Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36847) > Сторінка 427 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
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| MRF6V3090NBR5578 | NXP USA Inc. | Description: RF POWER UHF BAND N-CHANNEL FET |
товару немає в наявності |
Мінімальне замовлення: 5 шт В кошику од. на суму грн. | |||||||||||||
| SPC5602BF2VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||
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SL2S5402FTBX | NXP USA Inc. |
Description: ICODE Part Status: Active Supplier Device Package: 3-XSON (1x1.45) Standards: ISO 15693, ISO 18000-3 Voltage - Supply: 1.5V ~ 1.7V Operating Temperature: -40°C ~ 85°C Type: RFID Transponder Interface: ISO 15693, ISO 18000-3 Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 3-XDFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||
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S912ZVL12F0CLF | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
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MCIMX6D5EYM12AC | NXP USA Inc. |
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGAAdditional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||
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LS1084ASE7MQA | NXP USA Inc. |
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGAAdditional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART SATA: SATA 6Gbps (1) Security Features: Secure Boot, TrustZone® Display & Interface Controllers: LVDS Graphics Acceleration: Yes RAM Controllers: DDR4 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 + PHY (2) Ethernet: 10GbE (2), 1GbE (8) Supplier Device Package: 780-FBGA (23x23) Core Processor: ARM® Cortex®-A53 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||
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MK22FN1M0AVLK12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 80FQFPDigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 80-FQFP (12x12) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 27x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||
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MC33HB2001EKR2518 | NXP USA Inc. |
Description: BRUSH DC MOTOR CONTROLLER 16A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33HB2002ES | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Grade: Automotive Part Status: Active Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 28-HVQFN (6x6) Voltage - Load: 5V ~ 28V Technology: CMOS Applications: DC Motors Voltage - Supply: 5V ~ 28V Output Configuration: Half Bridge (2) Operating Temperature: -40°C ~ 125°C (TA) Interface: SPI Current - Output: 10A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount, Wettable Flank Package / Case: 28-VQFN Exposed Pad Packaging: Tray |
на замовлення 497 шт: термін постачання 21-31 дні (днів) |
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| MC33HB2002ESR2 | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Grade: Automotive Part Status: Active Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 28-HVQFN (6x6) Voltage - Load: 5V ~ 28V Technology: CMOS Applications: DC Motors Voltage - Supply: 5V ~ 28V Output Configuration: Half Bridge (2) Operating Temperature: -40°C ~ 125°C (TA) Interface: SPI Current - Output: 10A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount, Wettable Flank Package / Case: 28-VQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
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S9S12GN48AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
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MPF5024AVNA0ESR2 | NXP USA Inc. |
Description: PF5024 Supplier Device Package: 40-HVQFN (6x6) Applications: High Performance i.MX 8 Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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NX3L1G3157GMZ | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 900MOHM 6XSONGrade: Automotive Qualification: AEC-Q100 Number of Circuits: 1 Current - Leakage (IS(off)) (Max): 10nA Channel Capacitance (CS(off), CD(off)): 35pF Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel-to-Channel Matching (ΔRon): 100mOhm Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: SPDT Crosstalk: -90dB @ 1MHz Charge Injection: 15pC Voltage - Supply, Single (V+): 1.4V ~ 4.3V Supplier Device Package: 6-XSON, SOT886 (1.45x1) -3db Bandwidth: 60MHz On-State Resistance (Max): 900mOhm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Tape & Reel (TR) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| S32G274AABK0CUCT | NXP USA Inc. |
Description: IC MPU AEC-Q100 1GHZ 525FCPBGASecurity Features: HSE-H RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit USB: USB OTG (1) Ethernet: MII, RGMII, RMII, SGMII Supplier Device Package: 525-FCPBGA (19x19) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: -40°C ~ 85°C (TA) Speed: 400MHz, 1GHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |||||||||||||
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SPC5746CK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGACore Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 178 Part Status: Active Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||
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2PA1774QMB315 | NXP USA Inc. |
Description: NOW NEXPERIA 2PA1774QMB - SMALLPackaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW Qualification: AEC-Q101 |
на замовлення 57940 шт: термін постачання 21-31 дні (днів) |
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PDTC144VMB315 | NXP USA Inc. |
