Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36847) > Сторінка 175 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
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PRF947,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3Part Status: Obsolete Supplier Device Package: SC-70 Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz Frequency - Transition: 8.5GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V Voltage - Collector Emitter Breakdown (Max): 10V Current - Collector (Ic) (Max): 50mA Power - Max: 250mW Operating Temperature: 175°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TL431BSDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 0.5% TO236ABQualification: AEC-Q100 Grade: Automotive Voltage - Output (Max): 36 V Current - Output: 100 mA Current - Cathode: 600 µA Part Status: Obsolete Voltage - Output (Min/Fixed): 2.495V Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature: -40°C ~ 125°C (TA) Reference Type: Shunt Mounting Type: Surface Mount Output Type: Adjustable Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±0.5% Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BGA7127,118 | NXP USA Inc. |
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSONPart Status: Obsolete Supplier Device Package: 8-HVSON (3x3) Test Frequency: 2.445GHz P1dB: 27.5dBm Noise Figure: 4.7dB Current - Supply: 180mA Gain: 10.5dB Voltage - Supply: 5V RF Type: ISM, RFID, WLAN Frequency: 400MHz ~ 2.7GHz Mounting Type: Surface Mount Package / Case: 8-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PTN3392BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 48HVQFNPackaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 3V ~ 3.6V Applications: Desktop, Notebook PCs Supplier Device Package: 48-HVQFN (7x7) Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SA616DK/03,118 | NXP USA Inc. |
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOPPart Status: Obsolete Supplier Device Package: 20-SSOP Number of Mixers: 2 Noise Figure: 6.8dB Secondary Attributes: RSSI Equipped Current - Supply: 3.5mA Gain: 17dB Voltage - Supply: 2.7V ~ 7V RF Type: Cellular Frequency: 150MHz Mounting Type: Surface Mount Package / Case: 20-LSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
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BGA7127,118 | NXP USA Inc. |
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSONMounting Type: Surface Mount Package / Case: 8-VFDFN Exposed Pad Packaging: Cut Tape (CT) Part Status: Obsolete Supplier Device Package: 8-HVSON (3x3) Test Frequency: 2.445GHz P1dB: 27.5dBm Noise Figure: 4.7dB Current - Supply: 180mA Gain: 10.5dB Voltage - Supply: 5V RF Type: ISM, RFID, WLAN Frequency: 400MHz ~ 2.7GHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PTN3392BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 48HVQFNPackaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 3V ~ 3.6V Applications: Desktop, Notebook PCs Supplier Device Package: 48-HVQFN (7x7) Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BUK764R3-40B,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 75A D2PAKQualification: AEC-Q101 Grade: Automotive Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V Drain to Source Voltage (Vdss): 40 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Obsolete Supplier Device Package: D2PAK Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 254W (Tc) Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PX1011BI-EL1/G,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 81LFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TFF1003HN/N1,115 | NXP USA Inc. |
Description: IC FREQUENCY GEN TX/TXRX 24HVQFNNumber of Circuits: 1 Part Status: Obsolete PLL: No Supplier Device Package: 24-HVQFN (4x4) Differential - Input:Output: Yes/No Ratio - Input:Output: 1:4 Main Purpose: Ku band VSAT applications Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Input: Clock Frequency - Max: 13.05GHz Output: Clock Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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OM13008,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC122 EVAL BRDPlatform: LPCXpresso™ Utilized IC / Part: LPC122 Core Processor: ARM® Cortex®-M0 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRFE6VP5600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Configuration: Dual Frequency: 230MHz Mounting Type: Chassis Mount Package / Case: SOT-979A Packaging: Tape & Reel (TR) Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 130 V Part Status: Active Supplier Device Package: NI-1230-4H Technology: LDMOS Gain: 25dB Power - Output: 600W |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP5600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Frequency: 230MHz Mounting Type: Chassis Mount Package / Case: SOT-979A Packaging: Cut Tape (CT) Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 130 V Part Status: Active Supplier Device Package: NI-1230-4H Technology: LDMOS Gain: 25dB Power - Output: 600W Configuration: Dual |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MPC8313E-RDBC | NXP USA Inc. |
Description: MPC8313E EVAL BRDUtilized IC / Part: MPC8313E Core Processor: e300 Contents: Board(s) Type: MPU Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P1013PSE2EFA | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| P1022COME-DS-PB | NXP USA Inc. |
Description: P1022 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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P2010NXE2HFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Additional Interfaces: DUART, I2C, MMC/SD, SPI Part Status: Obsolete Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Security; SEC 3.3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: -40°C ~ 125°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P2020NXE2KFC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| P4080COME-DS-PB | NXP USA Inc. | Description: P4080 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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P2020PSE2HFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33897CTEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOICPart Status: Active Duplex: Half Receiver Hysteresis: 500 mV Supplier Device Package: 14-SOIC Protocol: CANbus Data Rate: 83.33Kbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
на замовлення 4694 шт: термін постачання 21-31 дні (днів) |
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MC33972ATEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Supplier Device Package: 32-SSOP-EP Applications: Switch Monitoring Voltage - Supply: 3.1V ~ 5.25V Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||||||||||||||
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MC33975ATEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPart Status: Active Supplier Device Package: 32-SOIC-EP Applications: Switch Monitoring Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||||||||||||||
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MC33975TEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Part Status: Active Supplier Device Package: 32-SSOP-EP Applications: Switch Monitoring Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
