Технічний опис 2013012-3 TE Connectivity
Description: CONN RCPT 50POS SMD GOLD, Features: Board Guide, Solder Retention, Packaging: Tray, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 50, Pitch: 0.024" (0.60mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 4mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції 2013012-3
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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2013012-3 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN RCPT 50POS SMD GOLDFeatures: Board Guide, Solder Retention Packaging: Tray Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.024" (0.60mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 4mm Part Status: Active Number of Rows: 2 |
товару немає в наявності |
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| 2013012-3 | Виробник : TE Connectivity |
Board to Board & Mezzanine Connectors .6FHR04H,050,S,STD, 30/SP,ST,NSYes |
товару немає в наявності |