1-1825094-3 TE Connectivity
на замовлення 2868 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 34+ | 70.97 грн |
| 350+ | 65.21 грн |
| 650+ | 64.51 грн |
| 1300+ | 63.13 грн |
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Технічний опис 1-1825094-3 TE Connectivity
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 1-1825094-3
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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1-1825094-3 | Виробник : TE Connectivity |
 Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube |
товар відсутній |
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1-1825094-3 | Виробник : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
товар відсутній |