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PTN3360BBS,518 PTN3360BBS,518 NXP USA Inc. PTN3360B.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Part Status: Obsolete
Supplier Device Package: 48-HVQFN (7x7)
Applications: Set-Top Boxes, Video Players
Voltage - Supply: 3V ~ 3.6V
Interface: 3-Wire Serial
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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SE97TL,147 SE97TL,147 NXP USA Inc. SE97.pdf Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Supplier Device Package: 8-HXSON (2x3)
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Comparator, Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±3°C(Max)
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
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SE98ATL,147 SE98ATL,147 NXP USA Inc. SE98A.pdf Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Supplier Device Package: 8-HXSON (2x3)
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±4°C(Max)
Function: Temp Monitoring System (Sensor)
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
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TDA8920CTH/N1,118 TDA8920CTH/N1,118 NXP USA Inc. TDA8920C.pdf Description: IC AMP D MONO/STEREO 220W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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OM11025 OM11025 NXP USA Inc. Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+26036.38 грн
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OM11027 OM11027 NXP USA Inc. LPC2939.pdf Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
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LPC1751FBD80,551 LPC1751FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1752FBD80,551 LPC1752FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M3
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LPC1754FBD80,551 LPC1754FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1756FBD80,551 LPC1756FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1758FBD80,551 LPC1758FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1765FBD100,551 LPC1765FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Packaging: Tray
Package / Case: 100-LQFP
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
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LPC1766FBD100,551 LPC1766FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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LPC1768FBD100,551 LPC1768FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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SSL2101T/DB/FBCB230V,598 SSL2101T/DB/FBCB230V,598 NXP USA Inc. SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf Description: BOARD EVAL LED DRIVER SS2101
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SSL2101T/DB/FBCB120V,598 SSL2101T/DB/FBCB120V,598 NXP USA Inc. SSL2101.pdf Description: EVAL BOARD FOR SSL2101
Features: Dimmable
Packaging: Box
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Contents: Board(s)
Current - Output / Channel: 800mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Obsolete
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+7584.09 грн
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TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 4643 шт:
термін постачання 21-31 дні (днів)
1+871.86 грн
10+659.92 грн
25+614.97 грн
100+530.78 грн
250+527.79 грн
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TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1000+546.43 грн
Мінімальне замовлення: 1000 шт
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TJA1050T/VM,118 TJA1050T/VM,118 NXP USA Inc. TJA1050.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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OM11035 OM11035 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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OM11032,598 OM11032,598 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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JN5148-EK010,596 JN5148-EK010,596 NXP USA Inc. JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf Description: KIT EVAL ZIGBEE PRO JN5148
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TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Operating Temperature: -40°C ~ 80°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
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TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 80°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TJA1040T/VM,118 TJA1040T/VM,118 NXP USA Inc. TJA1040.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/VM,518 TJA1041T/VM,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
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PN5331B3HN/C270,55 PN5331B3HN/C270,55 NXP USA Inc. PN5331B3HN.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4285 шт:
термін постачання 21-31 дні (днів)
1+1052.25 грн
10+881.62 грн
25+835.79 грн
100+725.34 грн
490+665.81 грн
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1N4148,133 1N4148,133 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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 Мінімальне замовлення: 10000 шт
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1N4148,143 1N4148,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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 Мінімальне замовлення: 20000 шт
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1N4448,143 1N4448,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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 Мінімальне замовлення: 5000 шт
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ADC1207S080HW/C1,5 ADC1207S080HW/C1,5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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ADC1207S080HW/C1:1 ADC1207S080HW/C1:1 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tray
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BAW62,133 BAW62,133 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Operating Temperature - Junction: 200°C (Max)
Supplier Device Package: ALF2
Current - Average Rectified (Io): 250mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Tape & Box (TB)
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BAW62,143 BAW62,143 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Part Status: Active
Operating Temperature - Junction: 200°C (Max)
Supplier Device Package: ALF2
Current - Average Rectified (Io): 250mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Tape & Box (TB)
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BT136-600E/02,127 BT136-600E/02,127 NXP USA Inc. BT136-600E.pdf Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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BUK7510-55AL,127 BUK7510-55AL,127 NXP USA Inc. BUK7510-55AL.pdf Description: MOSFET N-CH 55V 75A TO220AB
Qualification: AEC-Q101
Grade: Automotive
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
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BUK752R3-40C,127 BUK752R3-40C,127 NXP USA Inc. BUK752R3-40C.pdf Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B,127 NXP USA Inc. BUK753R4-30B.pdf Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C,127 NXP USA Inc. BUK754R3-75C.pdf Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Qualification: AEC-Q101
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BUK7609-55A,118 BUK7609-55A,118 NXP USA Inc. Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 211W (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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BUK7619-100B,118 BUK7619-100B,118 NXP USA Inc. BUK7619-100B.pdf Description: MOSFET N-CH 100V 64A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
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BUK761R8-30C,118 BUK761R8-30C,118 NXP USA Inc. BUK761R8-30C.pdf Description: MOSFET N-CH 30V 100A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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BUK7880-55A,115 BUK7880-55A,115 NXP USA Inc. BUK7880-55A.pdf Description: MOSFET N-CH 55V 7A SOT-223
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 8W (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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BUK7E07-55B,127 BUK7E07-55B,127 NXP USA Inc. BUK7E07-55B.pdf Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 203W (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Qualification: AEC-Q101
Grade: Automotive
