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BZV55-C22,115 BZV55-C22,115 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 22V 500MW LLDS
Packaging: Tape & Reel (TR)
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BT137-800,127 NXP USA Inc. bt137-800.pdf Description: TRIAC 800V 8A TO220AB
Packaging: Tube
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BT137X-800,127 NXP USA Inc. bt137x-800.pdf Description: TRIAC 800V 8A SOT186A
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 65A, 71A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 8 A
Voltage - Off State: 800 V
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BT137-800E,127 NXP USA Inc. bt137-800e.pdf Description: TRIAC SENS GATE 800V 8A TO220AB
Packaging: Tube
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FS32K146HRT0CLHT FS32K146HRT0CLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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IW610FHN/A1ZDIK IW610FHN/A1ZDIK NXP USA Inc. IW610.pdf Description: IC
Packaging: Tray
Package / Case: 81-VFQFN Dual Rows, Exposed Pad
Sensitivity: -105.7dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 3.14V ~ 3.46V
Power - Output: 22dBm
Protocol: 802.11ax, Bluetooth v5.4
Current - Receiving: 21mA ~ 79mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24mA ~ 82mA
Supplier Device Package: 81-HVQFN (8x7.5)
GPIO: 23
Modulation: QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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PDTC143EU,115 PDTC143EU,115 NXP USA Inc. PDTA143E_SERIES_7.pdf Description: TRANS PREBIAS NPN 200MW SOT323
Packaging: Tape & Reel (TR)
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PDTC143EM,315 PDTC143EM,315 NXP USA Inc. PDTA143E_SERIES_7.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Tape & Reel (TR)
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PMBT3904M,315 PMBT3904M,315 NXP USA Inc. PMBT3904M.pdf Description: TRANS NPN SW 40V 200MA SOT883
Packaging: Tape & Reel (TR)
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PMBT3904YS,115 PMBT3904YS,115 NXP USA Inc. PMBT3904YS_1.pdf Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
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SPC5645CCF0VLU8R SPC5645CCF0VLU8R NXP USA Inc. PdfFile_217377.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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MCXA255VPN NXP USA Inc. MCXAFS.pdf Description: MCXA20 169BGA
Packaging: Tray
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74HC541PW,118 74HC541PW,118 NXP USA Inc. 74HC_HCT541.pdf Description: IC BUFFER NON-INVERT 6V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-TSSOP
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P5010NSN1TNB P5010NSN1TNB NXP USA Inc. P5_FS.pdf Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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HEF40106BT,653 HEF40106BT,653 NXP USA Inc. HEF40106B.pdf Description: IC SCHMITT TRIGGER HEX 14SOIC
Packaging: Tape & Reel (TR)
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HEF40106BT,652 HEF40106BT,652 NXP USA Inc. HEF40106B.pdf Description: IC SCHMITT TRIGGER HEX 14SOIC
Packaging: Tube
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HEF40106BTT,118 HEF40106BTT,118 NXP USA Inc. HEF40106B.pdf Description: IC HEX INVRTR SCHMTT TRGR14TSSOP
Packaging: Tape & Reel (TR)
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BZV55-B12,115 BZV55-B12,115 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 12V 500MW LLDS
Packaging: Tape & Reel (TR)
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74HCT138PW,112 74HCT138PW,112 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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74HCT32PW,118 74HCT32PW,118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HCT32PW,112 74HCT32PW,112 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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PMLL4148L,115 PMLL4148L,115 NXP USA Inc. PMLL4148L_PMLL4448.pdf Description: DIODE SWITCHING 75V 0.2A LLDS
Packaging: Tape & Reel (TR)
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PMLL4148L,135 PMLL4148L,135 NXP USA Inc. PMLL4148L_PMLL4448.pdf Description: DIODE SWITCHING 75V 0.2A LLDS
Packaging: Tape & Reel (TR)
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74HC11N,652 74HC11N,652 NXP USA Inc. 74HC_HCT11_Rev4.pdf Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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BZX84-C51,215 BZX84-C51,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 51V 250MW TO236AB
Packaging: Tape & Reel (TR)
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PEMI6QFN/WT,132 PEMI6QFN/WT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
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BAT54S,215 BAT54S,215 NXP USA Inc. BAT54.pdf description Description: DIODE SCHOTTKY 30V 200MA TO236AB
