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MTFC16GAPALBH-AAT TR MTFC16GAPALBH-AAT TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GAPALBH-AIT ES TR MTFC16GAPALBH-AIT ES TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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MTFC16GAPALBH-AIT ES MTFC16GAPALBH-AIT ES Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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MTFC16GAPALBH-AAT ES MTFC16GAPALBH-AAT ES Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GAPALBH-AAT ES TR MTFC16GAPALBH-AAT ES TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GAPALBH-AAT MTFC16GAPALBH-AAT Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
на замовлення 1424 шт:
термін постачання 21-31 дні (днів)
1+1699.28 грн
10+1515.27 грн
25+1467.13 грн
50+1342.98 грн
100+1309.48 грн
250+1265.98 грн
500+1213.54 грн
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MTFC16GAPALBH-AIT MTFC16GAPALBH-AIT Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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MT53D1024M32D4NQ-046 AAT ES :D T MT53D1024M32D4NQ-046 AAT ES :D T Micron Technology Inc. Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
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MT53D1024M32D4NQ-046 AIT ES:D TR MT53D1024M32D4NQ-046 AIT ES:D TR Micron Technology Inc. Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
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MT53D1024M32D4NQ-046 WT ES:D TR MT53D1024M32D4NQ-046 WT ES:D TR Micron Technology Inc. Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
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MT55L1MY18PT-6 MT55L1MY18PT-6 Micron Technology Inc. MICTS01163-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Asynchronous, ZBT
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
на замовлення 233 шт:
термін постачання 21-31 дні (днів)
16+1454.02 грн
Мінімальне замовлення: 16
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MT47H32M16NF-25E AAT:H MT47H32M16NF-25E AAT:H Micron Technology Inc. 512mb_ddr2_automotive.pdf Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1066 шт:
термін постачання 21-31 дні (днів)
1+390.44 грн
10+349.65 грн
25+339.22 грн
50+310.86 грн
100+303.40 грн
250+293.62 грн
500+281.62 грн
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MT47H32M16NF-25E AIT:H MT47H32M16NF-25E AIT:H Micron Technology Inc. Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT47H32M16NF-25E AIT:H TR MT47H32M16NF-25E AIT:H TR Micron Technology Inc. Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tape & Reel (TR)
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT47H32M16NF-25E AUT:H MT47H32M16NF-25E AUT:H Micron Technology Inc. Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tray
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT29F64G08CECCBH1-12Z:C TR MT29F64G08CECCBH1-12Z:C TR Micron Technology Inc. Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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MT29F64G08CECCBH1-12:C TR MT29F64G08CECCBH1-12:C TR Micron Technology Inc. Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
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MT29F64G08CECCBH1-12ITZ:C TR MT29F64G08CECCBH1-12ITZ:C TR Micron Technology Inc. Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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MTFDKCC3T2TFC-1AZ15ABYY Micron Technology Inc. Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFC-1AZ1ZABYY Micron Technology Inc. Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCB3T2TFC-1AZ1ZABYY Micron Technology Inc. Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFC-1AZ45ABYY Micron Technology Inc. Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCB3T2TFS-1BC1ZABYY Micron Technology Inc. 7450-product-catalog.pdf Description: SSD 3.2TB 2.5" TLC NVME
Packaging: Tray
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC4ZABYY Micron Technology Inc. 7450_nvme_ssd_product_brief.pdf Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
