1969312-1 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP Connectors
Description: CONN HEADER SMD T/H 2POS 1.5MM
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Holder
Contact Type: Male Pin
Operating Temperature: -30°C ~ 105°C
Style: Board to Board or Cable
Number of Rows: 1
Number of Positions: 2
Mounting Type: Surface Mount, Through Board
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 50V
Connector Type: Header
Features: Solder Retention
Packaging: Bulk
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Технічний опис 1969312-1 TE Connectivity AMP Connectors
Description: CONN HEADER SMD T/H 2POS 1.5MM, Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.059" (1.50mm), Insulation Color: Natural, Contact Material: Copper Alloy, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Latch Holder, Contact Type: Male Pin, Operating Temperature: -30°C ~ 105°C, Style: Board to Board or Cable, Number of Rows: 1, Number of Positions: 2, Mounting Type: Surface Mount, Through Board, Current Rating (Amps): Varies by Wire Gauge, Voltage Rating: 50V, Connector Type: Header, Features: Solder Retention, Packaging: Bulk.
Інші пропозиції 1969312-1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
| 1969312-1 | TE Connectivity |
Headers & Wire Housings 3POS(2 LOADED) INVRT THRU BOARD HDER |
товару немає в наявності |
В кошику од. на суму грн. |
| 1969312-1 |
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Виробник: TE Connectivity
Headers & Wire Housings 3POS(2 LOADED) INVRT THRU BOARD HDER
Headers & Wire Housings 3POS(2 LOADED) INVRT THRU BOARD HDER
товару немає в наявності
В кошику
од. на суму грн.