Description: TRANS PREBIASPart Status: Active Packaging: Bulk Qualification: AEC-Q101 Grade: Automotive Resistor - Emitter Base (R2): 10 kOhms Resistor - Base (R1): 47 kOhms Frequency - Transition: 230 MHz Power - Max: 250 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Supplier Device Package: DFN1006B-3 DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Transistor Type: NPN - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-101, SOT-883 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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LPC11E13FBD48301 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP |
товару немає в наявності |
Мінімальне замовлення: 31 шт В кошику од. на суму грн. | ||||||||||||
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SPC5747CHK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 129 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||
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SP5747CHK0AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 129 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||
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NX3V1T66GM,115 | NXP USA Inc. |
Description: IC SW SPST-NOX1 450MOHM 6XSONOn-State Resistance (Max): 450mOhm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Bulk Multiplexer/Demultiplexer Circuit: 1:1 Switch Circuit: SPST - NO Charge Injection: 12pC Voltage - Supply, Single (V+): 1.4V ~ 4.3V Supplier Device Package: 6-XSON, SOT886 (1.45x1) -3db Bandwidth: 25MHz Number of Circuits: 1 Current - Leakage (IS(off)) (Max): 10nA Channel Capacitance (CS(off), CD(off)): 70pF Switch Time (Ton, Toff) (Max): 28ns, 20ns |
на замовлення 33273 шт: термін постачання 21-31 дні (днів) |
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S912ZVC12F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFPPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| TDA18225HN/C1 | NXP USA Inc. | Description: INTEGRATED CIRCUIT |
на замовлення 938 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 76 шт В кошику од. на суму грн. | |||||||||||||
| P60D144PX34/9A0409 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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BZX79-B6V2143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-B6V2 - ZENER |
на замовлення 105000 шт: термін постачання 21-31 дні (днів) |
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| BAP65-05 | NXP USA Inc. | Description: PIN DIODE, 30V V(BR), SILICON, T |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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S9S12G64AVLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
| SWAC58R-ICC01L | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SWAC58R-ICC01V | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SWAC58R-ICC01P | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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LD6806TD/18P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 5TSOPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 1.8V Supplier Device Package: 5-TSOP Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: SC-74A, SOT-753 Packaging: Bulk |
на замовлення 15901 шт: термін постачання 21-31 дні (днів) |
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MPC5775B-EVB | NXP USA Inc. |
Description: MPC5775B-EVB DEV BOARDType: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk Part Status: Active Utilized IC / Part: MPC5775B, MPC5775E Board Type: Evaluation Platform Core Processor: e200 Contents: Board(s) |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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S32K14WEVB-Q064 | NXP USA Inc. |
Description: S32K144W EVAL BOARDUtilized IC / Part: S32K144W Core Processor: ARM® Cortex®-M4F Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| S12VR64EVB3 | NXP USA Inc. |
Description: S12VR64 EVAL BRDMounting Type: Fixed Packaging: Bulk Utilized IC / Part: S12VR64 Core Processor: S12 Contents: Board(s) Type: MCU 16-Bit |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. | |||||||||||||
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MIMXRT1060-EVKB | NXP USA Inc. |
Description: I.MX RT1060 EVAL BRD REVBPackaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: i.MX RT1060 |
на замовлення 47 шт: термін постачання 21-31 дні (днів) |
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S32K3X4EVBQ257ND | NXP USA Inc. |
Description: S32K344 EVAL BOARD Utilized IC / Part: S32K344 Core Processor: ARM® Cortex®-M7 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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S32K116EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K116Utilized IC / Part: S32K116 Core Processor: ARM® Cortex®-M0+ Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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S32K118EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K118 GEN PURPOSEUtilized IC / Part: S32K118 Core Processor: ARM® Cortex®-M0+ Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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| KIT33772CTPLEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772C Part Status: Active Embedded: Yes, MCU Primary Attributes: 6-Channel (Hex) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MC33772C Type: Power Management Function: Battery Cell Controller Packaging: Bulk Contents: Board(s), Cable(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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FRDM33772CSPEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772CPackaging: Bulk Secondary Attributes: On-Board LEDs, Test Points Contents: Board(s), Cable(s) Part Status: Active Embedded: Yes, MCU Primary Attributes: 6-Channel (Hex) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MC33772C Type: Power Management Function: Battery Cell Controller |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| UJA1161A-EVB | NXP USA Inc. |