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MTFDKCC3T2TFC-1AZ4ZABYY Micron Technology Inc. Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC45ABYY Micron Technology Inc. Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC15ABYY Micron Technology Inc. 7450-product-catalog.pdf Description: 7450 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC1ZABYY MTFDKCC3T2TFS-1BC1ZABYY Micron Technology Inc. Description: IC SSD FLASH NAND SLC
Packaging: Bulk
Part Status: Active
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) -
Type: NVMe
Form Factor: U.3 Module
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+66424.07 грн
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MTSD128ANC8MS-1WT MTSD128ANC8MS-1WT Micron Technology Inc. micro-sd-card-flyer.pdf Description: MEM CARD MICROSD 128GB 10 UHS 1
Packaging: Tray
Memory Size: 128GB
Speed: Class 10, UHS Class 1
Memory Type: microSD™
Operating Temperature: -25°C ~ 85°C
Part Status: Active
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
1+3413.29 грн
10+2916.01 грн
25+2780.39 грн
40+2546.22 грн
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MT29F8T08EWLKEM5-ITF:K Micron Technology Inc. Description: IC FLASH 8TBIT LBGA
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Memory Size: 8Tbit
Memory Format: FLASH
Memory Organization: 1T x 8
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MT29F8T08EWLKEM5-ITF:K TR Micron Technology Inc. Description: IC FLASH 8TBIT LBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Memory Size: 8Tbit
Memory Format: FLASH
Memory Organization: 1T x 8
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MT53E512M16D1Z11MWC1 Micron Technology Inc. Description: LPDDR4 8G DIE 512MX16
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Memory Format: DRAM
Supplier Device Package: Wafer
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53D512M16D1DS-046 IT:D MT53D512M16D1DS-046 IT:D Micron Technology Inc. 200b_z11m_sdp_ddp_qdp_auto_lpddr4_lpddr4x_mt53d.pdf Description: IC DRAM 8GBIT 2.133GHZ 200WFBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
на замовлення 1355 шт:
термін постачання 21-31 дні (днів)
1+897.93 грн
10+767.57 грн
25+732.00 грн
50+662.74 грн
100+639.33 грн
250+609.60 грн
500+578.34 грн
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MT53D512M16D1DS-046 IT:D TR Micron Technology Inc. 200b_z11m_sdp_ddp_qdp_auto_lpddr4_lpddr4x_mt53d.pdf Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AAT:D MT53E512M16D1FW-046 AAT:D Micron Technology Inc. Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AAT:D TR MT53E512M16D1FW-046 AAT:D TR Micron Technology Inc. Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AIT:D MT53E512M16D1FW-046 AIT:D Micron Technology Inc. Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AIT:D TR MT53E512M16D1FW-046 AIT:D TR Micron Technology Inc. Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT41K512M16VRP-107 IT:P TR Micron Technology Inc. Description: IC DRAM 8GBIT PARALLEL 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
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MT41K512M16VRP-107 AAT:P TR MT41K512M16VRP-107 AAT:P TR Micron Technology Inc. ddr3l_8gb_x16_1cs_twindie_v00h.pdf Description: IC DRAM 8GBIT PAR 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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MT41K512M16VRP-107 AAT:P MT41K512M16VRP-107 AAT:P Micron Technology Inc. ddr3l_8gb_x16_1cs_twindie_v00h.pdf Description: IC DRAM 8GBIT PAR 96FBGA
Packaging: Box
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 473 шт:
термін постачання 21-31 дні (днів)
1+1365.32 грн
10+1217.64 грн
25+1179.24 грн
50+1079.60 грн
100+1052.79 грн
250+1017.92 грн
В кошику  од. на суму  грн.
MT55V512V36PF-10 MT55V512V36PF-10 Micron Technology Inc. MICTS01163-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 36
на замовлення 669 шт:
термін постачання 21-31 дні (днів)
18+1329.16 грн
Мінімальне замовлення: 18
В кошику  од. на суму  грн.
MT55V512V32PF-10 MT55V512V32PF-10 Micron Technology Inc. MICTS01163-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 32
DigiKey Programmable: Not Verified
на замовлення 97 шт:
термін постачання 21-31 дні (днів)
16+1420.98 грн
Мінімальне замовлення: 16
В кошику  од. на суму  грн.
