Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36388) > Сторінка 519 з 607
| Фото | Назва | Виробник | Інформація |
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BZA868AVL,115 | NXP USA Inc. |
Description: TVS DIODE 6.8VWM 5TSSOPPackaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Applications: General Purpose Capacitance @ Frequency: 180pF @ 1MHz Voltage - Reverse Standoff (Typ): 6.8V Supplier Device Package: SOT-353 Unidirectional Channels: 4 Power - Peak Pulse: 6W Power Line Protection: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| LFDBGK46MT4A | NXP USA Inc. |
Description: 292 PIN 0.8MM PGA ADAPTER WITH A Packaging: Bulk For Use With/Related Products: MPC5746M Module/Board Type: Socket Module - BGA Utilized IC / Part: MPC5746M |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| RDWMC9064-SR2-S0 | NXP USA Inc. |
Description: RDWMC9064-SR2-S0 Packaging: Bulk |
товару немає в наявності |
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LPC5502JHI48J | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48VFQFNPackaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 |
на замовлення 1513 шт: термін постачання 21-31 дні (днів) |
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LPC5502JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 9x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 45 |
на замовлення 686 шт: термін постачання 21-31 дні (днів) |
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74LVCH32373AEC,551 | NXP USA Inc. |
Description: IC 32BIT TRANSP D LATCH 96LFBGAPackaging: Tray Package / Case: 96-LFBGA Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 4 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 3ns Supplier Device Package: 96-LFBGA (13.5x5.5) |
на замовлення 743 шт: термін постачання 21-31 дні (днів) |
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S912XEQ512BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
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P1010NXE5HHB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGAPackaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
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MCIMX8ULP-EVK | NXP USA Inc. |
Description: I.MX 8ULP EVK (W/ 15X15) Packaging: Box |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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| NTM88H145T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MC56F82723VLC | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 32KB (16K x 16) RAM Size: 3K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC35FS6510NAE | NXP USA Inc. |
Description: FS6500Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 88W8782UB0-NAPC/EZ | NXP USA Inc. |
Description: 11ABGN 1X1+ INTEGRATED PA + TR S Packaging: Tape & Reel (TR) Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 68-HVQFN (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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LPC11U12FHN33/201, | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| NCK2912HHN/T0B/UY | NXP USA Inc. |
Description: NCK2912HHN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NCK2912AHN/T0BY | NXP USA Inc. |
Description: IC RF TXRX+MCU 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Type: TxRx + MCU Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NCK2912HHN/T0BY | NXP USA Inc. |
Description: TRANSCEIVER Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74AHCT164D,112 | NXP USA Inc. |
Description: IC 8BIT SHIFT REGISTER 14-SOICPackaging: Tube |
на замовлення 1920 шт: термін постачання 21-31 дні (днів) |
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MCZ33789BAE | NXP USA Inc. |
Description: IC SBC W/PWR SUPPLY 64LQFPPackaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.2V ~ 20V Applications: Airbag System Supplier Device Package: 64-LQFP (10x10) Grade: Automotive |
на замовлення 671 шт: термін постачання 21-31 дні (днів) |
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MCIMX7S5EVK08SC | NXP USA Inc. |
Description: IC MPU I.MX7S 800MHZ 488TFBGAPackaging: Bulk Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
на замовлення 2440 шт: термін постачання 21-31 дні (днів) |
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MCIMX7S5EVK08SC | NXP USA Inc. |
Description: IC MPU I.MX7S 800MHZ 488TFBGAPackaging: Tray Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
товару немає в наявності |
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S32G274AABK0VUCR | NXP USA Inc. |
Description: S32G274A ARM CORTEX-M7 AND -A53,Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (4) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF5407CAI220 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208FQFPPackaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Speed: 220MHz RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, WDT Supplier Device Package: 208-FQFP (28x28) Number of I/O: 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| NVT4558HKX | NXP USA Inc. |
Description: IC SIM CARD LEVEL TRANS XQFN10Packaging: Tape & Reel (TR) Package / Case: 10-XFQFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 10-XQFN (1.4x1.8) Channel Type: Bidirectional Translator Type: Voltage Level Voltage - VCCA: 1.08 V ~ 1.98 V Voltage - VCCB: 1.62 V ~ 3.6 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NVT4558HKX | NXP USA Inc. |
Description: IC SIM CARD LEVEL TRANS XQFN10Packaging: Cut Tape (CT) Package / Case: 10-XFQFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 10-XQFN (1.4x1.8) Channel Type: Bidirectional Translator Type: Voltage Level Voltage - VCCA: 1.08 V ~ 1.98 V Voltage - VCCB: 1.62 V ~ 3.6 V Number of Circuits: 1 |
на замовлення 3460 шт: термін постачання 21-31 дні (днів) |
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S32G399AACK1VUCT | NXP USA Inc. |
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART |
на замовлення 244 шт: термін постачання 21-31 дні (днів) |
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MWCT1011VLH | NXP USA Inc. |
