| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 514-83-144-12-000117 | Preci-Dip |
 Description: CONN SOCKET PGA 144POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 34 шт В кошику од. на суму грн. | |
| 514-83-145-15-081117 | Preci-Dip |
Description: CONN SOCKET PGA 145POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 42 шт В кошику од. на суму грн. | |
| 514-83-175-16-071117 | Preci-Dip |
Description: CONN SOCKET PGA 175POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 175 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 312 шт В кошику од. на суму грн. | |
| 514-83-192M16-001148 | Preci-Dip |
Description: CONN SOCKET BGA 192POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 192 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |
| 514-83-223-18-091117 | Preci-Dip |
Description: CONN SOCKET PGA 223POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |
| 514-83-255M16-001148 | Preci-Dip |
Description: CONN SOCKET BGA 255POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 255 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |
| 514-83-256M16-000148 | Preci-Dip |
Description: CONN SOCKET BGA 256POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |
| 514-83-256M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 256POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 684 шт В кошику од. на суму грн. | |
| 514-83-257-20-111117 | Preci-Dip |
Description: CONN SOCKET PGA 257POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 257 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | |
| 514-83-272M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 272POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
| 514-83-279-19-081117 | Preci-Dip |
Description: CONN SOCKET PGA 279POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 279 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |
| 514-83-281-19-081117 | Preci-Dip |
Description: CONN SOCKET PGA 281POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 281 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |
| 514-83-292M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 292POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
| 514-83-299-20-001117 | Preci-Dip |
Description: CONN SOCKET PGA 299POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 299 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 20 шт В кошику од. на суму грн. | |
| 514-83-321-19-121154 | Preci-Dip |
Description: CONN SOCKET PGA 321POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 321 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 20 шт В кошику од. на суму грн. | |
| 514-83-352M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 352POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 352 (26 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-83-356M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 356POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 356 (26 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-83-357M19-001148 | Preci-Dip |
Description: CONN SOCKET BGA 357POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 357 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 756 шт В кошику од. на суму грн. | |
| 514-83-360M19-001148 | Preci-Dip |
Description: CONN SOCKET BGA 360POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 360 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 756 шт В кошику од. на суму грн. | |
| 514-83-388M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 388POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 15 шт В кошику од. на суму грн. | |
| 514-83-400M20-000148 | Preci-Dip |
Description: CONN SOCKET BGA 400POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
| 514-83-419-19-001154 | Preci-Dip |
Description: CONN SOCKET PGA 419POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 419 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | |
| 514-83-420M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 420POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 15 шт В кошику од. на суму грн. | |
| 514-83-432M31-001148 | Preci-Dip |
Description: CONN SOCKET BGA 432POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 312 шт В кошику од. на суму грн. | |
| 514-83-456M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 456POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 15 шт В кошику од. на суму грн. | |
| 514-83-478M26-131148 | Preci-Dip |
Description: CONN SOCKET BGA 478POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 478 (26 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-83-480M29-001148 | Preci-Dip |
Description: CONN SOCKET BGA 480POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 480 (29 x 29) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 351 шт В кошику од. на суму грн. | |
| 514-83-500M30-001148 | Preci-Dip |
Description: CONN SOCKET BGA 500POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 500 (30 x 30) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 13 шт В кошику од. на суму грн. | |
| 514-83-504M29-001148 | Preci-Dip |
Description: CONN SOCKET BGA 504POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 504 (29 x 29) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 351 шт В кошику од. на суму грн. | |
| 514-83-520M31-001148 | Preci-Dip |
Description: CONN SOCKET BGA 520POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 13 шт В кошику од. на суму грн. | |
| 514-83-560M33-001148 | Preci-Dip |
Description: CONN SOCKET BGA 560POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 560 (33 x 33) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 12 шт В кошику од. на суму грн. | |
| 514-83-576M30-001148 | Preci-Dip |
Description: CONN SOCKET BGA 576POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 576 (30 x 30) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 351 шт В кошику од. на суму грн. | |
| 514-83-600M35-001148 | Preci-Dip |
Description: CONN SOCKET BGA 600POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 600 (35 x 35) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 11 шт В кошику од. на суму грн. | |
| 514-83-652M35-001148 | Preci-Dip |
Description: CONN SOCKET BGA 652POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 652 (35 x 35) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 264 шт В кошику од. на суму грн. | |
| 514-87-068-10-001117 | Preci-Dip |
Description: CONN SOCKET PGA 68POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | |
| 514-87-068-10-061117 | Preci-Dip |
Description: CONN SOCKET PGA 68POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | |
| 514-87-078-13-061117 | Preci-Dip |
Description: CONN SOCKET PGA 78POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 78 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. | |
| 514-87-120-13-061117 | Preci-Dip |
Description: CONN SOCKET PGA 120POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 120 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 48 шт В кошику од. на суму грн. | |
| 514-87-127-16-091117 | Preci-Dip |
Description: CONN SOCKET PGA 127POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 127 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 52 шт В кошику од. на суму грн. | |
| 514-87-144-12-000117 | Preci-Dip |
Description: CONN SOCKET PGA 144POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 51 шт В кошику од. на суму грн. | |
| 514-87-145-15-081117 | Preci-Dip |
Description: CONN SOCKET PGA 145POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 42 шт В кошику од. на суму грн. | |