на замовлення 125 шт: термін постачання 21-31 дні (днів) |
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MC56F8245VLD | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 44LQFPNumber of I/O: 35 Part Status: Active Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 8x12b; D/A 1x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 3K x 16 Program Memory Size: 48KB (24K x 16) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 717 шт: термін постачання 21-31 дні (днів) |
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MC56F8246VLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFPRAM Size: 3K x 16 Program Memory Size: 48KB (24K x 16) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 10x12b; D/A 1x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||||
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MC56F8247MLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFPNumber of I/O: 54 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 16 Program Memory Size: 48KB (24K x 16) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||
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MC56F8257MLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPCore Size: 16-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 16 Program Memory Size: 64KB (32K x 16) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray Number of I/O: 54 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||
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MC56F8257VLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 16 Program Memory Size: 64KB (32K x 16) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
на замовлення 1458 шт: термін постачання 21-31 дні (днів) |
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| MPC17511EV | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFPMotor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 16-VMFP Voltage - Load: 2V ~ 6.8V Technology: CMOS Applications: Battery Powered Voltage - Supply: 2.7V ~ 5.7V Output Configuration: Half Bridge (2) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 1A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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KMC8144TVT1000B | NXP USA Inc. |
Description: IC DSP 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||||
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KMC8144TVT800A | NXP USA Inc. |
Description: IC DSP 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||||
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KMC8144TVT800B | NXP USA Inc. |
Description: IC DSP 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||||
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KMC8144VT1000A | NXP USA Inc. |
Description: IC DSP 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||||
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KMC8144TVT1000A | NXP USA Inc. |
Description: IC DSP 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||||
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MC13892BJVL | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 186MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 945 шт В кошику од. на суму грн. | ||||||||||||||||
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MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||||||
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MCIMX286DVM4B | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
на замовлення 760 шт: термін постачання 21-31 дні (днів) |
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MCIMX534AVV8B | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529TEBGA |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||||
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MCIMX535DVV1B | NXP USA Inc. |
Description: IC MPU I.MX53 1.0GHZ 529FBGAPackage / Case: 529-FBGA Packaging: Tray Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -20°C ~ 85°C (TC) Speed: 1.0GHz Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX536AVV8B | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGAPart Status: Obsolete SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tray Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX537CVV8B | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGAAdditional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -40°C ~ 85°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC13892AJVL | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 186MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 945 шт В кошику од. на суму грн. | ||||||||||||||||
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MPC8306CVMABDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 133MHZ 369BGAPackaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8306SVMACDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 200MHZ 369BGAAdditional Interfaces: DUART, I2C, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8306VMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGAAdditional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM Part Status: Last Time Buy Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8309CVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 489BGAPart Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8309VMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 489BGAAdditional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8309VMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 489BGAPackaging: Tray Package / Case: 489-LFBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 489-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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MPC8533EVTALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8544AVTALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||||
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MPC8544AVTANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCBGA |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||||
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MPC8544AVTARJA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.067GHZ 783BGA |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||||
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MPC8544CVTALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCPBGAAdditional Interfaces: DUART, I2C, PCI Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 667MHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8544EAVTALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8544EVTAQGA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGAAdditional Interfaces: DUART, I2C, PCI Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MPX4400AP | NXP USA Inc. |