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BUK7E4R3-75C,127 BUK7E4R3-75C,127 NXP USA Inc. Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A,118 NXP USA Inc. BUK9213-30A.pdf Description: MOSFET N-CH 30V 55A DPAK
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: DPAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 150W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
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BY329-1000,127 BY329-1000,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1KV 8A TO220AC
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
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BY329-1200,127 BY329-1200,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1.2KV 8A TO220AC
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
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CGY888C,112 CGY888C,112 NXP USA Inc. CGY888C.pdf Description: IC AMP CATV SOT115J
Current - Supply: 280 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Tube
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CX24123-11Z,518 CX24123-11Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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 Мінімальне замовлення: 1500 шт
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CX24123-11Z,557 CX24123-11Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Control Interface: Parallel, Serial
Supplier Device Package: 64-TQFP (10x10)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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 Мінімальне замовлення: 800 шт
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CX24123-21Z,518 CX24123-21Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Control Interface: Parallel, Serial
Part Status: Obsolete
Supplier Device Package: 80-TQFP (14x14)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tape & Reel (TR)
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CX24123-21Z,557 CX24123-21Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Control Interface: Parallel, Serial
Part Status: Obsolete
Supplier Device Package: 80-TQFP (14x14)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
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LPC2930FET208,551 LPC2930FET208,551 NXP USA Inc. Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FBD208,551 LPC2939FBD208,551 NXP USA Inc. LPC2939.pdf Description: IC MCU 16/32B 768KB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 24x10b
Core Processor: ARM9®
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 56K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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 Мінімальне замовлення: 36 шт
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LPC2939FET208,551 LPC2939FET208,551 NXP USA Inc. Description: IC MCU 16/32B 768KB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 24x10b
Core Processor: ARM9®
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 56K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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MFRC52201HN1,151 MFRC52201HN1,151 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC52301HN1,157 NXP USA Inc. MFRC523.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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 Мінімальне замовлення: 2450 шт
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MFRC53001T/0FE,518 MFRC53001T/0FE,518 NXP USA Inc. Description: IC RFID READER 13.56MHZ 32SO
Supplier Device Package: 32-SO
Standards: ISO 14443, MIFARE
Voltage - Supply: 3.3V ~ 5V
Operating Temperature: -40°C ~ 150°C
Type: RFID Reader
Interface: SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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 Мінімальне замовлення: 1000 шт
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P89LPC9201FDH,112 P89LPC9201FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
DigiKey Programmable: Verified
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PTN3360BBS,518 PTN3360B.pdf
PTN3360BBS,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Part Status: Obsolete
Supplier Device Package: 48-HVQFN (7x7)
Applications: Set-Top Boxes, Video Players
Voltage - Supply: 3V ~ 3.6V
Interface: 3-Wire Serial
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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SE97TL,147 SE97.pdf
SE97TL,147
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Supplier Device Package: 8-HXSON (2x3)
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Comparator, Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±3°C(Max)
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
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SE98ATL,147 SE98A.pdf
SE98ATL,147
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Supplier Device Package: 8-HXSON (2x3)
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±4°C(Max)
Function: Temp Monitoring System (Sensor)
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
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TDA8920CTH/N1,118 TDA8920C.pdf
TDA8920CTH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 220W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
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OM11025
OM11025
Виробник: NXP USA Inc.
Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+26036.38 грн
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OM11027 LPC2939.pdf
OM11027
Виробник: NXP USA Inc.
Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
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LPC1751FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1751FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1752FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1752FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M3
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LPC1754FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1754FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
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LPC1756FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1756FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1758FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1758FBD80,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Discontinued at Digi-Key
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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LPC1765FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1765FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Packaging: Tray
Package / Case: 100-LQFP
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
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LPC1766FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1766FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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LPC1768FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
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SSL2101T/DB/FBCB230V,598 SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf
SSL2101T/DB/FBCB230V,598
Виробник: NXP USA Inc.
Description: BOARD EVAL LED DRIVER SS2101
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SSL2101T/DB/FBCB120V,598 SSL2101.pdf
SSL2101T/DB/FBCB120V,598
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SSL2101
Features: Dimmable
Packaging: Box
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Contents: Board(s)
Current - Output / Channel: 800mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Obsolete
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7584.09 грн
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TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
на замовлення 4643 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+871.86 грн
10+659.92 грн
25+614.97 грн
100+530.78 грн
250+527.79 грн
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TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+546.43 грн
Мінімальне замовлення: 1000 шт
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TJA1050T/VM,118 TJA1050.pdf
TJA1050T/VM,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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OM11035 LPC1769_68_67_66_65_64_63.pdf
OM11035
Виробник: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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OM11032,598 LPC1769_68_67_66_65_64_63.pdf
OM11032,598
Виробник: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
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JN5148-EK010,596 JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf
JN5148-EK010,596
Виробник: NXP USA Inc.
