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MCF51CN128CLK MCF51CN128CLK NXP USA Inc. MCF51CN128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
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TWR-MCF51CN-KIT TWR-MCF51CN-KIT NXP USA Inc. TWR-MCF51CN-KIT-LABS.pdf Description: TOWER SYSTEM MCF51CN EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51CN
Platform: Tower System
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TWR-SER TWR-SER NXP USA Inc. TWRSERUM.pdf Description: TOWER SERIAL I/O HARDWARE
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
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TWR-ELEV TWR-ELEV NXP USA Inc. TWRMCF51CNQSG.pdf Description: TOWER ELEVATOR HARDWARE 2 BOARDS
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: 2 Elevator Boards
Part Status: Active
Utilized IC / Part: Freescale Tower System
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
1+3473.71 грн
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LM75BDP,118 LM75BDP,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 9350 шт:
термін постачання 21-31 дні (днів)
2500+22.43 грн
5000+20.81 грн
7500+20.37 грн
Мінімальне замовлення: 2500
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LM75BGD,125 LM75BGD,125 NXP USA Inc. LM75B.pdf Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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PCA9527DP,118 PCA9527DP,118 NXP USA Inc. PCA9527.pdf Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
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PCA9575HF,118 PCA9575HF,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9622DR,118 PCA9622DR,118 NXP USA Inc. PCA9622.pdf Description: IC LED DRV LIN PWM 100MA 32TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PCA9626B,118 PCA9626B,118 NXP USA Inc. PCA9626.pdf Description: IC LED DRVR LIN PWM 100MA 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 24
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 48-LQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PTN3360ABS,518 PTN3360ABS,518 NXP USA Inc. PTN3360A.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
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PTN3360BBS,518 PTN3360BBS,518 NXP USA Inc. PTN3360B.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
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SC16C850IBS,151 SC16C850IBS,151 NXP USA Inc. SC16C850.pdf Description: IC UART SGL-CH 3.3V 32-HVQFN
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SE97TL,147 SE97TL,147 NXP USA Inc. SE97.pdf Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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LM75BDP,118 LM75BDP,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 9897 шт:
термін постачання 21-31 дні (днів)
9+38.83 грн
10+32.93 грн
11+31.26 грн
25+27.32 грн
50+25.96 грн
100+24.74 грн
500+21.92 грн
1000+21.02 грн
Мінімальне замовлення: 9
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LM75BGD,125 LM75BGD,125 NXP USA Inc. LM75B.pdf Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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PCA9527DP,118 PCA9527DP,118 NXP USA Inc. PCA9527.pdf Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
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PCA9575HF,118 PCA9575HF,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5405 шт:
термін постачання 21-31 дні (днів)
3+159.44 грн
10+113.52 грн
25+103.61 грн
100+86.98 грн
250+82.08 грн
500+79.13 грн
1000+75.45 грн
2500+72.93 грн
Мінімальне замовлення: 3
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PCA9622DR,118 PCA9622DR,118 NXP USA Inc. PCA9622.pdf Description: IC LED DRV LIN PWM 100MA 32TSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PTN3360BBS,518 PTN3360BBS,518 NXP USA Inc. PTN3360B.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
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SE97TL,147 SE97TL,147 NXP USA Inc. SE97.pdf Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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SE98ATL,147 SE98ATL,147 NXP USA Inc. SE98A.pdf Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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TDA8950TH/N1,118 TDA8950TH/N1,118 NXP USA Inc. TDA8950.pdf Description: IC AMP D MONO/STEREO 340W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 40V
Max Output Power x Channels @ Load: 340W x 1 @ 8Ohm; 170W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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TDA8920CTH/N1,118 TDA8920CTH/N1,118 NXP USA Inc. TDA8920C.pdf Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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OM11025 OM11025 NXP USA Inc. Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+27185.80 грн
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OM11027 OM11027 NXP USA Inc. LPC2939.pdf Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
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LPC1751FBD80,551 LPC1751FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1752FBD80,551 LPC1752FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1754FBD80,551 LPC1754FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1756FBD80,551 LPC1756FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1758FBD80,551 LPC1758FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1765FBD100,551 LPC1765FBD100,551 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1766FBD100,551 LPC1766FBD100,551 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1768FBD100,551 LPC1768FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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SSL2101T/DB/FBCB230V,598 SSL2101T/DB/FBCB230V,598 NXP USA Inc. SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf Description: BOARD EVAL LED DRIVER SS2101
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SSL2101T/DB/FBCB120V,598 SSL2101T/DB/FBCB120V,598 NXP USA Inc. SSL2101.pdf Description: EVAL BOARD FOR SSL2101
Packaging: Box
Features: Dimmable
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Current - Output / Channel: 800mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Obsolete
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+7918.90 грн
В кошику  од. на суму  грн.
TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 1763 шт:
термін постачання 21-31 дні (днів)
1+703.00 грн
10+529.32 грн
25+492.89 грн
100+425.15 грн
250+406.78 грн
500+396.01 грн
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TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+422.78 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
TJA1050T/VM,118 TJA1050T/VM,118 NXP USA Inc. TJA1050.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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OM11035 OM11035 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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OM11032,598 OM11032,598 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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JN5148-EK010,596 JN5148-EK010,596 NXP USA Inc. JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf Description: KIT EVAL ZIGBEE PRO JN5148
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TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1040T/VM,118 TJA1040T/VM,118 NXP USA Inc. TJA1040.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/VM,518 TJA1041T/VM,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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PN5331B3HN/C270,55 PN5331B3HN/C270,55 NXP USA Inc. PN5331B3HN.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4395 шт:
термін постачання 21-31 дні (днів)
1+1020.22 грн
10+854.92 грн
25+810.48 грн
100+703.40 грн
490+645.67 грн
980+622.88 грн
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1N4148,133 1N4148,133 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4148,143 1N4148,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4448,143 1N4448,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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ADC1207S080HW/C1,5 ADC1207S080HW/C1,5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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ADC1207S080HW/C1:1 ADC1207S080HW/C1:1 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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BAW62,133 BAW62,133 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BAW62,143 BAW62,143 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BT136-600E/02,127 BT136-600E/02,127 NXP USA Inc. BT136-600E.pdf Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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BUK7510-55AL,127 BUK7510-55AL,127 NXP USA Inc. BUK7510-55AL.pdf Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK752R3-40C,127 BUK752R3-40C,127 NXP USA Inc. BUK752R3-40C.pdf Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B,127 NXP USA Inc. BUK753R4-30B.pdf Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C,127 NXP USA Inc. BUK754R3-75C.pdf Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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BUK7609-55A,118 BUK7609-55A,118 NXP USA Inc. Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
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MCF51CN128CLK MCF51CN128.pdf
MCF51CN128CLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
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TWR-MCF51CN-KIT TWR-MCF51CN-KIT-LABS.pdf
TWR-MCF51CN-KIT
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51CN EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51CN
Platform: Tower System
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TWR-SER TWRSERUM.pdf
TWR-SER
Виробник: NXP USA Inc.
Description: TOWER SERIAL I/O HARDWARE
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
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TWR-ELEV TWRMCF51CNQSG.pdf
TWR-ELEV
Виробник: NXP USA Inc.
Description: TOWER ELEVATOR HARDWARE 2 BOARDS
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: 2 Elevator Boards
Part Status: Active
Utilized IC / Part: Freescale Tower System
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3473.71 грн
В кошику  од. на суму  грн.
LM75BDP,118 LM75B.pdf
LM75BDP,118
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 9350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+22.43 грн
5000+20.81 грн
7500+20.37 грн
Мінімальне замовлення: 2500
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LM75BGD,125 LM75B.pdf
LM75BGD,125
Виробник: NXP USA Inc.
Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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PCA9527DP,118 PCA9527.pdf
PCA9527DP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
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PCA9575HF,118 PCA9575.pdf
PCA9575HF,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9622DR,118 PCA9622.pdf
PCA9622DR,118
Виробник: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 32TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PCA9626B,118 PCA9626.pdf
PCA9626B,118
Виробник: NXP USA Inc.
Description: IC LED DRVR LIN PWM 100MA 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 24
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 48-LQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PTN3360ABS,518 PTN3360A.pdf
PTN3360ABS,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
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PTN3360BBS,518 PTN3360B.pdf
PTN3360BBS,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
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SC16C850IBS,151 SC16C850.pdf
SC16C850IBS,151
Виробник: NXP USA Inc.