Packaging: Tape & Reel (TR)
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BZX384-C15,115 NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 14.7V 300MW SOD323
Packaging: Tape & Reel (TR)
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HEF4001BT,653 HEF4001BT,653 NXP USA Inc. HEF4001B.pdf Description: IC QUAD 2-IN NOR GATE 14SOIC
Packaging: Tape & Reel (TR)
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N74F540N,602 N74F540N,602 NXP USA Inc. N74F540%2C541.pdf Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74ABT640N,602 74ABT640N,602 NXP USA Inc. 74ABT640D.pdf Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
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N74F240N,602 N74F240N,602 NXP USA Inc. 74F240.pdf Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74HC4538D,652 74HC4538D,652 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
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74HC4538D,653 74HC4538D,653 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
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74HC4538PW,118 74HC4538PW,118 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538PW,112 74HC4538PW,112 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538DB,118 74HC4538DB,118 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538DB,112 74HC4538DB,112 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538N,652 74HC4538N,652 NXP USA Inc. 74HC4538.pdf Description: IC MMV 2-CIR 25-NS 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
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PBHV8540T,215 PBHV8540T,215 NXP USA Inc. PBHV8540T.pdf Description: TRANS NPN 400V 500MA SOT23
Packaging: Tape & Reel (TR)
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PBLS1501Y,115 PBLS1501Y,115 NXP USA Inc. PBLS1501Y_PBLS1501V.pdf Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PBLS1504Y,115 PBLS1504Y,115 NXP USA Inc. PBLS1504Y_PBLS1504V.pdf Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PBLS1503Y,115 PBLS1503Y,115 NXP USA Inc. PBLS1503Y_PBLS1503V.pdf Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PESD5V0L5UV,115 PESD5V0L5UV,115 NXP USA Inc. PESDXL5UF_V_Y.pdf Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Tape & Reel (TR)
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74HC688D,652 74HC688D,652 NXP USA Inc. 74HC688.pdf Description: IC ID COMPARATOR 8BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HC688PW,112 74HC688PW,112 NXP USA Inc. 74HC688.pdf Description: IC ID COMPARATOR 8BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HC688DB,112 74HC688DB,112 NXP USA Inc. 74HC688.pdf Description: IC ID COMPARATOR 8BIT 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HCT688N,652 74HCT688N,652 NXP USA Inc. 74HC%28T%29688_Rev_Feb2017.pdf Description: IC ID COMPARATOR 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
Output Function: A=B
Number of Bits: 8
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74AHC125PW,118 74AHC125PW,118 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF DVR TRI-ST QD 14TSSOP
Packaging: Tape & Reel (TR)
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74AHC125PW,112 74AHC125PW,112 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF DVR TRI-ST QD 14TSSOP
Packaging: Tube
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74AHC125BQ,115 74AHC125BQ,115 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF DVR TRI-ST QD 14DHVQFN
Packaging: Tape & Reel (TR)
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74HCT126D,653 74HCT126D,653 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SO
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74HCT126D,652 74HCT126D,652 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SO
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74HCT126PW,118 74HCT126PW,118 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFF NON-INVERT 5.5V 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
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74HCT126DB,112 74HCT126DB,112 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFF NON-INVERT 5.5V 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SSOP
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LPC1114FA44/301,52 LPC1114FA44/301,52 NXP USA Inc. LPC1111-14.pdf Description: IC MCU 32BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
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74HC86N,652 74HC86N,652 NXP USA Inc. 74HC_HCT86.pdf Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC73D,653 74HC73D,653 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73D,652 74HC73D,652 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,118 74HC73PW,118 NXP USA Inc. 74HC73.pdf Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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BZV55-C22,115 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C22,115
Виробник: NXP USA Inc.
