2102061-3 TE CONNECTIVITY - AMP
Виробник: TE CONNECTIVITY - AMP
Description: TE CONNECTIVITY - AMP - 2102061-3 - Mezzanine-Steckverbinder, Buchse, 1.27 mm, 6 Reihe(n), 114 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: NO
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: NO
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 114Kontakt(e)
SVHC: Lead (04-Feb-2026)
Produktpalette: Mezalok
productTraceability: Yes-Date/Lot Code
usEccn: EAR99
Anzahl der Reihen: 6Reihe(n)
Mezzanine-Steckverbinder: Buchse
Rastermaß: 1.27mm
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Технічний опис 2102061-3 TE CONNECTIVITY - AMP
Description: CONN RCPT 114POS 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 250VAC, Mounting Type: Surface Mount, Number of Positions: 114, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 12mm, Insulation Color: Natural, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Post: Tin-Lead, Part Status: Active, Insulation Height: 0.315" (8.00mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 6.
Інші пропозиції 2102061-3
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
2102061-3 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 114POS 0.05 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 250VAC Mounting Type: Surface Mount Number of Positions: 114 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 12mm Insulation Color: Natural Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.315" (8.00mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 6 |
товару немає в наявності |
Мінімальне замовлення: 350 шт В кошику од. на суму грн. |
|
|
2102061-3 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 114POS 0.05 GOLD SMD Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 250VAC Mounting Type: Surface Mount Number of Positions: 114 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 12mm Insulation Color: Natural Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.315" (8.00mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. |
 |
2102061-3 | TE Connectivity |
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 12MM 1.27 Gold |
товару немає в наявності |
В кошику од. на суму грн. |
 |
2102061-3 | TE Connectivity |
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
товару немає в наявності |
Мінімальне замовлення: 350 шт В кошику од. на суму грн. |
|
|
2102061-3 | TE Connectivity |
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
товару немає в наявності |
Мінімальне замовлення: 350 шт В кошику од. на суму грн. |
| 2102061-3 |
|
Виробник: TE Connectivity Aerospace, Defense and Marine
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 12mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.315" (8.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 12mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.315" (8.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
товару немає в наявності
Мінімальне замовлення: 350 шт
В кошику
од. на суму грн.
| 2102061-3 |
|
Виробник: TE Connectivity Aerospace, Defense and Marine
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 12mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.315" (8.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 12mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.315" (8.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| 2102061-3 |
|
Виробник: TE Connectivity
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 12MM 1.27 Gold
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 12MM 1.27 Gold
товару немає в наявності
В кошику
од. на суму грн.
| 2102061-3 |
|
Виробник: TE Connectivity
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
товару немає в наявності
Мінімальне замовлення: 350 шт
В кошику
од. на суму грн.
| 2102061-3 |
|
Виробник: TE Connectivity
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
товару немає в наявності
Мінімальне замовлення: 350 шт
В кошику
од. на суму грн.