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IP4853CX24/P,135 NXP USA Inc. IP4853CX24.pdf Description: IC INTFACE SPECIALIZED 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: microSD™, MMC, SD
Voltage - Supply: 1.62V ~ 2.1V
Applications: Cell Phones, Digital Cameras, Media Players
Supplier Device Package: 24-WLCSP (5x5)
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NVT2002GD,125 NVT2002GD,125 NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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NVT2002GF,115 NVT2002GF,115 NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NVT2008BQ,115 NVT2008BQ,115 NXP USA Inc. NVT2008_NVT2010.pdf Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3L1G384GW,125 NX3L1G384GW,125 NXP USA Inc. NX3L1G384.pdf Description: IC SW SPST-NCX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G53GD,125 NX3L1G53GD,125 NXP USA Inc. NX3L1G53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1G66GW,125 NX3L1G66GW,125 NXP USA Inc. NX3L1G66.pdf Description: IC SW SPST-NOX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T384GM,115 NX3L1T384GM,115 NXP USA Inc. NX3L1T384.pdf Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T5157GM,132 NX3L1T5157GM,132 NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T53GD,125 NX3L1T53GD,125 NXP USA Inc. NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T53GM,125 NX3L1T53GM,125 NXP USA Inc. NX3L1T53.pdf Description: IC SWITCH SPDTX1 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L1T53GT,115 NX3L1T53GT,115 NXP USA Inc. NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L1T66GM,115 NX3L1T66GM,115 NXP USA Inc. NX3L1T66.pdf Description: IC SW SPST-NOX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L2267GM,132 NX3L2267GM,132 NXP USA Inc. NX3L2267.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2467HR,115 NX3L2467HR,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2
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NX3L2G384GD,125 NX3L2G384GD,125 NXP USA Inc. NX3L2G384.pdf Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2G384GM,125 NX3L2G384GM,125 NXP USA Inc. NX3L2G384.pdf Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX3L2G384GT,115 NX3L2G384GT,115 NXP USA Inc. NX3L2G384.pdf Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
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NX3L2G66GD,125 NX3L2G66GD,125 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T384GD,125 NX3L2T384GD,125 NXP USA Inc. NX3L2T384.pdf Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T384GT,115 NX3L2T384GT,115 NXP USA Inc. NX3L2T384.pdf Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T66GD,125 NX3L2T66GD,125 NXP USA Inc. NX3L2T66.pdf Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T66GM,125 NX3L2T66GM,125 NXP USA Inc. NX3L2T66.pdf Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2
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NX3L2T66GT,115 NX3L2T66GT,115 NXP USA Inc. NX3L2T66.pdf Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
5000+25.33 грн
10000+23.86 грн
Мінімальне замовлення: 5000
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NX3L4051HR,115 NX3L4051HR,115 NXP USA Inc. NX3L4051.pdf Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 1
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NX3L4053HR,115 NX3L4053HR,115 NXP USA Inc. NX3L4053.pdf Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
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NX3L4357GM,132 NX3L4357GM,132 NXP USA Inc. NX3L4357.pdf Description: IC SWITCH SP3TX1 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 30MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SP3T
Multiplexer/Demultiplexer Circuit: 3:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L4684GM,132 NX3L4684GM,132 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
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NX3V1G384GM,132 NX3V1G384GM,132 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1G384GW,125 NX3V1G384GW,125 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1T384GM,115 NX3V1T384GM,115 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX5DV330BQ,115 NX5DV330BQ,115 NXP USA Inc. NX5DV330.pdf Description: IC MUX/DEMUX VIDEO QUAD DHVQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
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NTB0102GF,115 NTB0102GF,115 NXP USA Inc. NTB0102.pdf Description: IC TRNSLTR BIDIRECTIONAL 8XSON
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NTS0102GF,115 NTS0102GF,115 NXP USA Inc. NTS0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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PSMN017-30LL,115 PSMN017-30LL,115 NXP USA Inc. Description: MOSFET N-CH 30V 15A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 5A, 10V
Power Dissipation (Max): 37W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 526 pF @ 15 V
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PSMN023-80LS,115 PSMN023-80LS,115 NXP USA Inc. Description: MOSFET N-CH 80V 34A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 23mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1295 pF @ 40 V
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PSMN035-100LS,115 PSMN035-100LS,115 NXP USA Inc. Description: MOSFET N-CH QFN3333
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PSMN3R5-30LL,115 PSMN3R5-30LL,115 NXP USA Inc. Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 10A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2061 pF @ 15 V
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PSMN3R8-30LL,115 PSMN3R8-30LL,115 NXP USA Inc. PSMN3R8-30LL.pdf Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.7mOhm @ 10A, 10V
Power Dissipation (Max): 69W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 38 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2085 pF @ 15 V
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PSMN5R8-30LL,115 PSMN5R8-30LL,115 NXP USA Inc. PSMN5R8-30LL.pdf Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 5.8mOhm @ 10A, 10V
Power Dissipation (Max): 55W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1316 pF @ 15 V