Description: IC UART SGL-CH 3.3V 32-HVQFN
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SE97TL,147 SE97.pdf
SE97TL,147
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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LM75BDP,118 LM75B.pdf
LM75BDP,118
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 9897 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+38.83 грн
10+32.93 грн
11+31.26 грн
25+27.32 грн
50+25.96 грн
100+24.74 грн
500+21.92 грн
1000+21.02 грн
Мінімальне замовлення: 9
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LM75BGD,125 LM75B.pdf
LM75BGD,125
Виробник: NXP USA Inc.
Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
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PCA9527DP,118 PCA9527.pdf
PCA9527DP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
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PCA9575HF,118 PCA9575.pdf
PCA9575HF,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5405 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+159.44 грн
10+113.52 грн
25+103.61 грн
100+86.98 грн
250+82.08 грн
500+79.13 грн
1000+75.45 грн
2500+72.93 грн
Мінімальне замовлення: 3
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PCA9622DR,118 PCA9622.pdf
PCA9622DR,118
Виробник: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 32TSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 32-TSSOP
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PTN3360BBS,518 PTN3360B.pdf
PTN3360BBS,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
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SE97TL,147 SE97.pdf
SE97TL,147
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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SE98ATL,147 SE98A.pdf
SE98ATL,147
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
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TDA8950TH/N1,118 TDA8950.pdf
TDA8950TH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 340W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 40V
Max Output Power x Channels @ Load: 340W x 1 @ 8Ohm; 170W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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TDA8920CTH/N1,118 TDA8920C.pdf
TDA8920CTH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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OM11025
OM11025
Виробник: NXP USA Inc.
Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+27185.80 грн
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OM11027 LPC2939.pdf
OM11027
Виробник: NXP USA Inc.
Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
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LPC1751FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1751FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1752FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1752FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1754FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1754FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1756FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1756FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1758FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1758FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1765FBD100,551
LPC1765FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1766FBD100,551
LPC1766FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1768FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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SSL2101T/DB/FBCB230V,598 SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf
SSL2101T/DB/FBCB230V,598
Виробник: NXP USA Inc.
Description: BOARD EVAL LED DRIVER SS2101
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SSL2101T/DB/FBCB120V,598 SSL2101.pdf
SSL2101T/DB/FBCB120V,598
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SSL2101
Packaging: Box
Features: Dimmable
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Current - Output / Channel: 800mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Obsolete
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7918.90 грн
В кошику  од. на суму  грн.
TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 1763 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+703.00 грн
10+529.32 грн
25+492.89 грн
100+425.15 грн
250+406.78 грн
500+396.01 грн
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TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+422.78 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
TJA1050T/VM,118 TJA1050.pdf
TJA1050T/VM,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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OM11035 LPC1769_68_67_66_65_64_63.pdf
OM11035
Виробник: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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OM11032,598 LPC1769_68_67_66_65_64_63.pdf
OM11032,598
Виробник: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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JN5148-EK010,596 JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf
JN5148-EK010,596
Виробник: NXP USA Inc.
Description: KIT EVAL ZIGBEE PRO JN5148
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TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1040T/VM,118 TJA1040.pdf
TJA1040T/VM,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
товару немає в наявності
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TJA1041T/VM,518 TJA1041.pdf
TJA1041T/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
товару немає в наявності
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PN5331B3HN/C270,55 PN5331B3HN.pdf
PN5331B3HN/C270,55
Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4395 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1020.22 грн
10+854.92 грн
25+810.48 грн
100+703.40 грн
490+645.67 грн
980+622.88 грн
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1N4148,133 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4148,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4448,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4448,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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ADC1207S080HW/C1,5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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ADC1207S080HW/C1:1 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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BAW62,133 BAW62_Rev_Feb2017.pdf
BAW62,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BAW62,143 BAW62_Rev_Feb2017.pdf
BAW62,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BT136-600E/02,127 BT136-600E.pdf
BT136-600E/02,127
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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BUK7510-55AL,127 BUK7510-55AL.pdf
BUK7510-55AL,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK752R3-40C,127 BUK752R3-40C.pdf
BUK752R3-40C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B.pdf
BUK753R4-30B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C.pdf
BUK754R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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BUK7609-55A,118
BUK7609-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
товару немає в наявності
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