147413-3 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP Connectors
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 30VAC
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6.35mm, 8.13mm, 9.91mm
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.187" (4.75mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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Технічний опис 147413-3 TE Connectivity AMP Connectors
Description: CONN RCPT 20POS 0.05 GOLD SMD, Features: Board Lock, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 30VAC, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -65°C ~ 105°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6.35mm, 8.13mm, 9.91mm, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin-Lead, Insulation Height: 0.187" (4.75mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції 147413-3
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
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147413-3 | TE Connectivity AMP Connectors |
Description: CONN RCPT 20POS 0.05 GOLD SMDFeatures: Board Lock, Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 30VAC Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -65°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6.35mm, 8.13mm, 9.91mm Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Insulation Height: 0.187" (4.75mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. |
|
147413-3 | TE Connectivity |
Board to Board & Mezzanine Connectors 20 50/50 GRID RCPT VC W/O HD |
товару немає в наявності |
Мінімальне замовлення: 2400 шт В кошику од. на суму грн. |
|
147413-3 | TE Connectivity |
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R |
товару немає в наявності |
Мінімальне замовлення: 2400 шт В кошику од. на суму грн. |
|
147413-3 | TE Connectivity |
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R |
товару немає в наявності |
Мінімальне замовлення: 2400 шт В кошику од. на суму грн. |
| 147413-3 |
![]() |
Виробник: TE Connectivity AMP Connectors
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Board Lock, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 30VAC
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6.35mm, 8.13mm, 9.91mm
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.187" (4.75mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Board Lock, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 30VAC
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6.35mm, 8.13mm, 9.91mm
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.187" (4.75mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 147413-3 |
![]() |
Виробник: TE Connectivity
Board to Board & Mezzanine Connectors 20 50/50 GRID RCPT VC W/O HD
Board to Board & Mezzanine Connectors 20 50/50 GRID RCPT VC W/O HD
товару немає в наявності
Мінімальне замовлення: 2400 шт
В кошику
од. на суму грн.
| 147413-3 |
![]() |
Виробник: TE Connectivity
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R
товару немає в наявності
Мінімальне замовлення: 2400 шт
В кошику
од. на суму грн.
| 147413-3 |
![]() |
Виробник: TE Connectivity
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R
Conn Socket Strip RCP 20 POS 1.27mm Solder ST SMD T/R
товару немає в наявності
Мінімальне замовлення: 2400 шт
В кошику
од. на суму грн.