Description: SENSOR 58.02PSIA Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa) Output Type: Analog Voltage Packaging: Tray Maximum Pressure: 58.02PSI (400kPa) Applications: Board Mount Voltage - Supply: 4.85V ~ 5.35V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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P1011NSE2DFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ PBGA689Additional Interfaces: DUART, I2C, MMC/SD, SPI Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Security; SEC 3.3 Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 125°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P1011NSN2DFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ PBGA689Additional Interfaces: DUART, I2C, MMC/SD, SPI Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 125°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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P1011NSN2FFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ PBGA689Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 125°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray Additional Interfaces: DUART, I2C, MMC/SD, SPI Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) |
товару немає в наявності |
В кошику од. на суму грн. |
| PRF947,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Part Status: Obsolete
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Frequency - Transition: 8.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 50mA
Power - Max: 250mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Part Status: Obsolete
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Frequency - Transition: 8.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 50mA
Power - Max: 250mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| TL431BSDT,215 |
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Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Qualification: AEC-Q100
Grade: Automotive
Voltage - Output (Max): 36 V
Current - Output: 100 mA
Current - Cathode: 600 µA
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.495V
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature: -40°C ~ 125°C (TA)
Reference Type: Shunt
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±0.5%
Packaging: Cut Tape (CT)
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Qualification: AEC-Q100
Grade: Automotive
Voltage - Output (Max): 36 V
Current - Output: 100 mA
Current - Cathode: 600 µA
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.495V
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature: -40°C ~ 125°C (TA)
Reference Type: Shunt
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±0.5%
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| BGA7127,118 |
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Виробник: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Part Status: Obsolete
Supplier Device Package: 8-HVSON (3x3)
Test Frequency: 2.445GHz
P1dB: 27.5dBm
Noise Figure: 4.7dB
Current - Supply: 180mA
Gain: 10.5dB
Voltage - Supply: 5V
RF Type: ISM, RFID, WLAN
Frequency: 400MHz ~ 2.7GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Part Status: Obsolete
Supplier Device Package: 8-HVSON (3x3)
Test Frequency: 2.445GHz
P1dB: 27.5dBm
Noise Figure: 4.7dB
Current - Supply: 180mA
Gain: 10.5dB
Voltage - Supply: 5V
RF Type: ISM, RFID, WLAN
Frequency: 400MHz ~ 2.7GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| PTN3392BS/F2,518 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
товару немає в наявності
В кошику
од. на суму грн.
| SA616DK/03,118 |
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Виробник: NXP USA Inc.
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Number of Mixers: 2
Noise Figure: 6.8dB
Secondary Attributes: RSSI Equipped
Current - Supply: 3.5mA
Gain: 17dB
Voltage - Supply: 2.7V ~ 7V
RF Type: Cellular
Frequency: 150MHz
Mounting Type: Surface Mount
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Number of Mixers: 2
Noise Figure: 6.8dB
Secondary Attributes: RSSI Equipped
Current - Supply: 3.5mA
Gain: 17dB
Voltage - Supply: 2.7V ~ 7V
RF Type: Cellular
Frequency: 150MHz
Mounting Type: Surface Mount
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| BGA7127,118 |
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Виробник: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 8-HVSON (3x3)
Test Frequency: 2.445GHz
P1dB: 27.5dBm
Noise Figure: 4.7dB
Current - Supply: 180mA
Gain: 10.5dB
Voltage - Supply: 5V
RF Type: ISM, RFID, WLAN
Frequency: 400MHz ~ 2.7GHz
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 8-HVSON (3x3)
Test Frequency: 2.445GHz
P1dB: 27.5dBm
Noise Figure: 4.7dB
Current - Supply: 180mA
Gain: 10.5dB
Voltage - Supply: 5V
RF Type: ISM, RFID, WLAN
Frequency: 400MHz ~ 2.7GHz
товару немає в наявності
В кошику
од. на суму грн.
| PTN3392BS/F2,518 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
товару немає в наявності
В кошику
од. на суму грн.
| BUK764R3-40B,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 254W (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
Description: MOSFET N-CH 40V 75A D2PAK
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 254W (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
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В кошику
од. на суму грн.
| PX1011BI-EL1/G,518 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Description: IC INTFACE SPECIALIZED 81LFBGA
товару немає в наявності
В кошику
од. на суму грн.
| TFF1003HN/N1,115 |
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Виробник: NXP USA Inc.
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Number of Circuits: 1
Part Status: Obsolete
PLL: No
Supplier Device Package: 24-HVQFN (4x4)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:4
Main Purpose: Ku band VSAT applications
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: Clock
Frequency - Max: 13.05GHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Number of Circuits: 1
Part Status: Obsolete
PLL: No
Supplier Device Package: 24-HVQFN (4x4)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:4
Main Purpose: Ku band VSAT applications
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: Clock
Frequency - Max: 13.05GHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| OM13008,598 |
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Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC122 EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC122
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: LPCXPRESSO LPC122 EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC122
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| MRFE6VP5600HR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Description: RF MOSFET LDMOS 50V NI1230
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 50+ | 43545.30 грн |
| MRFE6VP5600HR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Description: RF MOSFET LDMOS 50V NI1230
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 130 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 52301.40 грн |
| 10+ | 44341.34 грн |
| MPC8313E-RDBC |
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Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
Description: MPC8313E EVAL BRD
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| P1013PSE2EFA |
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Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
товару немає в наявності
В кошику
од. на суму грн.
| P1022COME-DS-PB |
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Виробник: NXP USA Inc.