Description: DIODE ZENER 22V 500MW LLDS
Packaging: Tape & Reel (TR)
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BT137-800,127 bt137-800.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 8A TO220AB
Packaging: Tube
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BT137X-800,127 bt137x-800.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 8A SOT186A
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 65A, 71A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 8 A
Voltage - Off State: 800 V
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BT137-800E,127 bt137-800e.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 800V 8A TO220AB
Packaging: Tube
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FS32K146HRT0CLHT S32K1xx.pdf
FS32K146HRT0CLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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IW610FHN/A1ZDIK IW610.pdf
IW610FHN/A1ZDIK
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 81-VFQFN Dual Rows, Exposed Pad
Sensitivity: -105.7dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 3.14V ~ 3.46V
Power - Output: 22dBm
Protocol: 802.11ax, Bluetooth v5.4
Current - Receiving: 21mA ~ 79mA
Data Rate (Max): 2Mbps
Current - Transmitting: 24mA ~ 82mA
Supplier Device Package: 81-HVQFN (8x7.5)
GPIO: 23
Modulation: QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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PDTC143EU,115 PDTA143E_SERIES_7.pdf
PDTC143EU,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 200MW SOT323
Packaging: Tape & Reel (TR)
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PDTC143EM,315 PDTA143E_SERIES_7.pdf
PDTC143EM,315
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Tape & Reel (TR)
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PMBT3904M,315 PMBT3904M.pdf
PMBT3904M,315
Виробник: NXP USA Inc.
Description: TRANS NPN SW 40V 200MA SOT883
Packaging: Tape & Reel (TR)
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PMBT3904YS,115 PMBT3904YS_1.pdf
PMBT3904YS,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)
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SPC5645CCF0VLU8R PdfFile_217377.pdf
SPC5645CCF0VLU8R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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MCXA255VPN MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20 169BGA
Packaging: Tray
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74HC541PW,118 74HC_HCT541.pdf
74HC541PW,118
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-TSSOP
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P5010NSN1TNB P5_FS.pdf
P5010NSN1TNB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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HEF40106BT,653 HEF40106B.pdf
HEF40106BT,653
Виробник: NXP USA Inc.
Description: IC SCHMITT TRIGGER HEX 14SOIC
Packaging: Tape & Reel (TR)
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HEF40106BT,652 HEF40106B.pdf
HEF40106BT,652
Виробник: NXP USA Inc.
Description: IC SCHMITT TRIGGER HEX 14SOIC
Packaging: Tube
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HEF40106BTT,118 HEF40106B.pdf
HEF40106BTT,118
Виробник: NXP USA Inc.
Description: IC HEX INVRTR SCHMTT TRGR14TSSOP
Packaging: Tape & Reel (TR)
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BZV55-B12,115 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-B12,115
Виробник: NXP USA Inc.
Description: DIODE ZENER 12V 500MW LLDS
Packaging: Tape & Reel (TR)
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74HCT138PW,112 74HC_HCT138.pdf
74HCT138PW,112
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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74HCT32PW,118 74HC_HCT32.pdf
74HCT32PW,118
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HCT32PW,112 74HC_HCT32.pdf
74HCT32PW,112
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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PMLL4148L,115 PMLL4148L_PMLL4448.pdf
PMLL4148L,115
Виробник: NXP USA Inc.
Description: DIODE SWITCHING 75V 0.2A LLDS
Packaging: Tape & Reel (TR)
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PMLL4148L,135 PMLL4148L_PMLL4448.pdf
PMLL4148L,135
Виробник: NXP USA Inc.
Description: DIODE SWITCHING 75V 0.2A LLDS
Packaging: Tape & Reel (TR)
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74HC11N,652 74HC_HCT11_Rev4.pdf
74HC11N,652
Виробник: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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BZX84-C51,215 BZX84_Series.pdf
BZX84-C51,215
Виробник: NXP USA Inc.
