2174988-1 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2174988-1 - IC AND COMPONENT SOCKETS
tariffCode: 85366990
productTraceability: Yes-Date/Lot Code
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: No SVHC (27-Jun-2024)
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Технічний опис 2174988-1 TE CONNECTIVITY / PARTNER STOCK
Description: CONN SOCKET LGA 2011POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 2011 (47 x 58), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.035" (0.90mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Copper Alloy.
Інші пропозиції 2174988-1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
2174988-1 | TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 2011POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 2011 (47 x 58) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.040" (1.02mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.035" (0.90mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Material - Post: Copper Alloy |
товару немає в наявності |
В кошику од. на суму грн. |
 |
2174988-1 | TE Connectivity |
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. |
| 2174988-1 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN SOCKET LGA 2011POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.040" (1.02mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Copper Alloy
Description: CONN SOCKET LGA 2011POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.040" (1.02mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Copper Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 2174988-1 |
|
Виробник: TE Connectivity
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.