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PMBT3904YS,115 PMBT3904YS,115 NXP USA Inc. PMBT3904YS_1.pdf Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
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PESD5V0S1BA,115 PESD5V0S1BA,115 NXP USA Inc. PESD5V0S1BA.pdf Description: TVS DIODE 5VWM 14VC SOD323
Packaging: Tape & Reel (TR)
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MCZ33903DS3EK MCZ33903DS3EK NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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74HC377N,652 74HC377N,652 NXP USA Inc. 74HC_HCT377_Rev_Aug_1997.pdf Description: IC FF D-TYPE SINGLE 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377D,653 74HC377D,653 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC2G04GXZ 74LVC2G04GXZ NXP USA Inc. 74LVC2G04.pdf Description: IC INVERTER DUAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
на замовлення 89400 шт:
термін постачання 21-31 дні (днів)
1171+17.17 грн
Мінімальне замовлення: 1171
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74LVC2G04GM,115 74LVC2G04GM,115 NXP USA Inc. 74LVC2G04.pdf Description: IC DUAL INVERTER 6XSON
Packaging: Tape & Reel (TR)
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74LVC2G04GV,125 74LVC2G04GV,125 NXP USA Inc. 74LVC2G04.pdf Description: IC DUAL INVERTER 6TSOP
Packaging: Tape & Reel (TR)
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74LVC245ADB,118 74LVC245ADB,118 NXP USA Inc. 74LVC_LVCH245A.pdf Description: IC 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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S912ZVLA12AMLFR S912ZVLA12AMLFR NXP USA Inc. 568_MC9S12ZVLRM.pdf Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA12AMLF S912ZVLA12AMLF NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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74LVC4066D,118 74LVC4066D,118 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14SOIC
Packaging: Tape & Reel (TR)
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74LV4066D,112 74LV4066D,112 NXP USA Inc. 74LV4066.pdf Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tube
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74LV4066D,118 74LV4066D,118 NXP USA Inc. 74LV4066.pdf Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tape & Reel (TR)
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74LV4066PW,112 74LV4066PW,112 NXP USA Inc. 74LV4066.pdf Description: IC SWITCH QUAD 1X2 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 4
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S912ZVM16F1MKHR S912ZVM16F1MKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVM16F1MKHR S912ZVM16F1MKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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74HC164DB,112 74HC164DB,112 NXP USA Inc. 74HC_HCT164.pdf Description: IC SR PUSH-PULL 8BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SSOP
Number of Bits per Element: 8
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74HC164D,653 74HC164D,653 NXP USA Inc. 74HC_HCT164.pdf Description: IC SHFT REG PUSH-PULL 8BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SO
Number of Bits per Element: 8
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PMBT2222A,215 PMBT2222A,215 NXP USA Inc. PMBT2222.pdf Description: TRANS NPN SW 600MA 30V SOT23
Packaging: Tape & Reel (TR)
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PMBT2222A,235 PMBT2222A,235 NXP USA Inc. PMBT2222.pdf Description: TRANS NPN 40V 600MA SOT23
Packaging: Tape & Reel (TR)
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74HCT2G14GV,125 74HCT2G14GV,125 NXP USA Inc. 74HC_HCT2G14.pdf Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
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74HC3G14GD,125 74HC3G14GD,125 NXP USA Inc. PHGLS18906-1.pdf?t.download=true&u=5oefqw Description: IC SCHMITT TRIG TRPL INV 8XSON8U
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
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74HC3G14DP,125 74HC3G14DP,125 NXP USA Inc. PHGLS18906-1.pdf?t.download=true&u=5oefqw Description: IC INV SCHMITT-TRIGGER 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
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PDTC123JT,235 PDTC123JT,235 NXP USA Inc. PDTC123J_Rev_7.pdf Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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BZX84-B12,215 BZX84-B12,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
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74HCT125N,652 74HCT125N,652 NXP USA Inc. 74HC_HCT125_Rev5.pdf Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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74HCT125PW,112 74HCT125PW,112 NXP USA Inc. 74HC_HCT125.pdf Description: IC BUFF NON-INVERT 5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
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PEMI1QFN/RR,315 PEMI1QFN/RR,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
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BTA204S-600F,118 NXP USA Inc. BTA204S-600F.pdf Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
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BTA204S-600B,118 NXP USA Inc. BTA204S-600B.pdf Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
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SPC5745CK1AVMH2 SPC5745CK1AVMH2 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
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SPC5744CFK1ACMH6 SPC5744CFK1ACMH6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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PUMH17,115 PUMH17,115 NXP USA Inc. PEMH17_PUMH17.pdf Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH13,115 PUMH13,115 NXP USA Inc. PEMH13_PUMH13.pdf Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH14,115 PUMH14,115 NXP USA Inc. PEMH14_PUMH14.pdf Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH15,115 PUMH15,115 NXP USA Inc. PEMH15.pdf Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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MCF5211LCEP66 MCF5211LCEP66 NXP USA Inc. MCF5213EC.pdf Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MFS2601AMBA0ADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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SFS5600AMBAAESR2 NXP USA Inc. Description: PMIC, DUAL CHANNEL VPRE REGULATO