MT47H128M8SH-25E AAT:M MT47H128M8SH-25E AAT:M Micron Technology Inc. MT47H256M4_MT47H128M8_MT47H64M16_DS.pdf Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tray
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
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MT47H128M8SH-25E AAT:M TR MT47H128M8SH-25E AAT:M TR Micron Technology Inc. MT47H256M4_MT47H128M8_MT47H64M16_DS.pdf Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
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MTFC16GLWDM-4M AIT Z MTFC16GLWDM-4M AIT Z Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLXAM-WT TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLTAM-WT TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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В кошику  од. на суму  грн.
MTFC16GLTDV-WT TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 169VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLWDQ-4M AIT Z TR MTFC16GLWDQ-4M AIT Z TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 100LBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-LBGA (14x18)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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В кошику  од. на суму  грн.
MTFC16GLXDV-WT TR Micron Technology Inc. Description: IC FLASH 128GBIT MMC 169VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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В кошику  од. на суму  грн.
MTFC16GLWDQ-4M AIT Z MTFC16GLWDQ-4M AIT Z Micron Technology Inc. Description: IC FLASH 128GBIT MMC 100LBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-LBGA (14x18)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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В кошику  од. на суму  грн.
MTFC256GARATEK-WT TR Micron Technology Inc. Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS 3.1
Memory Organization: 256G x 8
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В кошику  од. на суму  грн.
MTFC256GAXAUEA-WT TR Micron Technology Inc. Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-WFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS
Memory Organization: 256G x 8
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MTFC256GAXAUEA-WT Micron Technology Inc. Description: UFS 2T
Packaging: Box
Package / Case: 153-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-WFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS
Memory Organization: 256G x 8
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В кошику  од. на суму  грн.
MTFC256GAXATEA-WT Micron Technology Inc. Description: UFS 2T
Packaging: Box
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
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В кошику  од. на суму  грн.
MTFC256GAXATEA-WT TR Micron Technology Inc. Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
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В кошику  од. на суму  грн.
MTFC256GARATEK-WT Micron Technology Inc. Description: UFS 2T
Packaging: Box
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS 3.1
Memory Organization: 256G x 8
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В кошику  од. на суму  грн.
MT29F2T08EMLEEJ4-T:E TR MT29F2T08EMLEEJ4-T:E TR Micron Technology Inc. Description: IC FLASH 2TBIT VBGA
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
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MT29F2T08EMLEEJ4-T:E MT29F2T08EMLEEJ4-T:E Micron Technology Inc. Description: IC FLASH 2TBIT VBGA
Packaging: Box
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
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MTFC16GAPALBH-AAT TR
MTFC16GAPALBH-AAT TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GAPALBH-AIT ES TR
MTFC16GAPALBH-AIT ES TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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MTFC16GAPALBH-AIT ES
MTFC16GAPALBH-AIT ES
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MTFC16GAPALBH-AAT ES
MTFC16GAPALBH-AAT ES
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GAPALBH-AAT ES TR
MTFC16GAPALBH-AAT ES TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
товару немає в наявності
В кошику  од. на суму  грн.
MTFC16GAPALBH-AAT
MTFC16GAPALBH-AAT
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
на замовлення 1424 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1699.28 грн
10+1515.27 грн
25+1467.13 грн
50+1342.98 грн
100+1309.48 грн
250+1265.98 грн
500+1213.54 грн
В кошику  од. на суму  грн.
MTFC16GAPALBH-AIT
MTFC16GAPALBH-AIT
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MT53D1024M32D4NQ-046 AAT ES :D T
MT53D1024M32D4NQ-046 AAT ES :D T
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
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MT53D1024M32D4NQ-046 AIT ES:D TR
MT53D1024M32D4NQ-046 AIT ES:D TR
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
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MT53D1024M32D4NQ-046 WT ES:D TR
MT53D1024M32D4NQ-046 WT ES:D TR
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
товару немає в наявності
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MT55L1MY18PT-6 MICTS01163-1.pdf?t.download=true&u=5oefqw
MT55L1MY18PT-6
Виробник: Micron Technology Inc.
