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DIP300T600P22Chip Quik Inc.Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 22
Material: FR4 Epoxy Glass
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Packaging: Bulk
товару немає в наявності
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DIP300T600P24Chip Quik Inc.Description: DIP-24 (0.3" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+341.74 грн
В кошику  од. на суму  грн.
DIP300T600P26Chip Quik Inc.Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+369.18 грн
В кошику  од. на суму  грн.
DIP300T600P28Chip Quik Inc.Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+396.61 грн
В кошику  од. на суму  грн.
DIP306-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 6POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Part Status: Obsolete
товару немає в наявності
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DIP308-001BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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DIP308-011BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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DIP308-014BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-001BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP314-011BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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DIP314-011BAmphenol Communications Solutions-FCIConn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole
на замовлення 710 шт:
термін постачання 21-31 дні (днів)
18+797.98 грн
100+728.11 грн
500+414.31 грн
Мінімальне замовлення: 18 шт
В кошику  од. на суму  грн.
DIP316-001BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP316-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP316-014BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS TIN
товару немає в наявності
 Мінімальне замовлення: 2700 шт
В кошику  од. на суму  грн.
DIP318-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
 Мінімальне замовлення: 2376 шт
В кошику  од. на суму  грн.
DIP320-001BAmphenol ICC (FCI)Description: DIP320-001B-DIP SOCKET 20 CTS
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
товару немає в наявності
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DIP320-011BAmphenol ICC (FCI)Description: DIP320-011B-DIP SOCKET 20 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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DIP324-001BAmphenol ICC (FCI)Description: DIP324-001B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-011BAmphenol ICC (FCI)Description: DIP324-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-014BAmphenol ICC (FCI)Description: DIP324-014B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP324-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS TIN
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-011BAmphenol ICC (FCI)Description: DIP328-011B-DIP SOCKET 28 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-014BAmphenol ICC (FCI)Description: DIP328-014B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
DIP328-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
DIP600-SOIC-08NChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-08NChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+763.44 грн
В кошику  од. на суму  грн.
DIP600-SOIC-08WChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+781.46 грн
5+649.72 грн
В кошику  од. на суму  грн.
DIP600-SOIC-08WChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 16 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-10NChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 15 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-10NChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+798.71 грн
5+664.66 грн
10+627.38 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10WChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+815.95 грн
5+679.46 грн
10+641.49 грн
В кошику  од. на суму  грн.
DIP600-SOIC-10WChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-12NChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 24 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-12NChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+833.98 грн
5+694.25 грн
10+655.45 грн
В кошику  од. на суму  грн.
DIP600-SOIC-12WChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-12WChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+851.22 грн
5+708.89 грн
10+669.49 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14NChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+869.25 грн
5+723.69 грн
10+683.46 грн
В кошику  од. на суму  грн.
DIP600-SOIC-14NChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 5 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-14WChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 19 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-14WChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+886.49 грн
5+738.48 грн
10+697.50 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16NChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+902.17 грн
5+751.31 грн
10+709.65 грн
В кошику  од. на суму  грн.
DIP600-SOIC-16NChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 9 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-16WChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 3 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-16WChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+919.41 грн
5+765.96 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18NChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-18NChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+938.23 грн
5+782.56 грн
10+739.24 грн
В кошику  од. на суму  грн.
DIP600-SOIC-18WChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-18WChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+955.47 грн
5+797.05 грн
10+753.12 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20NChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 20 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-20NChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+973.50 грн
5+811.54 грн
10+766.94 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20WChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+990.74 грн
5+826.34 грн
10+780.82 грн
В кошику  од. на суму  грн.
DIP600-SOIC-20WChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 12 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-22NChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-22NChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1007.99 грн
5+840.83 грн
10+794.64 грн
В кошику  од. на суму  грн.
DIP600-SOIC-22WChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-22WChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1025.23 грн
5+855.32 грн
10+808.45 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24NChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 23 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-24NChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+1039.34 грн
5+867.70 грн
10+820.22 грн
В кошику  од. на суму  грн.
DIP600-SOIC-24WChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 19 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-24WChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+1056.58 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26NChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1076.18 грн
5+898.80 грн
10+849.74 грн
В кошику  од. на суму  грн.
DIP600-SOIC-26NChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 22 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-26WChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 25 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-26WChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1093.42 грн
5+913.29 грн
10+863.47 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28NChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
на замовлення 15 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-28NChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1107.53 грн
5+925.37 грн
10+875.10 грн
В кошику  од. на суму  грн.
DIP600-SOIC-28WChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Wide (1.27mm pitch, 300 mil body) Adapter
на замовлення 16 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
DIP600-SOIC-28WChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+1124.77 грн
5+939.86 грн
10+888.76 грн
В кошику  од. на суму  грн.
DIP600T300P04Chip Quik Inc.Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
5+68.19 грн
Мінімальне замовлення: 5 шт
В кошику  од. на суму  грн.
DIP600T300P06Chip Quik Inc.Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 6
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
4+88.57 грн
Мінімальне замовлення: 4 шт
В кошику  од. на суму  грн.
DIP600T300P08Chip Quik Inc.Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P10Chip Quik Inc.Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P12Chip Quik Inc.Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 12
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Packaging: Bulk
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P14Chip Quik Inc.Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Packaging: Bulk
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P16Chip Quik Inc.Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Material: FR4 Epoxy Glass
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
2+225.74 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
DIP600T300P18Chip Quik Inc.Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
DIP600T300P20Chip Quik Inc.Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
DIP600T300P24Chip Quik Inc.Description: DIP-24 (0.6" BODY) TO DIP-24 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Packaging: Bulk
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+341.74 грн
В кошику  од. на суму  грн.
DIP600T300P26Chip Quik Inc.Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 26
Material: FR4 Epoxy Glass
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Packaging: Bulk
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
1+379.37 грн
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DIP600T300P28Chip Quik Inc.Description: DIP-28 (0.6" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+396.61 грн
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DIP624-001BAmphenol ICC (FCI)Description: DIP624-001B-DIP SOCKET 24 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP624-011BAmphenol ICC (FCI)Description: DIP624-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP624-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP628-001BAmphenol ICC (FCI)Description: DIP628-001B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP628-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
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DIP628-011BAmphenol ICC (FCI)Description: DIP628-011B-DIP SOCKET 28 CTS
Packaging: Bag
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP628-014BAmphenol ICC (FCI)Description: DIP628-014B-DIP SOCKET 28 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP628-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
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DIP632-001BAmphenol ICC (FCI)Description: DIP632-001B-DIP SOCKET 32 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP632-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP632-011BAmphenol ICC (FCI)Description: DIP632-011B-DIP SOCKET 32 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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DIP632-014BAmphenol ICC (FCI)Description: DIP632-014B-DIP SOCKET 32 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP640-001BAmphenol ICC (FCI)Description: DIP640-001B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP640-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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DIP640-011BAmphenol ICC (FCI)Description: DIP640-011B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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DIP640-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
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