| 514-87-175-16-071117 | Preci-Dip |
Description: CONN SOCKET PGA 175POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 312 шт В кошику од. на суму грн. | |
| 514-87-192M16-001148 | Preci-Dip |
Description: CONN SOCKET BGA 192POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 192 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |
| 514-87-223-18-091117 | Preci-Dip |
Description: CONN SOCKET PGA 223POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 223 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 264 шт В кошику од. на суму грн. | |
| 514-87-255M16-001148 | Preci-Dip |
Description: CONN SOCKET BGA 255POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 255 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 24 шт В кошику од. на суму грн. | |
| 514-87-256M16-000148 | Preci-Dip |
Description: CONN SOCKET BGA 256POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |
| 514-87-256M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 256POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 684 шт В кошику од. на суму грн. | |
| 514-87-257-20-111117 | Preci-Dip |
Description: CONN SOCKET PGA 257POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 257 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | |
| 514-87-272M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 272POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
| 514-87-279-19-081117 | Preci-Dip |
Description: CONN SOCKET PGA 279POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 279 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |
| 514-87-281-19-081117 | Preci-Dip |
Description: CONN SOCKET PGA 281POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 281 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |
| 514-87-292M20-001148 | Preci-Dip |
Description: CONN SOCKET BGA 292POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 292 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
| 514-87-299-20-001117 | Preci-Dip |
Description: CONN SOCKET PGA 299POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 299 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | |
| 514-87-321-19-121154 | Preci-Dip |
Description: CONN SOCKET PGA 321POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 321 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 20 шт В кошику од. на суму грн. | |
| 514-87-352M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 352POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-87-356M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 356POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 356 (26 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-87-357M19-001148 | Preci-Dip |
Description: CONN SOCKET BGA 357POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 357 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 756 шт В кошику од. на суму грн. | |
| 514-87-360M19-001148 | Preci-Dip |
Description: CONN SOCKET BGA 360POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 756 шт В кошику од. на суму грн. | |
| 514-87-388M26-001148 | Preci-Dip |
Description: CONN SOCKET BGA 388POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 388 (26 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 405 шт В кошику од. на суму грн. | |
| 514-87-400M20-000148 | Preci-Dip |
Description: CONN SOCKET BGA 400POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 400 (20 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 684 шт В кошику од. на суму грн. |
| 514-83-144-12-000117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 144POS GOLD
Description: CONN SOCKET PGA 144POS GOLD
товару немає в наявності
Мінімальне замовлення: 34 шт
В кошику
од. на суму грн.
| 514-83-145-15-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 42 шт
В кошику
од. на суму грн.
| 514-83-175-16-071117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 175POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 175 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 175POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 175 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 312 шт
В кошику
од. на суму грн.
| 514-83-192M16-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 192POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 192POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 514-83-223-18-091117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 223POS GOLD
Description: CONN SOCKET PGA 223POS GOLD
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 514-83-255M16-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 255POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 255POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 514-83-256M16-000148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 514-83-256M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 684 шт
В кошику
од. на суму грн.
| 514-83-257-20-111117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 257POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 257 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 257POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 257 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| 514-83-272M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 272POS GOLD
Description: CONN SOCKET BGA 272POS GOLD
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| 514-83-279-19-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 279POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 279POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 514-83-281-19-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 281POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 281 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 281POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 281 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 514-83-292M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 292POS GOLD
Description: CONN SOCKET BGA 292POS GOLD
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| 514-83-299-20-001117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 299POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 299POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 20 шт
В кошику
од. на суму грн.
| 514-83-321-19-121154 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 321POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 321POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 20 шт
В кошику
од. на суму грн.
| 514-83-352M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 352POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 352POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-83-356M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 356POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 356POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-83-357M19-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 357POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 357POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 756 шт
В кошику
од. на суму грн.
| 514-83-360M19-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 360POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 360POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 756 шт
В кошику
од. на суму грн.
| 514-83-388M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 388POS GOLD
Description: CONN SOCKET BGA 388POS GOLD
товару немає в наявності
Мінімальне замовлення: 15 шт
В кошику
од. на суму грн.