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Asynchronous, ZBT
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
на замовлення 233 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
16+1454.02 грн
Мінімальне замовлення: 16
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MT47H32M16NF-25E AAT:H 512mb_ddr2_automotive.pdf
MT47H32M16NF-25E AAT:H
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1066 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+390.44 грн
10+349.65 грн
25+339.22 грн
50+310.86 грн
100+303.40 грн
250+293.62 грн
500+281.62 грн
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MT47H32M16NF-25E AIT:H
MT47H32M16NF-25E AIT:H
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT47H32M16NF-25E AIT:H TR
MT47H32M16NF-25E AIT:H TR
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tape & Reel (TR)
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT47H32M16NF-25E AUT:H
MT47H32M16NF-25E AUT:H
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tray
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MT29F64G08CECCBH1-12Z:C TR
MT29F64G08CECCBH1-12Z:C TR
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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MT29F64G08CECCBH1-12:C TR
MT29F64G08CECCBH1-12:C TR
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
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MT29F64G08CECCBH1-12ITZ:C TR
MT29F64G08CECCBH1-12ITZ:C TR
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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MTFDKCC3T2TFC-1AZ15ABYY
Виробник: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFC-1AZ1ZABYY
Виробник: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCB3T2TFC-1AZ1ZABYY
Виробник: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFC-1AZ45ABYY
Виробник: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCB3T2TFS-1BC1ZABYY 7450-product-catalog.pdf
Виробник: Micron Technology Inc.
Description: SSD 3.2TB 2.5" TLC NVME
Packaging: Tray
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC4ZABYY 7450_nvme_ssd_product_brief.pdf
Виробник: Micron Technology Inc.
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
MTFDKCC3T2TFC-1AZ4ZABYY
Виробник: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
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MTFDKCC3T2TFS-1BC45ABYY
Виробник: Micron Technology Inc.
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
товару немає в наявності
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MTFDKCC3T2TFS-1BC15ABYY 7450-product-catalog.pdf
Виробник: Micron Technology Inc.
Description: 7450 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
товару немає в наявності
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MTFDKCC3T2TFS-1BC1ZABYY
MTFDKCC3T2TFS-1BC1ZABYY
Виробник: Micron Technology Inc.
Description: IC SSD FLASH NAND SLC
Packaging: Bulk
Part Status: Active
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) -
Type: NVMe
Form Factor: U.3 Module
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+66424.07 грн
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MTSD128ANC8MS-1WT micro-sd-card-flyer.pdf
MTSD128ANC8MS-1WT
Виробник: Micron Technology Inc.
Description: MEM CARD MICROSD 128GB 10 UHS 1
Packaging: Tray
Memory Size: 128GB
Speed: Class 10, UHS Class 1
Memory Type: microSD™
Operating Temperature: -25°C ~ 85°C
Part Status: Active
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3413.29 грн
10+2916.01 грн
25+2780.39 грн
40+2546.22 грн
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MT29F8T08EWLKEM5-ITF:K
Виробник: Micron Technology Inc.
Description: IC FLASH 8TBIT LBGA
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Memory Size: 8Tbit
Memory Format: FLASH
Memory Organization: 1T x 8
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MT29F8T08EWLKEM5-ITF:K TR
Виробник: Micron Technology Inc.
Description: IC FLASH 8TBIT LBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Memory Size: 8Tbit
Memory Format: FLASH
Memory Organization: 1T x 8
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MT53E512M16D1Z11MWC1
Виробник: Micron Technology Inc.
Description: LPDDR4 8G DIE 512MX16
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Memory Format: DRAM
Supplier Device Package: Wafer
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53D512M16D1DS-046 IT:D 200b_z11m_sdp_ddp_qdp_auto_lpddr4_lpddr4x_mt53d.pdf
MT53D512M16D1DS-046 IT:D
Виробник: Micron Technology Inc.
