Технічний опис 1977276-1 TE Connectivity
Description: CONN HEADER SMD R/A 10POS 1.27MM, Packaging: Bulk, Features: Board Lock, Solder Retention, Connector Type: Header, Voltage Rating: 30VAC, Mounting Type: Surface Mount, Right Angle, Number of Positions: 10, Number of Rows: 2, Style: Board to Board, Operating Temperature: -65°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin-Lead, Contact Shape: Circular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm).
Інші пропозиції 1977276-1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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1977276-1 | Виробник : TE Connectivity |
 Conn Shrouded Header HDR 10 POS 1.27mm Solder RA SMD |
товару немає в наявності |
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| 1977276-1 | Виробник : TE Connectivity AMP Connectors |
Description: CONN HEADER SMD R/A 10POS 1.27MM Packaging: Bulk Features: Board Lock, Solder Retention Connector Type: Header Voltage Rating: 30VAC Mounting Type: Surface Mount, Right Angle Number of Positions: 10 Number of Rows: 2 Style: Board to Board Operating Temperature: -65°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Contact Shape: Circular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) |
товару немає в наявності |
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1977276-1 | Виробник : TE Connectivity |
Headers & Wire Housings 10 50/50 GRID RA HDR T & R |
товару немає в наявності |