1MM-HU-D08-VS-00-F-TBP TE CONNECTIVITY
Виробник: TE CONNECTIVITYDescription: TE CONNECTIVITY - 1MM-HU-D08-VS-00-F-TBP - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Hauchvergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbindertyp: Stiftleiste
Produktpalette: Ampmodu Small Centerline
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (21-Jan-2025)
на замовлення 480 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 7+ | 133.70 грн |
| 10+ | 91.61 грн |
| 100+ | 89.96 грн |
| 250+ | 82.00 грн |
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Технічний опис 1MM-HU-D08-VS-00-F-TBP TE CONNECTIVITY
Description: SCL 1.0 HDR DRVT USP 016 SMT G1, Features: Pick and Place, Packaging: Box, Connector Type: Header, Breakaway, Voltage Rating: 30VAC, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.059" (1.50mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.083" (2.10mm).
Інші пропозиції 1MM-HU-D08-VS-00-F-TBP за ціною від 115.50 грн до 248.91 грн
| Фото | Назва | Виробник | Інформація |
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1MM-HU-D08-VS-00-F-TBP | Виробник : TE Connectivity AMP Connectors |
Description: SCL 1.0 HDR DRVT USP 016 SMT G1 Features: Pick and Place Packaging: Box Connector Type: Header, Breakaway Voltage Rating: 30VAC Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.059" (1.50mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.039" (1.00mm) Contact Length - Mating: 0.083" (2.10mm) |
на замовлення 1171 шт: термін постачання 21-31 дні (днів) |
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1MM-HU-D08-VS-00-F-TBP | Виробник : TE Connectivity |
Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 016 SMT G1 TBK |
на замовлення 1197 шт: термін постачання 21-30 дні (днів) |
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