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RS407L (аналог KBL410) (діодний міст) RS407L (аналог KBL410) (діодний міст)
Код товару: 42655 		YJ KBL4_RSL4_KBL6.pdf Діоди, діодні мости, стабілітрони > Діодні мости та збірки
Корпус: RS-L/KBL
Uзвор, V: 1000 V
I пр, A: 4 A
Тип діодного моста: Однофазний
Монтаж: THT
Імпульсний струм, А: 200 A
товар відсутній
1442655G1C-C 1442655G1C-C ATGBICS mmo_87098489_1650029629_2896_5145.pdf Description: 1000BASE-LX SFP 1310nm 10km
Packaging: Retail Package
Connector Type: LC
Wavelength: 1310nm
Mounting Type: Pluggable, SFP
Voltage - Supply: 3.3V
Applications: Ethernet
Data Rate: 1Gbps
на замовлення 8352 шт:
термін постачання 21-31 дні (днів)
1+1596.32 грн
50+ 1460.45 грн
150+ 1383.58 грн
1000+ 1226.3 грн
964265-5 TE Connectivity Category: Unclassified
Description: 964265-5
на замовлення 6500 шт:
термін постачання 21-30 дні (днів)
6500+11.43 грн
Мінімальне замовлення: 6500
T3426550U AMPHENOL Category: Industrial connectors - Unclassified
Description: T3426550U
на замовлення 245 шт:
термін постачання 21-30 дні (днів)
10+268.19 грн
140+ 158.16 грн
Мінімальне замовлення: 10
E559BB-0021=P3(1-426-559-2
на замовлення 6000 шт:
термін постачання 14-28 дні (днів)
E559BB-0021=P3(1-426-559-21)
на замовлення 3000 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50 SANYO 00+
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50 SANYO TSOP
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50 SANYO 00+
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
53_SMA-50-0-51/199_NE 53_SMA-50-0-51/199_NE Huber+Suhner, Inc. HUBERSUHNER53SMA50051199NEDataSheet.pdf Description: 53_SMA-50-0-51/199_NE
Packaging: Bulk
Impedance: 50 Ohms
Mounting Type: Free Hanging (In-Line), Right Angle
Style: Right Angle
Convert From (Adapter End): SMA Jack, Female Socket
Convert To (Adapter End): SMA Plug, Male Pin
Fastening Type: Threaded, Threaded
Adapter Series: SMA to SMA
Adapter Type: Plug to Jack
Center Gender: Female to Male
Conversion Type: Same Series
Center Contact Plating: Gold
Part Status: Active
Frequency - Max: 18 GHz
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+4783.21 грн
CD74ACT164E CD74ACT164E Texas Instruments suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fcd74ac164 Description: IC 8-BIT SHIFT REGISTER 14-DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-PDIP
Part Status: Active
Number of Bits per Element: 8
на замовлення 12954 шт:
термін постачання 21-31 дні (днів)
440+45.23 грн
Мінімальне замовлення: 440
CD74ACT164E CD74ACT164E Texas Instruments suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fcd74ac164 Description: IC 8-BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-PDIP
Part Status: Active
Number of Bits per Element: 8
на замовлення 554 шт:
термін постачання 21-31 дні (днів)
3+104.45 грн
10+ 90.04 грн
25+ 85.49 грн
100+ 65.91 грн
250+ 61.61 грн
500+ 54.45 грн
Мінімальне замовлення: 3
CY7C65631-56LTXI CY7C65631-56LTXI Infineon Technologies Infineon-CY7C65621_CY7C65631_EZ-USB_HX2LP_Lite_Low_Power_USB_2.0_Hub_Controller_Family-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecaf0514410&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC HUB CONTROLLER USB 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.15V ~ 3.45V
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 56-QFN (8x8)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 4495 шт:
термін постачання 21-31 дні (днів)
1+1179.23 грн