Description: P1022 EVAL BRD
Description: P1022 EVAL BRD
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В кошику
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| P2010NXE2HFC |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
товару немає в наявності
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| P2020NXE2KFC |
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Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
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| P4080COME-DS-PB |
Виробник: NXP USA Inc.
Description: P4080 EVAL BRD
Description: P4080 EVAL BRD
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| P2020PSE2HFC |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
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| MC33897CTEF |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Active
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Active
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
на замовлення 4694 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 240.51 грн |
| 10+ | 174.24 грн |
| 55+ | 150.21 грн |
| 110+ | 134.48 грн |
| 275+ | 127.63 грн |
| 550+ | 123.50 грн |
| 1045+ | 118.35 грн |
| 2530+ | 114.88 грн |
| MC33972ATEK |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 42 шт
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| MC33975ATEK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 42 шт
В кошику
од. на суму грн.
| MC33975TEK |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
на замовлення 125 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 567.26 грн |
| 10+ | 421.84 грн |
| 42+ | 376.45 грн |
| MC56F8245VLD |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Number of I/O: 35
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Number of I/O: 35
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 717 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 909.05 грн |
| 10+ | 687.88 грн |
| 160+ | 569.49 грн |
| MC56F8246VLF |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Description: IC MCU 16BIT 48KB FLASH 48LQFP
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MC56F8247MLH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| MC56F8257MLH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| MC56F8257VLH |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
на замовлення 1458 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1035.63 грн |
| 10+ | 797.29 грн |
| 80+ | 673.36 грн |
| 800+ | 628.05 грн |
| MPC17511EV |
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Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
товару немає в наявності
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од. на суму грн.
| KMC8144TVT1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
Description: IC DSP 783FCBGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMC8144TVT800A |
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Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
Description: IC DSP 783FCBGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMC8144TVT800B |
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Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
Description: IC DSP 783FCBGA
товару немає в наявності
Мінімальне замовлення: 2 шт
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од. на суму грн.
| KMC8144VT1000A |
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Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
Description: IC DSP 783FCBGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| KMC8144TVT1000A |
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Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
Description: IC DSP 783FCBGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| MC13892BJVL |
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Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
товару немає в наявності
Мінімальне замовлення: 945 шт
В кошику
од. на суму грн.
| MCIMX250DJM4A |
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
Description: IC MPU I.MX25 400MAPBGA
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| MCIMX286DVM4B |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1931.23 грн |
| 10+ | 1498.50 грн |
| 25+ | 1408.28 грн |
| 100+ | 1228.59 грн |
| 250+ | 1184.25 грн |
| MCIMX534AVV8B |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529TEBGA
Description: IC MPU I.MX53 800MHZ 529TEBGA
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| MCIMX535DVV1B |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
товару немає в наявності
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од. на суму грн.
| MCIMX536AVV8B |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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| MCIMX537CVV8B |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
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| MC13892AJVL |
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Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
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Мінімальне замовлення: 945 шт
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| MPC8306CVMABDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
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| MPC8306SVMACDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 200MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 200MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
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| MPC8306VMADDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Part Status: Last Time Buy
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Part Status: Last Time Buy
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
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| MPC8309CVMAFDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 489BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 489BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
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| MPC8309VMADDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
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| MPC8309VMAFDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2416.21 грн |
| 10+ | 1887.81 грн |
| 84+ | 1670.41 грн |
| MPC8533EVTALFA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
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| MPC8544AVTALFA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
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Мінімальне замовлення: 36 шт
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| MPC8544AVTANGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCBGA
Description: IC MPU MPC85XX 800MHZ 783FCBGA
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Мінімальне замовлення: 36 шт
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| MPC8544AVTARJA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.067GHZ 783BGA
Description: IC MPU MPC85XX 1.067GHZ 783BGA
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Мінімальне замовлення: 36 шт
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| MPC8544CVTALFA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| MPC8544EAVTALFA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Description: IC MPU MPC85XX 667MHZ 783FCBGA
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| MPC8544EVTAQGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| MPX4400AP |
Виробник: NXP USA Inc.
Description: SENSOR 58.02PSIA
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Output Type: Analog Voltage
Packaging: Tray
Maximum Pressure: 58.02PSI (400kPa)
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Description: SENSOR 58.02PSIA
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Output Type: Analog Voltage
Packaging: Tray
Maximum Pressure: 58.02PSI (400kPa)
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
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| P1011NSE2DFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
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| P1011NSN2DFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4458.20 грн |
| 10+ | 3553.32 грн |
| 27+ | 3355.15 грн |
| P1011NSN2FFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Description: IC MPU QORIQ P1 800MHZ PBGA689
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
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