Технічний опис 2-1571586-8 TE Connectivity
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Copper.
Інші пропозиції 2-1571586-8 за ціною від 323.13 грн до 330.38 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2-1571586-8 | Виробник : TE CONNECTIVITY / PARTNER STOCK |
 Description: TE CONNECTIVITY / PARTNER STOCK - 2-1571586-8 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 15.24 mmtariffCode: 85369010 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 24Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: DIPLOMATE 800 SVHC: To Be Advised |
на замовлення 1467 шт: термін постачання 21-31 дні (днів) |
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| 2-1571586-8 | Виробник : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Material - Post: Copper |
товару немає в наявності |