Description: KIT EVAL ZIGBEE PRO JN5148
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TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Operating Temperature: -40°C ~ 80°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
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TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 80°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TJA1040T/VM,118 TJA1040.pdf
TJA1040T/VM,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/VM,518 TJA1041.pdf
TJA1041T/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 70 mV
Supplier Device Package: 14-SO
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PN5331B3HN/C270,55 PN5331B3HN.pdf
PN5331B3HN/C270,55
Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4285 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1052.25 грн
10+881.62 грн
25+835.79 грн
100+725.34 грн
490+665.81 грн
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1N4148,133 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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Мінімальне замовлення: 10000 шт
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1N4148,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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Мінімальне замовлення: 20000 шт
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1N4448,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4448,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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Мінімальне замовлення: 5000 шт
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ADC1207S080HW/C1,5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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ADC1207S080HW/C1:1 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tray
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BAW62,133 BAW62_Rev_Feb2017.pdf
BAW62,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Operating Temperature - Junction: 200°C (Max)
Supplier Device Package: ALF2
Current - Average Rectified (Io): 250mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Tape & Box (TB)
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BAW62,143 BAW62_Rev_Feb2017.pdf
BAW62,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Part Status: Active
Operating Temperature - Junction: 200°C (Max)
Supplier Device Package: ALF2
Current - Average Rectified (Io): 250mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Tape & Box (TB)
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BT136-600E/02,127 BT136-600E.pdf
BT136-600E/02,127
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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Мінімальне замовлення: 5000 шт
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BUK7510-55AL,127 BUK7510-55AL.pdf
BUK7510-55AL,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Qualification: AEC-Q101
Grade: Automotive
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
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BUK752R3-40C,127 BUK752R3-40C.pdf
BUK752R3-40C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B.pdf
BUK753R4-30B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C.pdf
BUK754R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Qualification: AEC-Q101
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BUK7609-55A,118
BUK7609-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 211W (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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BUK7619-100B,118 BUK7619-100B.pdf
BUK7619-100B,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 64A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
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BUK761R8-30C,118 BUK761R8-30C.pdf
BUK761R8-30C,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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BUK7880-55A,115 BUK7880-55A.pdf
BUK7880-55A,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 7A SOT-223
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 8W (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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BUK7E07-55B,127 BUK7E07-55B.pdf
BUK7E07-55B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 203W (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Qualification: AEC-Q101
Grade: Automotive
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BUK7E4R3-75C,127
BUK7E4R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A.pdf
BUK9213-30A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 55A DPAK
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: DPAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 150W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
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BY329-1000,127 BY329_SERIES.pdf
BY329-1000,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1KV 8A TO220AC
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
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BY329-1200,127 BY329_SERIES.pdf
BY329-1200,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.2KV 8A TO220AC
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: TO-220AC
Current - Average Rectified (Io): 8A
Technology: Standard
Reverse Recovery Time (trr): 135 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
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CGY888C,112 CGY888C.pdf
CGY888C,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Current - Supply: 280 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Tube
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CX24123-11Z,518
CX24123-11Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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Мінімальне замовлення: 1500 шт
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CX24123-11Z,557
CX24123-11Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Control Interface: Parallel, Serial
Supplier Device Package: 64-TQFP (10x10)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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Мінімальне замовлення: 800 шт
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CX24123-21Z,518
CX24123-21Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Control Interface: Parallel, Serial
Part Status: Obsolete
Supplier Device Package: 80-TQFP (14x14)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tape & Reel (TR)
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CX24123-21Z,557
CX24123-21Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Control Interface: Parallel, Serial
Part Status: Obsolete
Supplier Device Package: 80-TQFP (14x14)
Applications: Consumer Video
Function: Demodulator
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
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LPC2930FET208,551
LPC2930FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 126 шт
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LPC2939FBD208,551 LPC2939.pdf
LPC2939FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 24x10b
Core Processor: ARM9®
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 56K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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Мінімальне замовлення: 36 шт
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LPC2939FET208,551
LPC2939FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 24x10b
Core Processor: ARM9®
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 56K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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MFRC52201HN1,151 MFRC522.pdf
MFRC52201HN1,151
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC523.pdf
MFRC52301HN1,157
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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Мінімальне замовлення: 2450 шт
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MFRC53001T/0FE,518
MFRC53001T/0FE,518
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32SO
Supplier Device Package: 32-SO
Standards: ISO 14443, MIFARE
Voltage - Supply: 3.3V ~ 5V
Operating Temperature: -40°C ~ 150°C
Type: RFID Reader
Interface: SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 1000 шт
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P89LPC9201FDH,112 P89LPC92X1.pdf
P89LPC9201FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
DigiKey Programmable: Verified
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