10+ 1043.85 грн
25+ 1000.6 грн
80+ 827.34 грн
260+ 786.73 грн
520+ 735.97 грн
DRV10963JJDSNR DRV10963JJDSNR Texas Instruments suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fdrv10963 Description: IC MOTOR DRIVER 2.1V-5.5V 10SON
Packaging: Bulk
Package / Case: 10-UFDFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 500mA
Interface: PWM
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 2.1V ~ 5.5V
Applications: Fan Motor Driver
Technology: Power MOSFET
Voltage - Load: 2.1V ~ 5.5V
Supplier Device Package: 10-SON (3x3)
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
на замовлення 306000 шт:
термін постачання 21-31 дні (днів)
484+41.24 грн
Мінімальне замовлення: 484
GBPAX-6 GBPAX-6 Curtis Industries Series-GFT-GB-Terminal-Blocks.pdf Description: CONN BARRIER STRIP 6CIRC 0.438"
Features: Flange
Packaging: Bulk
Color: Black
Current Rating (Amps): 20A
Wire Gauge: 12-22 AWG
Pitch: 0.438" (11.12mm)
Number of Rows: 1
Terminal Block Type: Barrier Block
Top Termination: Screws
Bottom Termination: PC Pin
Barrier Type: 2 Wall (Dual)
Part Status: Active
Number of Circuits: 6
Number of Wire Entries: 6
на замовлення 110 шт:
термін постачання 21-31 дні (днів)
1+674.26 грн
10+ 571.59 грн
25+ 539.1 грн
50+ 481.57 грн
100+ 472.41 грн
PS31L-NS11PR-M00 PS31L-NS11PR-M00 Carlo Gavazzi Inc. DatasheetPS31L-M.pdf Description: SWITCH SNAP ACT DPST 5.5A 130V
Packaging: Bulk
Current Rating (Amps): 5.5A (AC), 2.8A (DC)
Mounting Type: Chassis Mount
Circuit: DPST-NO/NC
Switch Function: On-Mom, Off-Mom
Operating Temperature: -25°C ~ 70°C
Termination Style: Screw Terminal
Actuator Type: Roller Plunger
Operating Force: 2243gf
Ingress Protection: IP66 - Dust Tight, Water Resistant
Part Status: Active
Voltage Rating - AC: 130 V
Voltage Rating - DC: 24 V
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+4656.43 грн
ROX05SJ9R1 ROX05SJ9R1 TE Connectivity Passive Product product-2-1676123-6.datasheet.pdf Description: RES 9.1 OHM 5% 1/2W AXIAL
Power (Watts): 0.5W, 1/2W
Tolerance: ±5%
Features: Flame Proof, Pulse Withstanding, Safety
Packaging: Cut Tape (CT)
Package / Case: Axial
Temperature Coefficient: ±200ppm/°C
Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
Composition: Metal Oxide Film
Operating Temperature: -55°C ~ 130°C
Number of Terminations: 2
Supplier Device Package: Axial
Part Status: Active
Resistance: 9.1 Ohms
на замовлення 4781 шт:
термін постачання 21-31 дні (днів)
24+12.25 грн
31+ 9.16 грн
40+ 7.02 грн
55+ 4.78 грн
100+ 3.35 грн
250+ 2.71 грн
500+ 2.1 грн
1000+ 1.46 грн
Мінімальне замовлення: 24
ROX05SJ9R1 ROX05SJ9R1 TE Connectivity Passive Product product-2-1676123-6.datasheet.pdf Description: RES 9.1 OHM 5% 1/2W AXIAL
Power (Watts): 0.5W, 1/2W
Tolerance: ±5%
Features: Flame Proof, Pulse Withstanding, Safety
Packaging: Tape & Box (TB)
Package / Case: Axial
Temperature Coefficient: ±200ppm/°C
Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
Composition: Metal Oxide Film
Operating Temperature: -55°C ~ 130°C
Number of Terminations: 2
Supplier Device Package: Axial
Part Status: Active
Resistance: 9.1 Ohms
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+1.89 грн
Мінімальне замовлення: 5000
TL1454ACDB TL1454ACDB Texas Instruments slvs423a.pdf Description: IC REG CTRLR MULT TOP 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Up, Step-Down, Step-Up/Step-Down
Operating Temperature: -20°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 50kHz ~ 2MHz
Topology: Buck, Boost, Flyback