Description: UJA1161A EVAL BOARDEmbedded: Yes, MCU Supplied Contents: Board(s) Utilized IC / Part: UJA1161A Type: Interface Function: CAN Transceiver Packaging: Bulk |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| CGY1049112 | NXP USA Inc. |
Description: NARROW BAND HIGH POWER AMPLIFIER |
на замовлення 6870 шт: термін постачання 21-31 дні (днів) |
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S912XET256J2MAGR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFPRAM Size: 16K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) Number of I/O: 119 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||
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LPC1548JBD64151 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 44 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, I²C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 24x12b Core Processor: ARM® Cortex®-M3 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 20K x 8 Program Memory Size: 128KB (128K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| EV-INVERTERHDBT | NXP USA Inc. |
Description: IGBT PWR INVTR CTRL REF PLATFORMPackaging: Box Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160 Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
XC7SET02GV,125 | NXP USA Inc. |
Description: IC GATE NOR 1CH 2-INP SC74ACurrent - Quiescent (Max): 1 µA Number of Circuits: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 5-TSOP Number of Inputs: 2 Current - Output High, Low: 8mA, 8mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Packaging: Bulk |
на замовлення 60000 шт: термін постачання 21-31 дні (днів) |
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| SAF7770EL/101S130Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 364-LFBGA (15x15) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| P1011NSE2HFB | NXP USA Inc. |
Description: QORIQ, POWER ARCH 32-BIT SOC, 80Part Status: Active Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Security; SEC 3.3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 125°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| NCF2961MHN3/0200E | NXP USA Inc. | Description: RFID TRANSPONDER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
BLM6G10-30G,118 | NXP USA Inc. |
Description: IC RF AMP CDMA 920-960MHZ 16HSOPSupplier Device Package: 16-HSOP Gain: 29dB Voltage - Supply: 28V RF Type: W-CDMA Frequency: 920MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: 16-SMD Module Packaging: Bulk |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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LS1084AXE7MQA | NXP USA Inc. |
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGAAdditional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART SATA: SATA 6Gbps (1) Security Features: Secure Boot, TrustZone® Display & Interface Controllers: LVDS Graphics Acceleration: Yes RAM Controllers: DDR4 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 + PHY (2) Ethernet: 10GbE (2), 1GbE (8) Supplier Device Package: 780-FBGA (23x23) Core Processor: ARM® Cortex®-A53 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||
|
MPC8270VVQLDA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 480TBGAPackaging: Bulk Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Active Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
на замовлення 507 шт: термін постачання 21-31 дні (днів) |
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MC34PF3000A2EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||
| SAF4000EL/101S43AY | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101S235K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101S574Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101S57AK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7770EL/101S170K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Supplier Device Package: 364-LFBGA (15x15) Type: Audio, Car Signal Processor Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101S23CY | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101S530K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| MRF6V3090NBR5578 |
Виробник: NXP USA Inc.
Description: RF POWER UHF BAND N-CHANNEL FET
Description: RF POWER UHF BAND N-CHANNEL FET
товару немає в наявності
Мінімальне замовлення: 5 шт
В кошику
од. на суму грн.
| SPC5602BF2VLH4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| SL2S5402FTBX |
Виробник: NXP USA Inc.
Description: ICODE
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 15693, ISO 18000-3
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Interface: ISO 15693, ISO 18000-3
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Tape & Reel (TR)
Description: ICODE
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 15693, ISO 18000-3
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Interface: ISO 15693, ISO 18000-3
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| S912ZVL12F0CLF |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MCIMX6D5EYM12AC |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| LS1084ASE7MQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Display & Interface Controllers: LVDS
Graphics Acceleration: Yes
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Display & Interface Controllers: LVDS
Graphics Acceleration: Yes
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| MK22FN1M0AVLK12R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1MB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MC33HB2001EKR2518 |
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Виробник: NXP USA Inc.
Description: BRUSH DC MOTOR CONTROLLER 16A
Description: BRUSH DC MOTOR CONTROLLER 16A
товару немає в наявності
В кошику
од. на суму грн.