Description: DIODE ZENER 51V 250MW TO236AB
Packaging: Tape & Reel (TR)
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PEMI6QFN/WT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/WT,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
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BAT54S,215 description BAT54.pdf
BAT54S,215
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA TO236AB
Packaging: Tape & Reel (TR)
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BZX384-C15,115 BZX384_SER.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 14.7V 300MW SOD323
Packaging: Tape & Reel (TR)
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HEF4001BT,653 HEF4001B.pdf
HEF4001BT,653
Виробник: NXP USA Inc.
Description: IC QUAD 2-IN NOR GATE 14SOIC
Packaging: Tape & Reel (TR)
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N74F540N,602 N74F540%2C541.pdf
N74F540N,602
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74ABT640N,602 74ABT640D.pdf
74ABT640N,602
Виробник: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
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N74F240N,602 74F240.pdf
N74F240N,602
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74HC4538D,652 74HC4538.pdf
74HC4538D,652
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
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74HC4538D,653 74HC4538.pdf
74HC4538D,653
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
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74HC4538PW,118 74HC4538.pdf
74HC4538PW,118
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538PW,112 74HC4538.pdf
74HC4538PW,112
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538DB,118 74HC4538.pdf
74HC4538DB,118
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538DB,112 74HC4538.pdf
74HC4538DB,112
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
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74HC4538N,652 74HC4538.pdf
74HC4538N,652
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 25-NS 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
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PBHV8540T,215 PBHV8540T.pdf
PBHV8540T,215
Виробник: NXP USA Inc.
Description: TRANS NPN 400V 500MA SOT23
Packaging: Tape & Reel (TR)
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PBLS1501Y,115 PBLS1501Y_PBLS1501V.pdf
PBLS1501Y,115
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PBLS1504Y,115 PBLS1504Y_PBLS1504V.pdf
PBLS1504Y,115
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PBLS1503Y,115 PBLS1503Y_PBLS1503V.pdf
PBLS1503Y,115
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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PESD5V0L5UV,115 PESDXL5UF_V_Y.pdf
PESD5V0L5UV,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Tape & Reel (TR)
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74HC688D,652 74HC688.pdf
74HC688D,652
Виробник: NXP USA Inc.
Description: IC ID COMPARATOR 8BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HC688PW,112 74HC688.pdf
74HC688PW,112
Виробник: NXP USA Inc.
Description: IC ID COMPARATOR 8BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HC688DB,112 74HC688.pdf
74HC688DB,112
Виробник: NXP USA Inc.
Description: IC ID COMPARATOR 8BIT 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
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74HCT688N,652 74HC%28T%29688_Rev_Feb2017.pdf
74HCT688N,652
Виробник: NXP USA Inc.
Description: IC ID COMPARATOR 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
Output Function: A=B
Number of Bits: 8
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74AHC125PW,118 74AHC_AHCT125.pdf
74AHC125PW,118
Виробник: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14TSSOP
Packaging: Tape & Reel (TR)
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74AHC125PW,112 74AHC_AHCT125.pdf
74AHC125PW,112
Виробник: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14TSSOP
Packaging: Tube
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74AHC125BQ,115 74AHC_AHCT125.pdf
74AHC125BQ,115
Виробник: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14DHVQFN
Packaging: Tape & Reel (TR)
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74HCT126D,653 74HC%28T%29126.pdf
74HCT126D,653
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SO
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74HCT126D,652 74HC%28T%29126.pdf
74HCT126D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SO
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74HCT126PW,118 74HC%28T%29126.pdf
74HCT126PW,118
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-TSSOP
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74HCT126DB,112 74HC%28T%29126.pdf
74HCT126DB,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-SSOP
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LPC1114FA44/301,52 LPC1111-14.pdf
LPC1114FA44/301,52
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
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74HC86N,652 74HC_HCT86.pdf
74HC86N,652
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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74HC73D,653 74HC73.pdf
74HC73D,653
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73D,652 74HC73.pdf
74HC73D,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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74HC73PW,118 74HC73.pdf
74HC73PW,118
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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