Voltage - Supply (Vcc/Vdd): 3.6V ~ 20V
Supplier Device Package: 16-SSOP
Synchronous Rectifier: Yes
Control Features: Dead Time Control, Frequency Control
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 2
на замовлення 9705 шт:
термін постачання 21-31 дні (днів)
177+113.08 грн
Мінімальне замовлення: 177
U.FL-LP-N2 U.FL-LP-N2 HIROSE(HRS) 2626612.pdf Description: HIROSE(HRS) - U.FL-LP-N2 - Ausziehwerkzeug, SMD-Ultraminiatur-Koaxialsteckverbinder der Baureihe HRS U.FL, U.FL
tariffCode: 82055980
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
1+1394.73 грн
10+ 1367.09 грн
25+ 1338.7 грн
100+ 1217.41 грн
42-6551-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-18 Aries Electronics Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-18 Aries Electronics Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6553-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6553-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6553-18 Aries Electronics Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-30 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-31 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-40 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-41 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
05042655001 05042655001 WERA Category: Screwdriver Bits
Description: Adapter; Overall len: 30mm; Mounting: 1/4" (C6,3mm),3/8" square
Type of tool: adapter
Overall length: 30mm
Mounting: 1/4" (C6,3mm); 3/8" square
товар відсутній
05042655001 05042655001 WERA Category: Screwdriver Bits
Description: Adapter; Overall len: 30mm; Mounting: 1/4" (C6,3mm),3/8" square
Type of tool: adapter
Overall length: 30mm
Mounting: 1/4" (C6,3mm); 3/8" square
кількість в упаковці: 1 шт
товар відсутній
1426550000 Weidmüller createDatasheetForMobile.do?ordernumber=1426550000&scope1=1&scope2=0&localeId=en Description: LMFS 5.08/23/90 3.5SN BK BX
Packaging: Box
товар відсутній
516-038-542-655 516-038-542-655 EDAC Inc. EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 38
Pitch: 0.150" (3.81mm)
Number of Rows: 9
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
516-056-542-655 516-056-542-655 EDAC Inc. EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 56
Pitch: 0.150" (3.81mm)
Number of Rows: 9
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
516-090-542-655 516-090-542-655 EDAC Inc. EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 90
Pitch: 0.150" (3.81mm)
Number of Rows: 13
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
8426550000 8426550000 Weidmuller 8426550000_top_unit_l_12.5_en.pdf DIN Rail Electronic Housing
товар відсутній
94265-504 Amphenol ICC (FCI) 94265.pdf Description: CONN HEADER VERT 4POS 2MM
Packaging: Bag
Connector Type: Header
Voltage Rating: 200V (AC/DC)
Current Rating (Amps): 2A (AC/DC)
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Shape: Square
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Insulation Material: Plastic
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.079" (2.00mm)
товар відсутній
964265-5 TE Connectivity 32164257004533713216424764213354eng_cd_1355055_a20.pdf Tab 1.6x0.6 Type A
товар відсутній
D-142-65-55-22-5 TE Connectivity Raychem Cable Protection Description: D-142-65-55-22-5
Packaging: Box
товар відсутній
PE142655 Aptiv CONN 6F M/P 150 (13524093)
товар відсутній
RKTN 4-265/5 M Belden 603
товар відсутній