| MC33HB2002ES |
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Grade: Automotive
Part Status: Active
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 28-HVQFN (6x6)
Voltage - Load: 5V ~ 28V
Technology: CMOS
Applications: DC Motors
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: SPI
Current - Output: 10A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 28-VQFN Exposed Pad
Packaging: Tray
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Grade: Automotive
Part Status: Active
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 28-HVQFN (6x6)
Voltage - Load: 5V ~ 28V
Technology: CMOS
Applications: DC Motors
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: SPI
Current - Output: 10A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 28-VQFN Exposed Pad
Packaging: Tray
на замовлення 497 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 276.12 грн |
| 10+ | 200.75 грн |
| 25+ | 184.31 грн |
| 80+ | 158.32 грн |
| 230+ | 148.60 грн |
| 490+ | 143.21 грн |
| MC33HB2002ESR2 |
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Grade: Automotive
Part Status: Active
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 28-HVQFN (6x6)
Voltage - Load: 5V ~ 28V
Technology: CMOS
Applications: DC Motors
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: SPI
Current - Output: 10A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 28-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Grade: Automotive
Part Status: Active
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 28-HVQFN (6x6)
Voltage - Load: 5V ~ 28V
Technology: CMOS
Applications: DC Motors
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: SPI
Current - Output: 10A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 28-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| S9S12GN48AMLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MPF5024AVNA0ESR2 |
Виробник: NXP USA Inc.
Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
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| NX3L1G3157GMZ |
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Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Grade: Automotive
Qualification: AEC-Q100
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel-to-Channel Matching (ΔRon): 100mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 1MHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 900mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Grade: Automotive
Qualification: AEC-Q100
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel-to-Channel Matching (ΔRon): 100mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 1MHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 900mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5000+ | 15.43 грн |
| S32G274AABK0CUCT |
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Виробник: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Security Features: HSE-H
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
USB: USB OTG (1)
Ethernet: MII, RGMII, RMII, SGMII
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Security Features: HSE-H
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
USB: USB OTG (1)
Ethernet: MII, RGMII, RMII, SGMII
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| SPC5746CK1MMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
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| 2PA1774QMB315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
на замовлення 57940 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6935+ | 2.89 грн |
| PDTC144VMB315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 11225+ | 2.16 грн |
| LPC11E13FBD48301 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Description: IC MCU 32BIT 24KB FLASH 48LQFP
товару немає в наявності
Мінімальне замовлення: 31 шт
В кошику
од. на суму грн.
| SPC5747CHK0AVKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| SP5747CHK0AVKU6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| NX3V1T66GM,115 |
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Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
On-State Resistance (Max): 450mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Charge Injection: 12pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 25MHz
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 70pF
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Description: IC SW SPST-NOX1 450MOHM 6XSON
On-State Resistance (Max): 450mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Charge Injection: 12pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 25MHz
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 70pF
Switch Time (Ton, Toff) (Max): 28ns, 20ns
на замовлення 33273 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3328+ | 6.79 грн |
| S912ZVC12F0VLFR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 352.63 грн |
| TDA18225HN/C1 |
Виробник: NXP USA Inc.
Description: INTEGRATED CIRCUIT
Description: INTEGRATED CIRCUIT
на замовлення 938 шт:
термін постачання 21-31 дні (днів)
| P60D144PX34/9A0409 |
Виробник: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
товару немає в наявності
В кошику
од. на суму грн.
| BZX79-B6V2143 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
на замовлення 105000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 15000+ | 1.45 грн |
| BAP65-05 |
Виробник: NXP USA Inc.
Description: PIN DIODE, 30V V(BR), SILICON, T
Description: PIN DIODE, 30V V(BR), SILICON, T
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| S9S12G64AVLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| SWAC58R-ICC01L |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Description: AUTO SOFTWARE SAC58R INTER CORE
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| SWAC58R-ICC01V |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Description: AUTO SOFTWARE SAC58R INTER CORE
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од. на суму грн.
| SWAC58R-ICC01P |
Виробник: NXP USA Inc.
Description: AUTO SOFTWARE SAC58R INTER CORE
Description: AUTO SOFTWARE SAC58R INTER CORE
товару немає в наявності
В кошику
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| LD6806TD/18P,125 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
на замовлення 15901 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 7.57 грн |
| MPC5775B-EVB |
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Виробник: NXP USA Inc.
Description: MPC5775B-EVB DEV BOARD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Utilized IC / Part: MPC5775B, MPC5775E
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Description: MPC5775B-EVB DEV BOARD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Utilized IC / Part: MPC5775B, MPC5775E
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21870.11 грн |
| S32K14WEVB-Q064 |
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Виробник: NXP USA Inc.
Description: S32K144W EVAL BOARD
Utilized IC / Part: S32K144W
Core Processor: ARM® Cortex®-M4F
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: S32K144W EVAL BOARD
Utilized IC / Part: S32K144W
Core Processor: ARM® Cortex®-M4F
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13621.45 грн |
| S12VR64EVB3 |
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Виробник: NXP USA Inc.