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PSMN7R0-40LS,115 PSMN7R0-40LS,115 NXP USA Inc. Description: MOSFET N-CH 40V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1286 pF @ 12 V
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PSMN9R0-30LL,115 PSMN9R0-30LL,115 NXP USA Inc. PSMN9R0-30LL.pdf Description: MOSFET N-CH 30V 21A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 5A, 10V
Power Dissipation (Max): 50W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1193 pF @ 15 V
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74AHC240D,118 74AHC240D,118 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC240PW,118 74AHC240PW,118 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
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74AHC241D,118 74AHC241D,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC241PW,118 74AHC241PW,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AVC16T245BQ,518 74AVC16T245BQ,518 NXP USA Inc. 74AVC16T245_Rev02.pdf Description: IC TRANSLATOR BIDIR 60HUQFNU
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74AVCH16T245DGV,11 74AVCH16T245DGV,11 NXP USA Inc. 74AVCH16T245_Rev_Feb2017.pdf Description: IC TRANSLATOR BIDIR 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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74LVC16244ABQ,518 74LVC16244ABQ,518 NXP USA Inc. 74LVC_LVCH16244A.pdf Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVC16374ABQ,518 74LVC16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVCH16244ABQ,518 74LVCH16244ABQ,518 NXP USA Inc. 74LVC(H)16244A_Rev9.pdf Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVCH16374ABQ,518 74LVCH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVT16244BBQ,518 74LVT16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVT16245BBQ,518 74LVT16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16244BBQ,518 74LVTH16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTH16245BBQ,518 74LVTH16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16374ABQ,518 74LVTH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Packaging: Cut Tape (CT)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 120 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 3 pF
Supplier Device Package: 60-HXQFN (4x6)
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVTN16244BBQ,518 74LVTN16244BBQ,518 NXP USA Inc. 74LVTN16244B_Rev02.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTN16245BBQ,518 74LVTN16245BBQ,518 NXP USA Inc. 74LVTN16244B_Rev5_2017.pdf Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Cut Tape (CT)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
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NVT2006PW,118 NVT2006PW,118 NXP USA Inc. NVT2003_06.pdf Description: IC TRANSLATOR BIDIR 16TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 18308 шт:
термін постачання 21-31 дні (днів)
5+78.60 грн
10+54.28 грн
25+49.02 грн
100+40.54 грн
250+37.94 грн
500+36.37 грн
1000+34.51 грн
Мінімальне замовлення: 5
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IP4853CX24/P,135 IP4853CX24.pdf
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: microSD™, MMC, SD
Voltage - Supply: 1.62V ~ 2.1V
Applications: Cell Phones, Digital Cameras, Media Players
Supplier Device Package: 24-WLCSP (5x5)
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NVT2002GD,125 NVT2001_NVT2002.pdf
NVT2002GD,125
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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NVT2002GF,115 NVT2001_NVT2002.pdf
NVT2002GF,115
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NVT2008BQ,115 NVT2008_NVT2010.pdf
NVT2008BQ,115
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3L1G384GW,125 NX3L1G384.pdf
NX3L1G384GW,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G53GD,125 NX3L1G53.pdf
NX3L1G53GD,125
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1G66GW,125 NX3L1G66.pdf
NX3L1G66GW,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T384GM,115 NX3L1T384.pdf
NX3L1T384GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T5157GM,132 NX3L1T3157.pdf
NX3L1T5157GM,132
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T53GD,125 NX3L1T53.pdf
NX3L1T53GD,125
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L1T53GM,125 NX3L1T53.pdf
NX3L1T53GM,125
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L1T53GT,115 NX3L1T53.pdf
NX3L1T53GT,115
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L1T66GM,115 NX3L1T66.pdf
NX3L1T66GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L2267GM,132 NX3L2267.pdf
NX3L2267GM,132
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2467HR,115 NX3L2467.pdf
NX3L2467HR,115
Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2
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NX3L2G384GD,125 NX3L2G384.pdf
NX3L2G384GD,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2G384GM,125 NX3L2G384.pdf
NX3L2G384GM,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX3L2G384GT,115 NX3L2G384.pdf
NX3L2G384GT,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
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NX3L2G66GD,125 NX3L2G66.pdf
NX3L2G66GD,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T384GD,125 NX3L2T384.pdf
NX3L2T384GD,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T384GT,115 NX3L2T384.pdf
NX3L2T384GT,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T66GD,125 NX3L2T66.pdf
NX3L2T66GD,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T66GM,125 NX3L2T66.pdf
NX3L2T66GM,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2
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NX3L2T66GT,115 NX3L2T66.pdf
NX3L2T66GT,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+25.33 грн
10000+23.86 грн
Мінімальне замовлення: 5000
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NX3L4051HR,115 NX3L4051.pdf
NX3L4051HR,115
Виробник: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 1
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NX3L4053HR,115 NX3L4053.pdf
NX3L4053HR,115
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
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NX3L4357GM,132 NX3L4357.pdf
NX3L4357GM,132
Виробник: NXP USA Inc.