RST 4-RKT 4-265/5 M RST 4-RKT 4-265/5 M Belden rst4rkt4265_techdata.pdf Cable Assembly Sensor/Actuator 5m 22AWG M12 Circular to M12 Circular 4 to 4 POS M-F
товар відсутній
T 3426 550 T 3426 550 Amphenol nty.pdf Conn Circular M 6 POS Crimp ST Panel Mount 6 Terminal 1 Port
товар відсутній
T 3426 550 T 3426 550 Amphenol Tuchel Industrial C091.pdf Description: CONN RCP HSG ML 6P PNL MT SNAPIN
Packaging: Bulk
Connector Type: Receptacle Housing
Mounting Type: Panel Mount, Snap-In
Shielding: Unshielded
Number of Positions: 6
Type: For Male Pins
Orientation: Keyed
Shell Size - Insert: M16-6
Contact Type: Crimp
Fastening Type: Bayonet Lock
Ingress Protection: IP40
Contact Size: 1.5mm
Material Flammability Rating: UL94 V-0
Housing Color: Black
Shell Material: Plastic
товар відсутній
257-602 257-602 WAGO Corporation Datasheet.pdf?product=257-602&lang=en Description: PCB TERMINAL BLOCK; PUSH-BUTTON;
Features: Push Button Actuated
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Pitch: 0.400" (10.16mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 2
Wire Termination: Screwless - Push Button Clamp
Part Status: Active
Current: 15 A
Number of Levels: 1
Voltage: 300 V
товар відсутній
961122-6804-AR 961122-6804-AR 3M 961_2.54mm_StraightSolderTail_DS.pdf Description: CONN HEADER VERT 22POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2A
Mounting Type: Through Hole
Number of Positions: 22
Number of Rows: 1
Style: Board to Board
Operating Temperature: -25°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.098" (2.50mm)
Shrouding: Unshrouded
Overall Contact Length: 0.496" (12.60mm)
Insulation Material: Thermoplastic
Contact Length - Mating: 0.268" (6.80mm)
товар відсутній
A3M34TL139T2 NXP USA Inc. A3M34TL139.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
RS407L (аналог KBL410) (діодний міст)
Код товару: 42655		 KBL4_RSL4_KBL6.pdf
RS407L (аналог KBL410) (діодний міст)
Виробник: YJ
Діоди, діодні мости, стабілітрони > Діодні мости та збірки
Корпус: RS-L/KBL
Uзвор, V: 1000 V
I пр, A: 4 A
Тип діодного моста: Однофазний
Монтаж: THT
Імпульсний струм, А: 200 A
товар відсутній
1442655G1C-C mmo_87098489_1650029629_2896_5145.pdf
1442655G1C-C
Виробник: ATGBICS
Description: 1000BASE-LX SFP 1310nm 10km
Packaging: Retail Package
Connector Type: LC
Wavelength: 1310nm
Mounting Type: Pluggable, SFP
Voltage - Supply: 3.3V
Applications: Ethernet
Data Rate: 1Gbps
на замовлення 8352 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1596.32 грн
50+ 1460.45 грн
150+ 1383.58 грн
1000+ 1226.3 грн
964265-5
Виробник: TE Connectivity
Category: Unclassified
Description: 964265-5
на замовлення 6500 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна без ПДВ
6500+11.43 грн
Мінімальне замовлення: 6500
T3426550U
Виробник: AMPHENOL
Category: Industrial connectors - Unclassified
Description: T3426550U
на замовлення 245 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна без ПДВ
10+268.19 грн
140+ 158.16 грн
Мінімальне замовлення: 10
E559BB-0021=P3(1-426-559-2
на замовлення 6000 шт:
термін постачання 14-28 дні (днів)
E559BB-0021=P3(1-426-559-21)
на замовлення 3000 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50
Виробник: SANYO
00+
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50
Виробник: SANYO
TSOP
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
LC32V4265-50
Виробник: SANYO
00+
на замовлення 120 шт:
термін постачання 14-28 дні (днів)
53_SMA-50-0-51/199_NE HUBERSUHNER53SMA50051199NEDataSheet.pdf
53_SMA-50-0-51/199_NE
Виробник: Huber+Suhner, Inc.
