2069965-1 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2069965-1 - IC-COMPONENT SOCKETS SOCKET ASSY L
tariffCode: 85444290
productTraceability: No
rohsCompliant: YES
euEccn: NLR
isCanonical: Y
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
| Кількість | Ціна |
|---|---|
| 120+ | 1499.65 грн |
| 360+ | 1409.45 грн |
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Технічний опис 2069965-1 TE CONNECTIVITY / PARTNER STOCK
Description: CONN SOCKET LGA 1155POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 1155 (40 x 40), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.036" (0.91mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Copper Alloy.
Інші пропозиції 2069965-1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
| 2069965-1 | TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 1155POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Material - Post: Copper Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |
 |
2069965-1 | TE Connectivity / AMP |
IC & Component Sockets SOCKET ASSY LGA1155 |
товару немає в наявності |
В кошику од. на суму грн. |
| 2069965-1 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN SOCKET LGA 1155POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 1155 (40 x 40)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.036" (0.91mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Copper Alloy
Description: CONN SOCKET LGA 1155POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 1155 (40 x 40)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.036" (0.91mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Copper Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 2069965-1 |
|
Виробник: TE Connectivity / AMP
IC & Component Sockets SOCKET ASSY LGA1155
IC & Component Sockets SOCKET ASSY LGA1155
товару немає в наявності
В кошику
од. на суму грн.