Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35482) > Сторінка 518 з 592
Фото | Назва | Виробник | Інформація |
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BAP64-05W,135 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Common Cathode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 100V Supplier Device Package: SC-70 Current - Max: 100 mA Power Dissipation (Max): 240 mW |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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BAP64-05W,135 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Common Cathode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 100V Supplier Device Package: SC-70 Current - Max: 100 mA Power Dissipation (Max): 240 mW |
на замовлення 24940 шт: термін постачання 21-31 дні (днів) |
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MC68HCP11E0FN | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
AFSC5G40E38-EVB | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: AFSC5G40E38 Frequency: 3.7GHz ~ 4GHz Type: Power Amplifier Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF7755HN/N207WK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
LPC802UKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-WLCSP (1.84x1.84) Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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LPC802M011JDH20J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVMD12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX8MM6CVTKZAAR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 486-LFBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX8MM2DVTLZAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MIMX8MM5DVTLZDA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Supplier Device Package: 486-LFBGA (14x14) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MIMX8MM3CVTKZAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MC9S08GB32ACFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 56 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08QA4CDNE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
на замовлення 3071 шт: термін постачання 21-31 дні (днів) |
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MC9S08SH4CTJ | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 17 DigiKey Programmable: Not Verified |
на замовлення 2133 шт: термін постачання 21-31 дні (днів) |
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MMA6827BKCW | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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MMA6255AKEG | NXP USA Inc. |
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X, Y Acceleration Range: ±50g Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MMA9550LR1 | NXP USA Inc. |
![]() Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 16-VFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 1.9Hz ~ 244Hz Supplier Device Package: 16-LGA (3x3) Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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A5000R2HQ1/Z016UZ | NXP USA Inc. |
Description: IC EDGE LOCK SEC AUTH 20HX2QFN Packaging: Tape & Reel (TR) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: Edge Lock Secure Authenticator Supplier Device Package: 20-HX2QFN (3x3) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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A5000R2HQ1/Z016UZ | NXP USA Inc. |
Description: IC EDGE LOCK SEC AUTH 20HX2QFN Packaging: Cut Tape (CT) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: Edge Lock Secure Authenticator Supplier Device Package: 20-HX2QFN (3x3) DigiKey Programmable: Not Verified |
на замовлення 2679 шт: термін постачання 21-31 дні (днів) |
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TLVH431ACDBZR,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±1% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 1.24V Current - Cathode: 80 µA Current - Output: 70 mA Voltage - Output (Max): 18 V |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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NX3DV42GU33Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Break-Before-Make, USB 2.0 Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: USB On-State Resistance (Max): 6.5Ohm -3db Bandwidth: 950MHz Supplier Device Package: 10-XQFN (1.4x1.8) Voltage - Supply, Single (V+): 3V ~ 4.3V Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 1 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MIMXRT1015CAF4BR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz Program Memory Size: 96KB (96K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1015CAF4AR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz Program Memory Size: 96KB (96K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MIMXRT1015DAF5B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 500MHz RAM Size: 128K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 9x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1015CAF4B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 400MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 9x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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MPF5024AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 210 шт: термін постачання 21-31 дні (днів) |
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BFU610F,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.5dB ~ 23.5dB Power - Max: 136mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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BFU610F,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.5dB ~ 23.5dB Power - Max: 136mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V Frequency - Transition: 15GHz Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP |
на замовлення 5773 шт: термін постачання 21-31 дні (днів) |
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MCF54454CVP200 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MF2DL1001DUD/02V | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D2201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D2201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D2200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D2200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH2201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH2201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH2200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH2200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D4201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D4201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D4200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D4200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH4201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH4201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH4200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH4200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D8201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D8201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D8200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D8200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH8201DUD/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH8201DUF/01V | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH8200DA6/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH8200DA4/01J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74LVC2G00GF115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: 8-XSON (1.35x1) Input Logic Level - High: 1.07V ~ 3.85V Input Logic Level - Low: 0.58V ~ 1.65V Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 4 µA |
на замовлення 570000 шт: термін постачання 21-31 дні (днів) |
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74AHC2G00GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 8-XSON (2x3) Input Logic Level - High: 1.5V ~ 3.85V Input Logic Level - Low: 0.5V ~ 1.65V Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 10 µA |
на замовлення 125658 шт: термін постачання 21-31 дні (днів) |
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NTB0101AGWH | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTB0101AGWH | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 6-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRF8S9102NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 920MHz Power - Output: 28W Gain: 23.1dB Technology: LDMOS Supplier Device Package: OM-780-2 Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 750 mA |
товару немає в наявності |
В кошику од. на суму грн. |
BAP64-05W,135 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
10000+ | 7.04 грн |
20000+ | 6.63 грн |
BAP64-05W,135 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
на замовлення 24940 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
18+ | 18.51 грн |
26+ | 12.01 грн |
30+ | 10.63 грн |
100+ | 8.55 грн |
250+ | 7.86 грн |
500+ | 7.45 грн |
1000+ | 7.00 грн |
2500+ | 6.83 грн |
MC68HCP11E0FN |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
AFSC5G40E38-EVB |
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Виробник: NXP USA Inc.