Description: 53_SMA-50-0-51/199_NE
Packaging: Bulk
Impedance: 50 Ohms
Mounting Type: Free Hanging (In-Line), Right Angle
Style: Right Angle
Convert From (Adapter End): SMA Jack, Female Socket
Convert To (Adapter End): SMA Plug, Male Pin
Fastening Type: Threaded, Threaded
Adapter Series: SMA to SMA
Adapter Type: Plug to Jack
Center Gender: Female to Male
Conversion Type: Same Series
Center Contact Plating: Gold
Part Status: Active
Frequency - Max: 18 GHz
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+4783.21 грн
CD74ACT164E suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fcd74ac164
CD74ACT164E
Виробник: Texas Instruments
Description: IC 8-BIT SHIFT REGISTER 14-DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-PDIP
Part Status: Active
Number of Bits per Element: 8
на замовлення 12954 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
440+45.23 грн
Мінімальне замовлення: 440
CD74ACT164E suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fcd74ac164
CD74ACT164E
Виробник: Texas Instruments
Description: IC 8-BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-PDIP
Part Status: Active
Number of Bits per Element: 8
на замовлення 554 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+104.45 грн
10+ 90.04 грн
25+ 85.49 грн
100+ 65.91 грн
250+ 61.61 грн
500+ 54.45 грн
Мінімальне замовлення: 3
CY7C65631-56LTXI Infineon-CY7C65621_CY7C65631_EZ-USB_HX2LP_Lite_Low_Power_USB_2.0_Hub_Controller_Family-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecaf0514410&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
CY7C65631-56LTXI
Виробник: Infineon Technologies
Description: IC HUB CONTROLLER USB 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.15V ~ 3.45V
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 56-QFN (8x8)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 4495 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1179.23 грн
10+ 1043.85 грн
25+ 1000.6 грн
80+ 827.34 грн
260+ 786.73 грн
520+ 735.97 грн
DRV10963JJDSNR suppproductinfo.tsp?distId=10&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fdrv10963
DRV10963JJDSNR
Виробник: Texas Instruments
Description: IC MOTOR DRIVER 2.1V-5.5V 10SON
Packaging: Bulk
Package / Case: 10-UFDFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 500mA
Interface: PWM
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 2.1V ~ 5.5V
Applications: Fan Motor Driver
Technology: Power MOSFET
Voltage - Load: 2.1V ~ 5.5V
Supplier Device Package: 10-SON (3x3)
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
на замовлення 306000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
484+41.24 грн
Мінімальне замовлення: 484
GBPAX-6 Series-GFT-GB-Terminal-Blocks.pdf
GBPAX-6
Виробник: Curtis Industries
Description: CONN BARRIER STRIP 6CIRC 0.438"
Features: Flange
Packaging: Bulk
Color: Black
Current Rating (Amps): 20A
Wire Gauge: 12-22 AWG
Pitch: 0.438" (11.12mm)
Number of Rows: 1
Terminal Block Type: Barrier Block
Top Termination: Screws
Bottom Termination: PC Pin
Barrier Type: 2 Wall (Dual)
Part Status: Active
Number of Circuits: 6
Number of Wire Entries: 6
на замовлення 110 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+674.26 грн
10+ 571.59 грн
25+ 539.1 грн
50+ 481.57 грн
100+ 472.41 грн
PS31L-NS11PR-M00 DatasheetPS31L-M.pdf
PS31L-NS11PR-M00
Виробник: Carlo Gavazzi Inc.