| 514-83-400M20-000148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 400POS GOLD
Description: CONN SOCKET BGA 400POS GOLD
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| 514-83-419-19-001154 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 419POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 419 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 419POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 419 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| 514-83-420M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 420POS GOLD
Description: CONN SOCKET BGA 420POS GOLD
товару немає в наявності
Мінімальне замовлення: 15 шт
В кошику
од. на суму грн.
| 514-83-432M31-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 432POS GOLD
Description: CONN SOCKET BGA 432POS GOLD
товару немає в наявності
Мінімальне замовлення: 312 шт
В кошику
од. на суму грн.
| 514-83-456M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 456POS GOLD
Description: CONN SOCKET BGA 456POS GOLD
товару немає в наявності
Мінімальне замовлення: 15 шт
В кошику
од. на суму грн.
| 514-83-478M26-131148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 478POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 478POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-83-480M29-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 480POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 480POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 351 шт
В кошику
од. на суму грн.
| 514-83-500M30-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 500POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 500POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 13 шт
В кошику
од. на суму грн.
| 514-83-504M29-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 504POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 504POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 351 шт
В кошику
од. на суму грн.
| 514-83-520M31-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 520POS GOLD
Description: CONN SOCKET BGA 520POS GOLD
товару немає в наявності
Мінімальне замовлення: 13 шт
В кошику
од. на суму грн.
| 514-83-560M33-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 560POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 560POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 12 шт
В кошику
од. на суму грн.
| 514-83-576M30-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 576POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 576 (30 x 30)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 576POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 576 (30 x 30)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 351 шт
В кошику
од. на суму грн.
| 514-83-600M35-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 600POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 600POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 11 шт
В кошику
од. на суму грн.
| 514-83-652M35-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 652POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 652POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 264 шт
В кошику
од. на суму грн.
| 514-87-068-10-001117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 68POS GOLD
Description: CONN SOCKET PGA 68POS GOLD
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| 514-87-068-10-061117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 68POS GOLD
Description: CONN SOCKET PGA 68POS GOLD
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| 514-87-078-13-061117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 78POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 78 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 78POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 78 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 514-87-120-13-061117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 120POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 120 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 120POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 120 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 48 шт
В кошику
од. на суму грн.
| 514-87-127-16-091117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 127POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 127 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 127POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 127 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 52 шт
В кошику
од. на суму грн.
| 514-87-144-12-000117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 144POS GOLD
Description: CONN SOCKET PGA 144POS GOLD
товару немає в наявності
Мінімальне замовлення: 51 шт
В кошику
од. на суму грн.
| 514-87-145-15-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 42 шт
В кошику
од. на суму грн.
| 514-87-175-16-071117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 175POS GOLD
Description: CONN SOCKET PGA 175POS GOLD
товару немає в наявності
Мінімальне замовлення: 312 шт
В кошику
од. на суму грн.
| 514-87-192M16-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 192POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 192POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 514-87-223-18-091117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 223POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 223 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 223POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 223 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 264 шт
В кошику
од. на суму грн.
| 514-87-255M16-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 255POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 255POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 24 шт
В кошику
од. на суму грн.
| 514-87-256M16-000148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 514-87-256M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 256POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 684 шт
В кошику
од. на суму грн.
| 514-87-257-20-111117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 257POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 257 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 257POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 257 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| 514-87-272M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 272POS GOLD
Description: CONN SOCKET BGA 272POS GOLD
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| 514-87-279-19-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 279POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 279POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 514-87-281-19-081117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 281POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 281 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 281POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 281 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 514-87-292M20-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 292POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 292POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| 514-87-299-20-001117 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 299POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 299POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| 514-87-321-19-121154 |
|
Виробник: Preci-Dip
Description: CONN SOCKET PGA 321POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 321POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 20 шт
В кошику
од. на суму грн.
| 514-87-352M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 352POS GOLD
Description: CONN SOCKET BGA 352POS GOLD
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-87-356M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 356POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 356POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-87-357M19-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 357POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET BGA 357POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 756 шт
В кошику
од. на суму грн.
| 514-87-360M19-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 360POS GOLD
Description: CONN SOCKET BGA 360POS GOLD
товару немає в наявності
Мінімальне замовлення: 756 шт
В кошику
од. на суму грн.
| 514-87-388M26-001148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 388POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 388 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 388POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 388 (26 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 405 шт
В кошику
од. на суму грн.
| 514-87-400M20-000148 |
|
Виробник: Preci-Dip
Description: CONN SOCKET BGA 400POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET BGA 400POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 684 шт
В кошику
од. на суму грн.