Description: AFSC5G40E38 3700-4000 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G40E38
Frequency: 3.7GHz ~ 4GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Description: AFSC5G40E38 3700-4000 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G40E38
Frequency: 3.7GHz ~ 4GHz
Type: Power Amplifier
Supplied Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
LPC802UKZ |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4000+ | 52.84 грн |
LPC802M011JDH20J |
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Виробник: NXP USA Inc.
Description: LPC802M011JDH20
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Description: LPC802M011JDH20
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2500+ | 60.53 грн |
MK22FN1M0AVMD12 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MIMX8MM6CVTKZAAR |
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Виробник: NXP USA Inc.
Description: I.MX 8M MINI QUAD
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: I.MX 8M MINI QUAD
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
MIMX8MM2DVTLZAA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 152 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2194.31 грн |
10+ | 1717.41 грн |
25+ | 1641.88 грн |
MIMX8MM5DVTLZDA |
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Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU MSCALE 845
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: MICROPROCESSORS - MPU MSCALE 845
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 152 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2616.91 грн |
10+ | 2324.27 грн |
25+ | 2219.79 грн |
152+ | 1862.61 грн |
MIMX8MM3CVTKZAA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 152 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2335.18 грн |
10+ | 1830.27 грн |
25+ | 1755.36 грн |
MC9S08GB32ACFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MC9S08QA4CDNE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 3071 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 229.41 грн |
10+ | 166.66 грн |
98+ | 138.31 грн |
196+ | 128.31 грн |
MC9S08SH4CTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 2133 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 310.71 грн |
10+ | 226.03 грн |
75+ | 191.26 грн |
150+ | 171.92 грн |
300+ | 165.68 грн |
525+ | 161.46 грн |
1050+ | 154.50 грн |
MMA6827BKCW |
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на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
65+ | 454.87 грн |
MMA6255AKEG |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
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MMA9550LR1 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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A5000R2HQ1/Z016UZ |
Виробник: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
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A5000R2HQ1/Z016UZ |
Виробник: NXP USA Inc.
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
Description: IC EDGE LOCK SEC AUTH 20HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Edge Lock Secure Authenticator
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
на замовлення 2679 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 207.68 грн |
10+ | 149.37 грн |
25+ | 136.70 грн |
100+ | 115.19 грн |
250+ | 108.95 грн |
500+ | 105.19 грн |
1000+ | 100.42 грн |
TLVH431ACDBZR,215 |
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Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Bulk
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Description: IC VREF SHUNT ADJ 1% TO236AB
Packaging: Bulk
Tolerance: ±1%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3000+ | 8.44 грн |
NX3DV42GU33Z |
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Виробник: NXP USA Inc.
Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
Description: NX3DV42GU33
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT1015CAF4BR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1000+ | 339.87 грн |
MIMXRT1015CAF4AR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
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MIMXRT1015DAF5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 593.25 грн |
10+ | 392.22 грн |
25+ | 345.90 грн |
80+ | 282.68 грн |
MIMXRT1015CAF4B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 688.24 грн |
10+ | 459.27 грн |
25+ | 406.76 грн |
80+ | 334.13 грн |
MPF5024AMMA0ES |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 210 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 516.78 грн |
10+ | 382.69 грн |
25+ | 354.05 грн |
80+ | 306.75 грн |
BFU610F,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3000+ | 17.23 грн |
BFU610F,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 5.5V 15GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.5dB ~ 23.5dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
Frequency - Transition: 15GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
на замовлення 5773 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5+ | 76.47 грн |
10+ | 46.04 грн |
100+ | 30.02 грн |
500+ | 21.71 грн |
1000+ | 19.63 грн |
MCF54454CVP200 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
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MF2DL1001DUD/02V |
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Виробник: NXP USA Inc.
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
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MF3D2201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
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MF3D2201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 MULTI APP
Packaging: Bulk
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
MF3D2200DA6/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D2200DA4/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH2201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH2201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH2200DA6/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH2200DA4/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D4201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D4201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D4200DA6/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D4200DA4/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH4201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH4201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH4200DA6/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH4200DA4/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D8201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D8201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D8200DA6/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3D8200DA4/01J |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH8201DUD/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH8201DUF/01V |
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Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 FFC
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH8200DA6/01J |
![]() |
Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MF3DH8200DA4/01J |
![]() |
Виробник: NXP USA Inc.
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MIFARE DESFIRE EV2 PLMCC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
74LVC2G00GF115 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
на замовлення 570000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1612+ | 13.99 грн |
74AHC2G00GD,125 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA
на замовлення 125658 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2049+ | 10.77 грн |
NTB0101AGWH |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
товару немає в наявності
В кошику
од. на суму грн.
NTB0101AGWH |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
товару немає в наявності
В кошику
од. на суму грн.
MRF8S9102NR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 28W
Gain: 23.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 750 mA
товару немає в наявності
В кошику
од. на суму грн.