Description: S12VR64 EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S12VR64
Core Processor: S12
Contents: Board(s)
Type: MCU 16-Bit
Description: S12VR64 EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S12VR64
Core Processor: S12
Contents: Board(s)
Type: MCU 16-Bit
товару немає в наявності
Мінімальне замовлення: 4 шт
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од. на суму грн.
| MIMXRT1060-EVKB |
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Виробник: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9178.28 грн |
| S32K3X4EVBQ257ND |
Виробник: NXP USA Inc.
Description: S32K344 EVAL BOARD
Utilized IC / Part: S32K344
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: S32K344 EVAL BOARD
Utilized IC / Part: S32K344
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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| S32K116EVB2Q048 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD S32K116
Utilized IC / Part: S32K116
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: EVAL BOARD S32K116
Utilized IC / Part: S32K116
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8436.96 грн |
| S32K118EVB2Q048 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD S32K118 GEN PURPOSE
Utilized IC / Part: S32K118
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: EVAL BOARD S32K118 GEN PURPOSE
Utilized IC / Part: S32K118
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7789.79 грн |
| KIT33772CTPLEVB |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Part Status: Active
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Type: Power Management
Function: Battery Cell Controller
Packaging: Bulk
Contents: Board(s), Cable(s)
Description: EVAL BOARD FOR MC33772C
Part Status: Active
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Type: Power Management
Function: Battery Cell Controller
Packaging: Bulk
Contents: Board(s), Cable(s)
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| FRDM33772CSPEVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Type: Power Management
Function: Battery Cell Controller
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Type: Power Management
Function: Battery Cell Controller
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| UJA1161A-EVB |
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Виробник: NXP USA Inc.
Description: UJA1161A EVAL BOARD
Embedded: Yes, MCU
Supplied Contents: Board(s)
Utilized IC / Part: UJA1161A
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
Description: UJA1161A EVAL BOARD
Embedded: Yes, MCU
Supplied Contents: Board(s)
Utilized IC / Part: UJA1161A
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6432.94 грн |
| CGY1049112 |
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Виробник: NXP USA Inc.
Description: NARROW BAND HIGH POWER AMPLIFIER
Description: NARROW BAND HIGH POWER AMPLIFIER
на замовлення 6870 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 3064.00 грн |
| S912XET256J2MAGR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 500 шт
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| LPC1548JBD64151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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| EV-INVERTERHDBT |
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Виробник: NXP USA Inc.
Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Description: IGBT PWR INVTR CTRL REF PLATFORM
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
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| XC7SET02GV,125 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 1CH 2-INP SC74A
Current - Quiescent (Max): 1 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 5-TSOP
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Description: IC GATE NOR 1CH 2-INP SC74A
Current - Quiescent (Max): 1 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 5-TSOP
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Bulk
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1926+ | 12.66 грн |
| SAF7770EL/101S130Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
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| P1011NSE2HFB |
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Виробник: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Bulk
Description: QORIQ, POWER ARCH 32-BIT SOC, 80
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Bulk
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| NCF2961MHN3/0200E |
Виробник: NXP USA Inc.
Description: RFID TRANSPONDER
Description: RFID TRANSPONDER
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| BLM6G10-30G,118 |
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Виробник: NXP USA Inc.
Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Supplier Device Package: 16-HSOP
Gain: 29dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 920MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 16-SMD Module
Packaging: Bulk
Description: IC RF AMP CDMA 920-960MHZ 16HSOP
Supplier Device Package: 16-HSOP
Gain: 29dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 920MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 16-SMD Module
Packaging: Bulk
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 2901.49 грн |
| LS1084AXE7MQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Display & Interface Controllers: LVDS
Graphics Acceleration: Yes
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Display & Interface Controllers: LVDS
Graphics Acceleration: Yes
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
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Мінімальне замовлення: 60 шт
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| MPC8270VVQLDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 507 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 11521.31 грн |
| MC34PF3000A2EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
товару немає в наявності
Мінімальне замовлення: 4000 шт
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| SAF4000EL/101S43AY |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
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| SAF4000EL/101S574Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
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| SAF7770EL/101S170K |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Supplier Device Package: 364-LFBGA (15x15)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Supplier Device Package: 364-LFBGA (15x15)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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| SAF4000EL/101S23CY |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
Description: SOFTWARE DEFINED RADIO
Part Status: Active
Packaging: Tape & Reel (TR)
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