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НазваВиробникІнформаціяДоступністьЦіна без ПДВ
DIP300T600P26Chip Quik Inc.Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+358.80 грн
В кошику  од. на суму  грн.
DIP300T600P28Chip Quik Inc.Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+382.10 грн
В кошику  од. на суму  грн.
DIP306-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 6POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
DIP308-001BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP308-011BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP308-014BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-001BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-011BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-011BAmphenol Communications Solutions-FCIConn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole
на замовлення 710 шт:
термін постачання 21-31 дні (днів)
18+799.75 грн
100+729.73 грн
500+415.23 грн
Мінімальне замовлення: 18 шт
В кошику  од. на суму  грн.
DIP316-001BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP316-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP316-014BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS TIN
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP318-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2376 шт
В кошику  од. на суму  грн.
DIP320-001BAmphenol ICC (FCI)Description: DIP320-001B-DIP SOCKET 20 CTS
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
товару немає в наявності
В кошику  од. на суму  грн.
DIP320-011BAmphenol ICC (FCI)Description: DIP320-011B-DIP SOCKET 20 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-001BAmphenol ICC (FCI)Description: DIP324-001B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-011BAmphenol ICC (FCI)Description: DIP324-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-014BAmphenol ICC (FCI)Description: DIP324-014B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS TIN
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-011BAmphenol ICC (FCI)Description: DIP328-011B-DIP SOCKET 28 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-014BAmphenol ICC (FCI)Description: DIP328-014B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
DIP600-SOIC-08NChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+687.32 грн
5+571.52 грн
В кошику  од. на суму  грн.
DIP600-SOIC-08NChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
1+539.62 грн
В кошику  од. на суму  грн.
DIP600-SOIC-08WChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+756.44 грн
5+629.26 грн
10+593.96 грн
В кошику  од. на суму  грн.
DIP600-SOIC-08WChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 18 шт:
термін постачання 21-30 дні (днів)
1+553.31 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10NChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+773.53 грн
5+643.62 грн
10+607.57 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10NChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 15 шт:
термін постачання 21-30 дні (днів)
1+567.00 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10WChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+790.61 грн
5+657.98 грн
10+621.26 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10WChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
1+581.50 грн
В кошику  од. на суму  грн.
DIP600-SOIC-12NChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+807.70 грн
5+672.33 грн
10+634.79 грн
В кошику  од. на суму  грн.
DIP600-SOIC-12NChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 24 шт:
термін постачання 21-30 дні (днів)
1+595.19 грн
В кошику  од. на суму  грн.
DIP600-SOIC-12WChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+824.01 грн
5+686.54 грн
10+648.40 грн
В кошику  од. на суму  грн.
DIP600-SOIC-12WChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
1+608.88 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14NChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+841.87 грн
5+700.90 грн
10+661.94 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14NChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 11 шт:
термін постачання 21-30 дні (днів)
1+622.57 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14WChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+858.18 грн
5+715.11 грн
10+675.48 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14WChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 19 шт:
термін постачання 21-30 дні (днів)
1+636.26 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16NChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+875.27 грн
5+729.32 грн
10+688.94 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16NChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 11 шт:
термін постачання 21-30 дні (днів)
1+650.76 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16WChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+892.35 грн
5+743.53 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16WChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 5 шт:
термін постачання 21-30 дні (днів)
1+664.45 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18NChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+908.66 грн
5+757.89 грн
10+715.94 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18NChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
1+678.14 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18WChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
1+691.84 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18WChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+925.75 грн
5+771.95 грн
10+729.40 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20NChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+942.83 грн
5+786.01 грн
10+742.78 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20NChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 20 шт:
термін постачання 21-30 дні (днів)
1+705.53 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20WChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+959.14 грн
5+800.22 грн
10+756.25 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20WChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 17 шт:
термін постачання 21-30 дні (днів)
1+720.03 грн
В кошику  од. на суму  грн.