Packaging: Tape & Reel (TR)
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SFS5600AMBAAES NXP USA Inc. Description: PMIC,DUAL CHANNEL VPRE REGULATOR
Packaging: Tray
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HEC4069UBT,118 HEC4069UBT,118 NXP USA Inc. HEF4069UB.pdf Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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TL431BIDBZR,215 TL431BIDBZR,215 NXP USA Inc. TL431_FAM.pdf Description: IC VREF SHUNT PREC ADJ SOT-23-3
Packaging: Tape & Reel (TR)
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BT169D,126 NXP USA Inc. BT169D.pdf Description: THYRISTOR 400V 50MA TO92-3
Packaging: Tape & Box (TB)
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MC33776ASA1AER2 MC33776ASA1AER2 NXP USA Inc. MC33777A_PB.pdf Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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SAF4000EL/103Q53CY NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MIMX9302DVVXDAC NXP USA Inc. IMX93CEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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PDTC144VE,115 PDTC144VE,115 NXP USA Inc. PDTC144V_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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FG32K144HAT0MLLT NXP USA Inc. PdfFile_890942.pdf Description: IC MCU
Packaging: Tray
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74HCT597N,652 74HCT597N,652 NXP USA Inc. 74HC%28T%29597_Rev3_2017.pdf Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
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PEMI2STD/RE,115 PEMI2STD/RE,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
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BZX384-B9V1,115 NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 9.1V 300MW SOD323
Packaging: Tape & Reel (TR)
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BC857BS,115 NXP USA Inc. Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BC846BS,115 NXP USA Inc. Description: TRANS 2NPN 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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74AVC8T245BQ,118 74AVC8T245BQ,118 NXP USA Inc. 74AVC8T245.pdf Description: IC TRANSLATON TXRX 3.6V 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-DHVQFN (5.5x3.5)
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74AVC8T245PW:112 74AVC8T245PW:112 NXP USA Inc. 74AVC8T245.pdf Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
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S912XEG128BCAL S912XEG128BCAL NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MPC8535BVJANGA MPC8535BVJANGA NXP USA Inc. MPC8535EEC.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (1)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJANGA MPC8536EBVJANGA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC866PZP100A MPC866PZP100A NXP USA Inc. MPC866%2C859_Man.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PMBT3904YS,115 PMBT3904YS_1.pdf
PMBT3904YS,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
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PESD5V0S1BA,115 PESD5V0S1BA.pdf
PESD5V0S1BA,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 14VC SOD323
Packaging: Tape & Reel (TR)
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MCZ33903DS3EK MC33903-MC33904-MC33905.pdf
MCZ33903DS3EK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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74HC377N,652 74HC_HCT377_Rev_Aug_1997.pdf
74HC377N,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377D,653 74HC_HCT377.pdf
74HC377D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC2G04GXZ 74LVC2G04.pdf
74LVC2G04GXZ
Виробник: NXP USA Inc.
Description: IC INVERTER DUAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
на замовлення 89400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1171+17.17 грн
Мінімальне замовлення: 1171
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74LVC2G04GM,115 74LVC2G04.pdf
74LVC2G04GM,115
Виробник: NXP USA Inc.
Description: IC DUAL INVERTER 6XSON
Packaging: Tape & Reel (TR)
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74LVC2G04GV,125 74LVC2G04.pdf
74LVC2G04GV,125
Виробник: NXP USA Inc.
Description: IC DUAL INVERTER 6TSOP
Packaging: Tape & Reel (TR)
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74LVC245ADB,118 74LVC_LVCH245A.pdf
74LVC245ADB,118
Виробник: NXP USA Inc.
Description: IC 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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S912ZVLA12AMLFR 568_MC9S12ZVLRM.pdf
S912ZVLA12AMLFR
Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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S912ZVLA12AMLF MC9S12ZVLRM.pdf
S912ZVLA12AMLF
Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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74LVC4066D,118 74LVC4066.pdf
74LVC4066D,118
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14SOIC
Packaging: Tape & Reel (TR)
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74LV4066D,112 74LV4066.pdf
74LV4066D,112
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tube
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74LV4066D,118 74LV4066.pdf
74LV4066D,118
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tape & Reel (TR)
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74LV4066PW,112 74LV4066.pdf
74LV4066PW,112
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 4
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S912ZVM16F1MKHR S12ZVMFS.pdf
S912ZVM16F1MKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVM16F1MKHR S12ZVMFS.pdf
S912ZVM16F1MKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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74HC164DB,112 74HC_HCT164.pdf
74HC164DB,112
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SSOP
Number of Bits per Element: 8
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74HC164D,653 74HC_HCT164.pdf
74HC164D,653
Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SO
Number of Bits per Element: 8
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PMBT2222A,215 PMBT2222.pdf
PMBT2222A,215
Виробник: NXP USA Inc.