Description: 15W MULTI-COIL CONS QFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Applications: General Purpose Supplier Device Package: 64-LQFP (10x10) |
на замовлення 90549 шт: термін постачання 21-31 дні (днів) |
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MWCT1011VLH | NXP USA Inc. |
Description: 15W MULTI-COIL CONS QFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Applications: General Purpose Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| AFSC5G23E37-EVB | NXP USA Inc. |
Description: AFSC5G23E37 2300-2400 MHZ REFEREPackaging: Bulk For Use With/Related Products: AFSC5G23E37 Frequency: 2.3GHz ~ 2.4GHz Type: Power Amplifier Contents: Board(s) Utilized IC / Part: AFSC5G23E37 Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MRF6S20010NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15.5dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 130 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1028AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 10.4kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1028AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 10.4kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2436 шт: термін постачання 21-31 дні (днів) |
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BUK7880-55,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 3.5A SOT223Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta) Rds On (Max) @ Id, Vgs: 80mOhm @ 5A, 10V Power Dissipation (Max): 1.8W (Ta) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: SC-73 Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NCX2222GMH | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8XQFNPackaging: Bulk Package / Case: 8-XFQFN Exposed Pad Output Type: Open-Drain Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-XQFN (1.6x1.6) Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): 68mA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 9mV |
на замовлення 51468 шт: термін постачання 21-31 дні (днів) |
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MC9S08AC8CFDE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MRF6VP121KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Bulk Technology: LDMOS Gain: 20dB Power - Output: 1000W Current - Test: 150 mA Voltage - Test: 50 V Voltage - Rated: 110 V Supplier Device Package: NI-1230 Configuration: Dual Frequency: 1.03GHz Package / Case: NI-1230 |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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MFS8631BMBA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOMQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HVQFN (7x7) Applications: Camera Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| LFVBBK77CZC | NXP USA Inc. |
Description: NXP LEAD FREE MPC5777C CSE 2.08 Accessory Type: Calibration Unit For Use With/Related Products: MPCxxxx Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MF3D9200DA4/02J | NXP USA Inc. |
Description: MF3D9200DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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P1021NSN2DFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ PBGA689Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8358VRADDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 668BGAPackaging: Bulk Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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MPC8358VRADDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 668BGAPackaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8358VRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGAPackaging: Bulk Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
на замовлення 174 шт: термін постачання 21-31 дні (днів) |
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MPC8358VRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGAPackaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8314VRAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8323VRAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8343VRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC1768FBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 70 |
на замовлення 453 шт: термін постачання 21-31 дні (днів) |
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LPC1768FET100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGAPackaging: Tape & Reel (TR) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 70 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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LPC1768FET100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGAPackaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 70 DigiKey Programmable: Not Verified |
на замовлення 1006 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101Q23DY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2330 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF4000EL/101Q23DK | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2330 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5603BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1028BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1028BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1841 шт: термін постачання 21-31 дні (днів) |
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| SPC5643LAMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Core Size: 32-Bit Dual-Core Data Converters: A/D 32x12b SAR Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5643LAMLQ1R | NXP USA Inc. |
Description: NXP 32-BIT MCU, DUAL POWER ARCH,Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Core Size: 32-Bit Dual-Core Data Converters: A/D 32x12b SAR Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| SPC5643LFAMLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SPC5643LFAMLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S32K328GHT1VPCSR | NXP USA Inc. |
Description: ICPackaging: Bulk Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Number of I/O: 142 |
товару немає в наявності |
В кошику од. на суму грн. |
| BZA868AVL,115 |
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Виробник: NXP USA Inc.
