292230-9 TE Connectivity
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 500+ | 84.99 грн |
| 1000+ | 83.34 грн |
| 1500+ | 80.04 грн |
| 5000+ | 66.04 грн |
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Технічний опис 292230-9 TE Connectivity
Description: CONN HEADER SMD 9POS 1.5MM, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: Header, Voltage Rating: 50VAC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 9, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -30°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Beige, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.272" (6.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled, Contact Length - Mating: 0.094" (2.40mm).
Інші пропозиції 292230-9 за ціною від 66.73 грн до 122.42 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||||||
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292230-9 | Виробник : TE Connectivity / AMP |
 Headers & Wire Housings 9P SMT HDR VT MINI |
на замовлення 549 шт: термін постачання 21-30 дні (днів) |
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| 292230-9 | Виробник : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 292230-9 - Stiftleiste, Wire-to-Board, 1.5 mm, 1 Reihe(n), 9 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 9Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: AMP Mini CT productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.5mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 6500 шт: термін постачання 21-31 дні (днів) |
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292230-9 | Виробник : TE Connectivity |
Conn Shrouded Header HDR 9 POS 1.5mm Solder ST SMD T/R |
товару немає в наявності |
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| 292230-9 | Виробник : TE Connectivity |
Conn Shrouded Header HDR 9 POS 1.5mm Solder ST SMD T/R |
товару немає в наявності |
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292230-9 | Виробник : TE Connectivity AMP Connectors |
Description: CONN HEADER SMD 9POS 1.5MM Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Header Voltage Rating: 50VAC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 9 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -30°C ~ 105°C Contact Type: Male Pin Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Beige Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.272" (6.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled Contact Length - Mating: 0.094" (2.40mm) |
товару немає в наявності |
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292230-9 | Виробник : TE Connectivity AMP Connectors |
Description: CONN HEADER SMD 9POS 1.5MM Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Header Voltage Rating: 50VAC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 9 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -30°C ~ 105°C Contact Type: Male Pin Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Beige Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.272" (6.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled Contact Length - Mating: 0.094" (2.40mm) |
товару немає в наявності |