DIP600-SOIC-22NChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+976.23 грн
5+814.28 грн
10+769.56 грн
В кошику  од. на суму  грн.
DIP600-SOIC-22NChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
1+733.72 грн
В кошику  од. на суму  грн.
DIP600-SOIC-22WChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+992.54 грн
5+828.34 грн
10+782.94 грн
В кошику  од. на суму  грн.
DIP600-SOIC-22WChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
1+747.41 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24NChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
1+761.10 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24NChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+1009.62 грн
5+842.40 грн
10+796.26 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24WChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+993.31 грн
5+829.09 грн
10+783.84 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24WChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 19 шт:
термін постачання 21-30 дні (днів)
1+774.79 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26NChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1042.24 грн
5+870.52 грн
10+822.88 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26NChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
1+789.29 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26WChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1059.33 грн
5+884.43 грн
10+836.27 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26WChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
1+802.98 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28NChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1074.86 грн
5+898.34 грн
10+849.50 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28NChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 15 шт:
термін постачання 21-30 дні (днів)
1+816.67 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28WChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 16 шт:
термін постачання 21-30 дні (днів)
1+830.37 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28WChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+1091.95 грн
5+912.40 грн
10+862.74 грн
В кошику  од. на суму  грн.
DIP600T300P04Chip Quik Inc.Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
5+65.24 грн
Мінімальне замовлення: 5 шт
В кошику  од. на суму  грн.
DIP600T300P06Chip Quik Inc.Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 6
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Packaging: Bulk
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
4+91.64 грн
Мінімальне замовлення: 4 шт
В кошику  од. на суму  грн.
DIP600T300P08Chip Quik Inc.Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
3+112.61 грн
Мінімальне замовлення: 3 шт
В кошику  од. на суму  грн.
DIP600T300P10Chip Quik Inc.Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P12Chip Quik Inc.Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 12
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Packaging: Bulk
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
2+170.08 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
DIP600T300P14Chip Quik Inc.Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
2+224.45 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
DIP600T300P16Chip Quik Inc.Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Material: FR4 Epoxy Glass
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Packaging: Bulk
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
2+223.67 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
DIP600T300P18Chip Quik Inc.Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
DIP600T300P20Chip Quik Inc.Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
2+269.49 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
DIP600T300P24Chip Quik Inc.Description: DIP-24 (0.6" BODY) TO DIP-24 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Packaging: Bulk
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
1+360.36 грн
В кошику  од. на суму  грн.
DIP600T300P26Chip Quik Inc.Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 26
Material: FR4 Epoxy Glass
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Packaging: Bulk
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
1+375.89 грн
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DIP600T300P28Chip Quik Inc.Description: DIP-28 (0.6" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
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DIP624-001BAmphenol ICC (FCI)Description: DIP624-001B-DIP SOCKET 24 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP624-011BAmphenol ICC (FCI)Description: DIP624-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP624-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP628-001BAmphenol ICC (FCI)Description: DIP628-001B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP628-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
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DIP628-011BAmphenol ICC (FCI)Description: DIP628-011B-DIP SOCKET 28 CTS
Packaging: Bag
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP628-014BAmphenol ICC (FCI)Description: DIP628-014B-DIP SOCKET 28 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP628-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
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DIP632-001BAmphenol ICC (FCI)Description: DIP632-001B-DIP SOCKET 32 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP632-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP632-011BAmphenol ICC (FCI)Description: DIP632-011B-DIP SOCKET 32 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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DIP632-014BAmphenol ICC (FCI)Description: DIP632-014B-DIP SOCKET 32 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP640-001BAmphenol ICC (FCI)Description: DIP640-001B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP640-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP640-011BAmphenol ICC (FCI)Description: DIP640-011B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP640-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP640-014BAmphenol ICC (FCI)Description: DIP640-014B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP648-001BAmphenol ICC (FCI)Description: DIP648-001B-DIP SOCKET 48 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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