Description: TRANS NPN SW 600MA 30V SOT23
Packaging: Tape & Reel (TR)
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PMBT2222A,235 PMBT2222.pdf
PMBT2222A,235
Виробник: NXP USA Inc.
Description: TRANS NPN 40V 600MA SOT23
Packaging: Tape & Reel (TR)
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74HCT2G14GV,125 74HC_HCT2G14.pdf
74HCT2G14GV,125
Виробник: NXP USA Inc.
Description: IC SCHMITT TRIG DL INV 6TSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
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74HC3G14GD,125 PHGLS18906-1.pdf?t.download=true&u=5oefqw
74HC3G14GD,125
Виробник: NXP USA Inc.
Description: IC SCHMITT TRIG TRPL INV 8XSON8U
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
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74HC3G14DP,125 PHGLS18906-1.pdf?t.download=true&u=5oefqw
74HC3G14DP,125
Виробник: NXP USA Inc.
Description: IC INV SCHMITT-TRIGGER 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
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PDTC123JT,235 PDTC123J_Rev_7.pdf
PDTC123JT,235
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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BZX84-B12,215 BZX84_Series.pdf
BZX84-B12,215
Виробник: NXP USA Inc.
Description: DIODE ZENER 12V 250MW TO236AB
Packaging: Tape & Reel (TR)
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74HCT125N,652 74HC_HCT125_Rev5.pdf
74HCT125N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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74HCT125PW,112 74HC_HCT125.pdf
74HCT125PW,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
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PEMI1QFN/RR,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RR,315
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1
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BTA204S-600F,118 BTA204S-600F.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
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BTA204S-600B,118 BTA204S-600B.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
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SPC5745CK1AVMH2 MPC5746C-Datasheet.pdf
SPC5745CK1AVMH2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100
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SPC5744CFK1ACMH6 MPC5746C-Datasheet.pdf
SPC5744CFK1ACMH6
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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PUMH17,115 PEMH17_PUMH17.pdf
PUMH17,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH13,115 PEMH13_PUMH13.pdf
PUMH13,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH14,115 PEMH14_PUMH14.pdf
PUMH14,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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PUMH15,115 PEMH15.pdf
PUMH15,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W 6TSSOP
Packaging: Tape & Reel (TR)
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MCF5211LCEP66 MCF5213EC.pdf
MCF5211LCEP66
Виробник: NXP USA Inc.
Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MFS2601AMBA0ADR2
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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SFS5600AMBAAESR2
Виробник: NXP USA Inc.
Description: PMIC, DUAL CHANNEL VPRE REGULATO
Packaging: Tape & Reel (TR)
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SFS5600AMBAAES
Виробник: NXP USA Inc.
Description: PMIC,DUAL CHANNEL VPRE REGULATOR
Packaging: Tray
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HEC4069UBT,118 HEF4069UB.pdf
HEC4069UBT,118
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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TL431BIDBZR,215 TL431_FAM.pdf
TL431BIDBZR,215
Виробник: NXP USA Inc.
Description: IC VREF SHUNT PREC ADJ SOT-23-3
Packaging: Tape & Reel (TR)
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BT169D,126 BT169D.pdf
Виробник: NXP USA Inc.
Description: THYRISTOR 400V 50MA TO92-3
Packaging: Tape & Box (TB)
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MC33776ASA1AER2 MC33777A_PB.pdf
MC33776ASA1AER2
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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SAF4000EL/103Q53CY
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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MIMX9302DVVXDAC IMX93CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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PDTC144VE,115 PDTC144V_SER.pdf
PDTC144VE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
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FG32K144HAT0MLLT PdfFile_890942.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
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74HCT597N,652 74HC%28T%29597_Rev3_2017.pdf
74HCT597N,652
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
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PEMI2STD/RE,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/RE,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
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BZX384-B9V1,115 BZX384_SER.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 300MW SOD323
Packaging: Tape & Reel (TR)
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BC857BS,115
Виробник: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BC846BS,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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74AVC8T245BQ,118 74AVC8T245.pdf
74AVC8T245BQ,118
Виробник: NXP USA Inc.
Description: IC TRANSLATON TXRX 3.6V 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-DHVQFN (5.5x3.5)
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74AVC8T245PW:112 74AVC8T245.pdf
74AVC8T245PW:112
Виробник: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
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S912XEG128BCAL MC9S12XEP100RMV1.pdf
S912XEG128BCAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MPC8535BVJANGA MPC8535EEC.pdf
MPC8535BVJANGA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (1)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJANGA MPC8536E.pdf
MPC8536EBVJANGA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC866PZP100A MPC866%2C859_Man.pdf
MPC866PZP100A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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