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
товару немає в наявності
В кошику
од. на суму грн.
| LFDBGK46MT4A |
Виробник: NXP USA Inc.
Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Utilized IC / Part: MPC5746M
Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Utilized IC / Part: MPC5746M
товару немає в наявності
В кошику
од. на суму грн.
| LPC5502JHI48J |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
на замовлення 1513 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 272.16 грн |
| 10+ | 197.78 грн |
| 25+ | 181.72 грн |
| 100+ | 153.93 грн |
| 250+ | 146.03 грн |
| 500+ | 142.26 грн |
| LPC5502JBD64K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
на замовлення 686 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 285.61 грн |
| 10+ | 208.22 грн |
| 25+ | 191.44 грн |
| 100+ | 162.32 грн |
| 250+ | 154.05 грн |
| 74LVCH32373AEC,551 |
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Виробник: NXP USA Inc.
Description: IC 32BIT TRANSP D LATCH 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
Description: IC 32BIT TRANSP D LATCH 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
на замовлення 743 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 62+ | 358.32 грн |
| S912XEQ512BCAL |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P1010NXE5HHB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX8ULP-EVK |
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 38357.16 грн |
| NTM88H145T1 |
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2000+ | 242.29 грн |
| MC56F82723VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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| MC35FS6510NAE |
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Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| 88W8782UB0-NAPC/EZ |
Виробник: NXP USA Inc.
Description: 11ABGN 1X1+ INTEGRATED PA + TR S
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Description: 11ABGN 1X1+ INTEGRATED PA + TR S
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
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| LPC11U12FHN33/201, |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 189.88 грн |
| NCK2912AHN/T0BY |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: TxRx + MCU
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: TxRx + MCU
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
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| NCK2912HHN/T0BY |
Виробник: NXP USA Inc.
Description: TRANSCEIVER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: TRANSCEIVER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| 74AHCT164D,112 |
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на замовлення 1920 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1110+ | 20.37 грн |
| MCZ33789BAE |
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Виробник: NXP USA Inc.
Description: IC SBC W/PWR SUPPLY 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.2V ~ 20V
Applications: Airbag System
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Description: IC SBC W/PWR SUPPLY 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.2V ~ 20V
Applications: Airbag System
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
на замовлення 671 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 28+ | 707.89 грн |
| MCIMX7S5EVK08SC |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
на замовлення 2440 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 16+ | 1479.92 грн |
| MCIMX7S5EVK08SC |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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| S32G274AABK0VUCR |
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Виробник: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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| MCF5407CAI220 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 220MHz
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 220MHz
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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| NVT4558HKX |
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Виробник: NXP USA Inc.
Description: IC SIM CARD LEVEL TRANS XQFN10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Voltage - VCCA: 1.08 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.6 V
Number of Circuits: 1
Description: IC SIM CARD LEVEL TRANS XQFN10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Voltage - VCCA: 1.08 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.6 V
Number of Circuits: 1
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| NVT4558HKX |
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Виробник: NXP USA Inc.
Description: IC SIM CARD LEVEL TRANS XQFN10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Voltage - VCCA: 1.08 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.6 V
Number of Circuits: 1
Description: IC SIM CARD LEVEL TRANS XQFN10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Voltage - VCCA: 1.08 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.6 V
Number of Circuits: 1
на замовлення 3460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.96 грн |
| 10+ | 48.61 грн |
| 25+ | 46.32 грн |
| 50+ | 41.94 грн |
| 100+ | 40.47 грн |
| 250+ | 38.59 грн |
| 500+ | 36.62 грн |
| 1000+ | 35.32 грн |
| S32G399AACK1VUCT |
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Виробник: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
на замовлення 244 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11495.60 грн |
| 10+ | 9392.14 грн |
| 25+ | 8973.38 грн |
| MWCT1011VLH |
Виробник: NXP USA Inc.
