Технічний опис 2033890361 Molex
Description: 0.175 BTB QUAD ROW REC EMBSTP PK, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 3.94µin (0.100µm), Height Above Board: 0.023" (0.59mm), Pitch: 0.014" (0.35mm), Number of Positions: 36, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Bulk.
Інші пропозиції 2033890361
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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2033890361 | Виробник : Molex |
 Description: 0.175 BTB QUAD ROW REC EMBSTP PKNumber of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 3.94µin (0.100µm) Height Above Board: 0.023" (0.59mm) Pitch: 0.014" (0.35mm) Number of Positions: 36 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Bulk |
товару немає в наявності |
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203389-0361 | Виробник : Molex | Board to Board & Mezzanine Connectors 0.175 BtB Quad Row Rec Embstp Pkg 36ckt |
товару немає в наявності |