
Виробник: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 2601 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+65.79 грн
25+58.32 грн
100+52.28 грн
Мінімальне замовлення: 5
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MTCH1030-E/ST MTCH1030-DataSheet-DS40002457.pdf
MTCH1030-E/ST
Виробник: Microchip Technology
Description: 3 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 3
на замовлення 986 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+70.73 грн
25+63.01 грн
100+56.97 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MTCH1060-E/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060-E/REB
Виробник: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 741 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+72.37 грн
25+63.67 грн
100+57.64 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MIC9130BM mic9130.pdf
MIC9130BM
Виробник: Microchip Technology
Description: IC REG CTRLR TELECOM 1OUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
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MIC9130BQS mic9130.pdf
MIC9130BQS
Виробник: Microchip Technology
Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
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