Description: 15W MULTI-COIL CONS QFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
Description: 15W MULTI-COIL CONS QFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
на замовлення 90549 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 71+ | 285.16 грн |
| MWCT1011VLH |
Виробник: NXP USA Inc.
Description: 15W MULTI-COIL CONS QFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
Description: 15W MULTI-COIL CONS QFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
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| AFSC5G23E37-EVB |
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Виробник: NXP USA Inc.
Description: AFSC5G23E37 2300-2400 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G23E37
Frequency: 2.3GHz ~ 2.4GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G23E37
Supplied Contents: Board(s)
Description: AFSC5G23E37 2300-2400 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G23E37
Frequency: 2.3GHz ~ 2.4GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G23E37
Supplied Contents: Board(s)
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| MRF6S20010NR1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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| TJA1028AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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| TJA1028AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2436 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 79.91 грн |
| 10+ | 55.31 грн |
| 25+ | 50.04 грн |
| 100+ | 41.47 грн |
| 250+ | 38.85 грн |
| 500+ | 37.28 грн |
| 1000+ | 35.86 грн |
| BUK7880-55,135 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 3.5A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 5A, 10V
Power Dissipation (Max): 1.8W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Qualification: AEC-Q101
Description: MOSFET N-CH 55V 3.5A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 5A, 10V
Power Dissipation (Max): 1.8W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Qualification: AEC-Q101
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| NCX2222GMH |
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Виробник: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XQFN (1.6x1.6)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Description: IC COMPARATOR 2 GEN PUR 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XQFN (1.6x1.6)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
на замовлення 51468 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1211+ | 18.86 грн |
| MC9S08AC8CFDE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| MRF6VP121KHR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Technology: LDMOS
Gain: 20dB
Power - Output: 1000W
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Configuration: Dual
Frequency: 1.03GHz
Package / Case: NI-1230
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 51968.32 грн |
| MFS8631BMBA0ESR2 |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Applications: Camera
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Applications: Camera
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| LFVBBK77CZC |
Виробник: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2.08
Accessory Type: Calibration Unit
For Use With/Related Products: MPCxxxx
Packaging: Bulk
Description: NXP LEAD FREE MPC5777C CSE 2.08
Accessory Type: Calibration Unit
For Use With/Related Products: MPCxxxx
Packaging: Bulk
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| MF3D9200DA4/02J |
Виробник: NXP USA Inc.
Description: MF3D9200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
Description: MF3D9200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
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| P1021NSN2DFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| MPC8358VRADDDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 668BGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 266MHZ 668BGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 5824.74 грн |
| MPC8358VRADDDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 266MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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| MPC8358VRAGDDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
на замовлення 174 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 6405.45 грн |
| MPC8358VRAGDDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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| MPC8314VRAFDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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| MPC8323VRAFDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| MPC8343VRADDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| LPC1768FBD100Y |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
на замовлення 453 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1005.57 грн |
| 10+ | 764.45 грн |
| 25+ | 713.59 грн |
| 100+ | 617.17 грн |
| 250+ | 611.34 грн |
| LPC1768FET100Y |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 630.82 грн |
| LPC1768FET100Y |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1006 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1005.57 грн |
| 10+ | 764.45 грн |
| 25+ | 713.59 грн |
| 100+ | 617.17 грн |
| 250+ | 611.34 грн |
| SPC5603BK0CLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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| TJA1028BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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| TJA1028BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1841 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 80.70 грн |
| 10+ | 56.45 грн |
| 25+ | 51.01 грн |
| 100+ | 42.28 грн |
| 250+ | 39.61 грн |
| 500+ | 38.00 грн |
| 1000+ | 36.08 грн |
| SPC5643LAMLQ8 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b SAR
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b SAR
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| SPC5643LAMLQ1R |
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Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, DUAL POWER ARCH,
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b SAR
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: NXP 32-BIT MCU, DUAL POWER ARCH,
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b SAR
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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| SPC5643LFAMLL6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
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| SPC5643LFAMLL6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
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| S32K328GHT1VPCSR |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
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