Description: IC DRAM 8GBIT 2.133GHZ 200WFBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
на замовлення 1355 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+897.93 грн
10+767.57 грн
25+732.00 грн
50+662.74 грн
100+639.33 грн
250+609.60 грн
500+578.34 грн
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MT53D512M16D1DS-046 IT:D TR 200b_z11m_sdp_ddp_qdp_auto_lpddr4_lpddr4x_mt53d.pdf
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AAT:D
MT53E512M16D1FW-046 AAT:D
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AAT:D TR
MT53E512M16D1FW-046 AAT:D TR
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AIT:D
MT53E512M16D1FW-046 AIT:D
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT53E512M16D1FW-046 AIT:D TR
MT53E512M16D1FW-046 AIT:D TR
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
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MT41K512M16VRP-107 IT:P TR
Виробник: Micron Technology Inc.
Description: IC DRAM 8GBIT PARALLEL 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
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MT41K512M16VRP-107 AAT:P TR ddr3l_8gb_x16_1cs_twindie_v00h.pdf
MT41K512M16VRP-107 AAT:P TR
Виробник: Micron Technology Inc.
Description: IC DRAM 8GBIT PAR 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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MT41K512M16VRP-107 AAT:P ddr3l_8gb_x16_1cs_twindie_v00h.pdf
MT41K512M16VRP-107 AAT:P
Виробник: Micron Technology Inc.
Description: IC DRAM 8GBIT PAR 96FBGA
Packaging: Box
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 473 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1365.32 грн
10+1217.64 грн
25+1179.24 грн
50+1079.60 грн
100+1052.79 грн
250+1017.92 грн
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MT55V512V36PF-10 MICTS01163-1.pdf?t.download=true&u=5oefqw
MT55V512V36PF-10
Виробник: Micron Technology Inc.
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 36
на замовлення 669 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
18+1329.16 грн
Мінімальне замовлення: 18
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MT55V512V32PF-10 MICTS01163-1.pdf?t.download=true&u=5oefqw
MT55V512V32PF-10
Виробник: Micron Technology Inc.
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 32
DigiKey Programmable: Not Verified
на замовлення 97 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
16+1420.98 грн
Мінімальне замовлення: 16
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MT47H128M8SH-25E AAT:M MT47H256M4_MT47H128M8_MT47H64M16_DS.pdf
MT47H128M8SH-25E AAT:M
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tray
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
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MT47H128M8SH-25E AAT:M TR MT47H256M4_MT47H128M8_MT47H64M16_DS.pdf
MT47H128M8SH-25E AAT:M TR
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
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MTFC16GLWDM-4M AIT Z
MTFC16GLWDM-4M AIT Z
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLXAM-WT TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLTAM-WT TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLTDV-WT TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 169VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLWDQ-4M AIT Z TR
MTFC16GLWDQ-4M AIT Z TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 100LBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-LBGA (14x18)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLXDV-WT TR
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 169VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC16GLWDQ-4M AIT Z
MTFC16GLWDQ-4M AIT Z
Виробник: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 100LBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-LBGA (14x18)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
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MTFC256GARATEK-WT TR
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS 3.1
Memory Organization: 256G x 8
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MTFC256GAXAUEA-WT TR
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-WFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS
Memory Organization: 256G x 8
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MTFC256GAXAUEA-WT
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Box
Package / Case: 153-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-WFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS
Memory Organization: 256G x 8
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MTFC256GAXATEA-WT
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Box
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
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MTFC256GAXATEA-WT TR
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
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MTFC256GARATEK-WT
Виробник: Micron Technology Inc.
Description: UFS 2T
Packaging: Box
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS 3.1
Memory Organization: 256G x 8
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MT29F2T08EMLEEJ4-T:E TR
MT29F2T08EMLEEJ4-T:E TR
Виробник: Micron Technology Inc.
Description: IC FLASH 2TBIT VBGA
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
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MT29F2T08EMLEEJ4-T:E
MT29F2T08EMLEEJ4-T:E
Виробник: Micron Technology Inc.
Description: IC FLASH 2TBIT VBGA
Packaging: Box
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
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