Description: IC SWITCH SP3TX1 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 30MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SP3T
Multiplexer/Demultiplexer Circuit: 3:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L4684GM,132 NX3L4684.pdf
NX3L4684GM,132
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
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NX3V1G384GM,132 NX3V1G384.pdf
NX3V1G384GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1G384GW,125 NX3V1G384.pdf
NX3V1G384GW,125
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3V1T384GM,115 NX3V1G384.pdf
NX3V1T384GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX5DV330BQ,115 NX5DV330.pdf
NX5DV330BQ,115
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX VIDEO QUAD DHVQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
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NTB0102GF,115 NTB0102.pdf
NTB0102GF,115
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 8XSON
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NTS0102GF,115 NTS0102.pdf
NTS0102GF,115
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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PSMN017-30LL,115
PSMN017-30LL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 15A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 5A, 10V
Power Dissipation (Max): 37W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 526 pF @ 15 V
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PSMN023-80LS,115
PSMN023-80LS,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 80V 34A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 23mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1295 pF @ 40 V
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PSMN035-100LS,115
PSMN035-100LS,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH QFN3333
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PSMN3R5-30LL,115
PSMN3R5-30LL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 10A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2061 pF @ 15 V
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PSMN3R8-30LL,115 PSMN3R8-30LL.pdf
PSMN3R8-30LL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.7mOhm @ 10A, 10V
Power Dissipation (Max): 69W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 38 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2085 pF @ 15 V
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PSMN5R8-30LL,115 PSMN5R8-30LL.pdf
PSMN5R8-30LL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 5.8mOhm @ 10A, 10V
Power Dissipation (Max): 55W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1316 pF @ 15 V
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PSMN7R0-40LS,115
PSMN7R0-40LS,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1286 pF @ 12 V
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PSMN9R0-30LL,115 PSMN9R0-30LL.pdf
PSMN9R0-30LL,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 21A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 5A, 10V
Power Dissipation (Max): 50W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1193 pF @ 15 V
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74AHC240D,118 74AHC%28T%29240.pdf
74AHC240D,118
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC240PW,118 74AHC%28T%29240.pdf
74AHC240PW,118
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
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74AHC241D,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241D,118
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC241PW,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241PW,118
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AVC16T245BQ,518 74AVC16T245_Rev02.pdf
74AVC16T245BQ,518
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 60HUQFNU
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74AVCH16T245DGV,11 74AVCH16T245_Rev_Feb2017.pdf
74AVCH16T245DGV,11
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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74LVC16244ABQ,518 74LVC_LVCH16244A.pdf
74LVC16244ABQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVC16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVC16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVCH16244ABQ,518 74LVC(H)16244A_Rev9.pdf
74LVCH16244ABQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVCH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVCH16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVT16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVT16244BBQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVT16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVT16245BBQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVTH16244BBQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTH16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVTH16245BBQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVTH16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Packaging: Cut Tape (CT)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 120 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 3 pF
Supplier Device Package: 60-HXQFN (4x6)
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVTN16244BBQ,518 74LVTN16244B_Rev02.pdf
74LVTN16244BBQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
товару немає в наявності
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74LVTN16245BBQ,518 74LVTN16244B_Rev5_2017.pdf
74LVTN16245BBQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Cut Tape (CT)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
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NVT2006PW,118 NVT2003_06.pdf
NVT2006PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 18308 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+78.60 грн
10+54.28 грн
25+49.02 грн
100+40.54 грн
250+37.94 грн
500+36.37 грн
1000+34.51 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
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