Description: SWITCH SNAP ACT DPST 5.5A 130V
Packaging: Bulk
Current Rating (Amps): 5.5A (AC), 2.8A (DC)
Mounting Type: Chassis Mount
Circuit: DPST-NO/NC
Switch Function: On-Mom, Off-Mom
Operating Temperature: -25°C ~ 70°C
Termination Style: Screw Terminal
Actuator Type: Roller Plunger
Operating Force: 2243gf
Ingress Protection: IP66 - Dust Tight, Water Resistant
Part Status: Active
Voltage Rating - AC: 130 V
Voltage Rating - DC: 24 V
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+4656.43 грн
ROX05SJ9R1 product-2-1676123-6.datasheet.pdf
ROX05SJ9R1
Виробник: TE Connectivity Passive Product
Description: RES 9.1 OHM 5% 1/2W AXIAL
Power (Watts): 0.5W, 1/2W
Tolerance: ±5%
Features: Flame Proof, Pulse Withstanding, Safety
Packaging: Cut Tape (CT)
Package / Case: Axial
Temperature Coefficient: ±200ppm/°C
Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
Composition: Metal Oxide Film
Operating Temperature: -55°C ~ 130°C
Number of Terminations: 2
Supplier Device Package: Axial
Part Status: Active
Resistance: 9.1 Ohms
на замовлення 4781 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
24+12.25 грн
31+ 9.16 грн
40+ 7.02 грн
55+ 4.78 грн
100+ 3.35 грн
250+ 2.71 грн
500+ 2.1 грн
1000+ 1.46 грн
Мінімальне замовлення: 24
ROX05SJ9R1 product-2-1676123-6.datasheet.pdf
ROX05SJ9R1
Виробник: TE Connectivity Passive Product
Description: RES 9.1 OHM 5% 1/2W AXIAL
Power (Watts): 0.5W, 1/2W
Tolerance: ±5%
Features: Flame Proof, Pulse Withstanding, Safety
Packaging: Tape & Box (TB)
Package / Case: Axial
Temperature Coefficient: ±200ppm/°C
Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
Composition: Metal Oxide Film
Operating Temperature: -55°C ~ 130°C
Number of Terminations: 2
Supplier Device Package: Axial
Part Status: Active
Resistance: 9.1 Ohms
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5000+1.89 грн
Мінімальне замовлення: 5000
TL1454ACDB slvs423a.pdf
TL1454ACDB
Виробник: Texas Instruments
Description: IC REG CTRLR MULT TOP 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Up, Step-Down, Step-Up/Step-Down
Operating Temperature: -20°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 50kHz ~ 2MHz
Topology: Buck, Boost, Flyback
Voltage - Supply (Vcc/Vdd): 3.6V ~ 20V
Supplier Device Package: 16-SSOP
Synchronous Rectifier: Yes
Control Features: Dead Time Control, Frequency Control
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 2
на замовлення 9705 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
177+113.08 грн
Мінімальне замовлення: 177
U.FL-LP-N2 2626612.pdf
U.FL-LP-N2
Виробник: HIROSE(HRS)
Description: HIROSE(HRS) - U.FL-LP-N2 - Ausziehwerkzeug, SMD-Ultraminiatur-Koaxialsteckverbinder der Baureihe HRS U.FL, U.FL
tariffCode: 82055980
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1394.73 грн
10+ 1367.09 грн
25+ 1338.7 грн
100+ 1217.41 грн
42-6551-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6551-18
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6552-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6552-18
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6553-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6553-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6553-18
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
42-6554-10 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Packaging: Tray
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6554-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
товар відсутній
42-6554-16 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товар відсутній
42-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-30 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-31 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
42-6556-40 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
42-6556-41 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
05042655001
05042655001
Виробник: WERA
Category: Screwdriver Bits
Description: Adapter; Overall len: 30mm; Mounting: 1/4" (C6,3mm),3/8" square
Type of tool: adapter
Overall length: 30mm
Mounting: 1/4" (C6,3mm); 3/8" square
товар відсутній
05042655001
05042655001
Виробник: WERA
Category: Screwdriver Bits
Description: Adapter; Overall len: 30mm; Mounting: 1/4" (C6,3mm),3/8" square
Type of tool: adapter
Overall length: 30mm
Mounting: 1/4" (C6,3mm); 3/8" square
кількість в упаковці: 1 шт
товар відсутній
1426550000 createDatasheetForMobile.do?ordernumber=1426550000&scope1=1&scope2=0&localeId=en
Виробник: Weidmüller
Description: LMFS 5.08/23/90 3.5SN BK BX
Packaging: Box
товар відсутній
516-038-542-655 EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf
516-038-542-655
Виробник: EDAC Inc.
Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 38
Pitch: 0.150" (3.81mm)
Number of Rows: 9
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
516-056-542-655 EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf
516-056-542-655
Виробник: EDAC Inc.
Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 56
Pitch: 0.150" (3.81mm)
Number of Rows: 9
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
516-090-542-655 EDAC%20516%20Series%20Rectangular%20Rack%20&%20Panel%20Connectors%20English%20Ordering%20Guide.pdf
516-090-542-655
Виробник: EDAC Inc.
Description: 516 SERIES RACK & PANEL CONNECTO
Features: Backshell, Jackscrew
Packaging: Box
Connector Type: Housing for Non-Gendered Contacts
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 90
Pitch: 0.150" (3.81mm)
Number of Rows: 13
Connector Usage: Receptacle
Connector Style: Rack and Panel
товар відсутній
8426550000 8426550000_top_unit_l_12.5_en.pdf
8426550000
Виробник: Weidmuller
DIN Rail Electronic Housing
товар відсутній
94265-504 94265.pdf
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER VERT 4POS 2MM
Packaging: Bag
Connector Type: Header
Voltage Rating: 200V (AC/DC)
Current Rating (Amps): 2A (AC/DC)
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Shape: Square
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Insulation Material: Plastic
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.079" (2.00mm)
товар відсутній
964265-5 32164257004533713216424764213354eng_cd_1355055_a20.pdf
Виробник: TE Connectivity
Tab 1.6x0.6 Type A
товар відсутній
D-142-65-55-22-5
Виробник: TE Connectivity Raychem Cable Protection
Description: D-142-65-55-22-5
Packaging: Box
товар відсутній
PE142655
Виробник: Aptiv
CONN 6F M/P 150 (13524093)
товар відсутній
RKTN 4-265/5 M
Виробник: Belden
603
товар відсутній
RST 4-RKT 4-265/5 M rst4rkt4265_techdata.pdf
RST 4-RKT 4-265/5 M
Виробник: Belden
Cable Assembly Sensor/Actuator 5m 22AWG M12 Circular to M12 Circular 4 to 4 POS M-F
товар відсутній
T 3426 550 nty.pdf
T 3426 550
Виробник: Amphenol
Conn Circular M 6 POS Crimp ST Panel Mount 6 Terminal 1 Port
товар відсутній
T 3426 550 C091.pdf
T 3426 550
Виробник: Amphenol Tuchel Industrial
Description: CONN RCP HSG ML 6P PNL MT SNAPIN
Packaging: Bulk
Connector Type: Receptacle Housing
Mounting Type: Panel Mount, Snap-In
Shielding: Unshielded
Number of Positions: 6
Type: For Male Pins
Orientation: Keyed
Shell Size - Insert: M16-6
Contact Type: Crimp
Fastening Type: Bayonet Lock
Ingress Protection: IP40
Contact Size: 1.5mm
Material Flammability Rating: UL94 V-0
Housing Color: Black
Shell Material: Plastic
товар відсутній
257-602 Datasheet.pdf?product=257-602&lang=en
257-602
Виробник: WAGO Corporation
Description: PCB TERMINAL BLOCK; PUSH-BUTTON;
Features: Push Button Actuated
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Pitch: 0.400" (10.16mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 2
Wire Termination: Screwless - Push Button Clamp
Part Status: Active
Current: 15 A
Number of Levels: 1
Voltage: 300 V
товар відсутній
961122-6804-AR 961_2.54mm_StraightSolderTail_DS.pdf
961122-6804-AR
Виробник: 3M
Description: CONN HEADER VERT 22POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2A
Mounting Type: Through Hole
Number of Positions: 22
Number of Rows: 1
Style: Board to Board
Operating Temperature: -25°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.098" (2.50mm)
Shrouding: Unshrouded
Overall Contact Length: 0.496" (12.60mm)
Insulation Material: Thermoplastic
Contact Length - Mating: 0.268" (6.80mm)
товар відсутній
A3M34TL139T2 A3M34TL139.pdf
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
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